Inter-Chip USB Supplement to the USB 2.0 Specifica

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2023-05-24

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Inter-ChipUSBSupplementtotheUSB2.0SpecificationMarch13th,2006Revision1.0Page1/48Inter-ChipUSBSupplementtotheUSB2.0SpecificationRevision1.0March13th,2006Inter-ChipUSBSupplementtotheUSB2.0SpecificationMarch13th,2006Revision1.0Page2/48AcknowledgementofIC_USBTechnicalContribution:DavidThompsondavethompson@agere.comAgereSystems,Inc.EricPayrateric.payrat@rfo.atmel.comAtmelCorporationFrançoisEnnesserfrancois.ennesser@axalto.comAxaltoRobertLeydierrobert.leydier@axalto.comAxaltoGrahamConnollygraham.connolly@fairchildsemi.comFairchildSemiconductorEdBeemaned.beeman@hp.comHewlett-PackardCompanyKalmanCinklerkalman.cinkler@infineon.comInfineonTechnologiesChristianSchneckenburgerchristian.schneckenburger@infineon.comInfineonTechnologiesPaulE.Bergpberg@mcci.comMCCIJoeDecuirjoe@mcci.comMCCIAvrahamShimoravraham.shimor@m-systems.comM-SystemsFlashDiskPioneersSubramanyamSankaransubramanyam.sankaran@philips.comPhilipsSemiconductorsHilbertZhanghilbert.zhang@philips.comPhilipsSemiconductorsSergeFruhaufserge.fruhauf@st.comSTMicroelectronicsEricDesmarcheliere-desmarchelier@ti.comTexasInstrumentsHyunLeehlee@transdimension.comTransDimension,Inc.UniversalSerialBusSpecificationSupplementCopyright2001,2006USBImplementersForum,Inc.(USB-IF)Allrightsreserved.INTELLECTUALPROPERTYDISCLAIMERTHISSPECIFICATIONISPROVIDEDTOYOUASISWITHNOWARRANTIESWHATSOEVER,INCLUDINGANYWARRANTYOFMERCHANTABILITY,NON-INFRINGEMENT,ORFITNESSFORANYPARTICULARPURPOSE.THEAUTHORSOFTHISSPECIFICATIONDISCLAIMALLLIABILITY,INCLUDINGLIABILITYFORINFRINGEMENTOFANYPROPRIETARYRIGHTS,RELATINGTOUSEORIMPLEMENTATIONOFINFORMATIONINTHISSPECIFICATION.THEPROVISIONOFTHISSPECIFICATIONTOYOUDOESNOTPROVIDEYOUWITHANYLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISE,TOANYINTELLECTUALPROPERTYRIGHTS.Allproductnamesaretrademarks,registeredtrademarks,orservicemarksoftheirrespectiveowners.Inter-ChipUSBSupplementtotheUSB2.0SpecificationMarch13th,2006Revision1.0Page3/48RevisionHistoryRevisionIssueDateComments0.60Feb.17,2004ForreviewOnly0.7pJan.25,20050.8aFeb.1,2005ReleasedafterreviewattheSanMateoFacetoFace0.8qOct.4,2005FrozenafterreviewattheAnaheimFacetoFace0.8q2Nov4th,2005Discussedatconfcallsafter30daysreviewbytheIC_USBgroup0.8q3Nov9th,2005IinCurrentvaluechangedto±2µATable7-11.0RCJanuary19th,2006FinalDraftSpecification.Samecontentas0.8q31.0March13th,2006ApprovedbythePromotersGroupMarch10th,2006Inter-ChipUSBSupplementtotheUSB2.0SpecificationMarch13th,2006Revision1.0Page4/48TableofContents1Introduction...........................................................................................................................................81.1General..............................................................................................................................................81.2ObjectiveofThisSupplement...........................................................................................................81.3IntendedAudience............................................................................................................................81.4RelevantDocuments.........................................................................................................................91.5AcronymsandTerms......................................................................................................................102SignificantFeatures...........................................................................................................................112.1CompliancewiththeCoreSpecification[USB]...............................................................................112.2BusIdleBiasCurrent......................................................................................................................112.3PhysicalImplementation.................................................................................................................112.4VoltageClasses..............................................................................................................................112.5Family..............................................................................................................................................112.6Speeds............................................................................................................................................113Inter-ChipUSB....................................................................................................................................123.1Topology..........................................................................................................................................123.2Signals.............................................................................................................................................124Power...................................................................................................................................................134.1PowerDistribution..............................................................................