泡沫铜制备工艺研究

(,100088):,:Cu2+(CuSO4)pH:;;;:TG14611+6;TB383;TQ15311+4:A:1001-0211(2002)04-0017-04:2001-12-07:(1968-),,,,205060,(I/M)(P/M)[1],,,2080,,,[2-3]:,,,[3],,:95%98%;,,;;[4],,,,()[5],,,14:110210mm,,,,,,210510m,:Cu2++H2O+HCHOvCu+HCOOH+2H+,,:Cu2++2evCuCu-2evCu2+,,,,2211:CrO3+H2SO4,(KMnO2-C2H2O4)1CrO3,,,,1CrO3Table1Distinguishofintensifiedandconventionalcoarsenizationtechnology1cm2,115mmCrO39490:544200211NONFERROUSMETALSVol154,No14November2002SnCl2+HCl,PdCl2+HCl,212,,210m:,;,;,2Table2Comparisonofsomeelectroless2platingsystem(5min)/m20/g61501067+51801044+EDTA51201025+EDTA+41801007,,,,A(-)B(),A,B,pH,,AB2134L,1#,(),CuSO4,()21311,,(H2),,121,315415A/cm2,,21312,CuSO4,31Fig11Influenceofcurrentdensityontensilestrength2Fig12Influenceofcurrentdensityonporosity3CuSO4Fig13InfluenceofCuSO4concentrateontensilestrengthCuSO4,,Cu2+,21313,(011015g/L),,8154,21314pH,pH110215,pHCu(OH)2CuSO4,,pH,H+H2,214,,,44Fig14Influenceofreducingandannealingtemperatureontensilestrength215,,5,,,:Cu2+(CuSO4)pH,,5,3Table3FactorsandlevelsfororthogonalexperimentA/(Acm-2)A1310A2315B[CuSO4]/(gL-1)B1200B2210C/(mgL-1)C1100C2120DpHD1115D2210E()/E1800E28504Table4OrthogonalexperimentandresultsABCDEb/(N(mm-2)P/%11111121459414211222214895123121122156961841222121849619521121216495176212122180961272212221769514822211216594175Table5Resultsofcomprehensiveexperimentb/(N(mm-2)P/%1A218;B200;C110;D118;E780217895182A312;B220;C140;D215;E85021809612(5ab),a-;b-5Fig15Photographofcopperfoambyscanningelectromicroscope914:3(1),(2),,,(3),(4),,(5)(),,(6),[1]DaviesGJ,ShuZhen1Metallicfoams:theirproduction,propertiesandapplication[J]1JournalofMaterialsScience,1983,18:1899[2],1[J]1,2001,23(4):9[3],,1[J]1,1997,21(1):15[4],1[J]1,1993,26(6):264[5]1[J]1,1996,29(11):12PREPARATIONOFCOPPERFOAMLUOYuanhui(GeneralResearchInstituteforNon2ferrousMetals,Beijing100088,China)ABSTRACTThepreparationtechnologyofcopperfoamisdevelopedandtheoptimumconditionisdetermined1Thein2tensifiedcoarsenizationforpre2treating,threekindsofligandssystemforchemicalplating,andadequateelec2tricitydensityandtotaladditivesconcentrationinelectrolyteforelectroplating,andappropriatetemperatureandatmosphereforheattreatingaretheguaranteeoftheproductqualityandperformances1Thesequenceofinflu2encingfactorsfromstrongtoweakisannealingtemperatureforhydrogenreduction,electricitydensity,andtotaladditivesconcentrationforelectroplating,Cu2+contentandpHofelectrolyte1Thequalifiedproductispreparedundertheoptimumcondition1KEYWORDS:copperfoam;chemicalplating;electroplating;heattreating(16Continuedfromp.16)EXPERIMENTALANALYSISOFVISION2PLASTICITYMETHODFOREQUALCHANNELANGULAREXTRUSIONBIDasen,ZHANGJian,CUIHongxiang(TianjinInstituteofTechnology,Tianjin300191,China)ABSTRACTThedeformationregularityoftheequalchannelangularextrusionisinvestigatedbyusingvision2plasticitymethod1Andthemetalflowingfeatureinthecourseoftheequalchannelangularextrusionisdeterminedbydis2placementobservationofthemeshnodesofsamplesonthedeformedplane1Therangeofthedeformationregionandthedistributionofshearstrainontheequalchannelangularextrusionarealsodealwith1KEYWORDS:equalchannelangularextrusion;vision2plasticity;deformation0254