焊接工艺文件

ByGerjanDiepstraten•••••••OCAPBibliography•DeKlein,F.J.(1998).StatisticalProcessControlforSoldering.Oosterhout,TheNetherlands:VitronicsSoltec.•Hall,W.J.(2000).CoolingParametersinReflowSoldering.Stratham,NH;VitronicsSoltecCorp.•Kelly,B.,andWeigerber,J.(2000).Step-by-StepSMTProcessControl.SMT2000•Rooks,B.(2000).RobustReflowProfileDesign•Suraski,D.ReflowProfiling,TheBenefitsofImplementingaRamp-to-SpikeProfile.AIM.ByGerjanDiepstraten12A°C255265B-C2.34.3DSmart-E°CF-G-OSPNiAuABCDEFGABSmartABCABC111111112623202271211122225182838607131221122910304104122221187585136293852121212580338026621221217011836722112214005141782212112728677617979ABCDEFGABSmartABCABC11111111000060211122220000003122112200058841222211023521061205212121200000062122121000000722112210000124822121128400700AnovaDFfSV1F2S'3?(%)A1444411400.1B11,7041,7044171,7004.3C12,2412,2415492,2375.7DSmart17,7017,7011,8867,69719.6E144F110,50210,5022,57210,49826.8G12,5812,5816322,5776.6B14944941214901.3e176,6219462326,59216.8e2327,301228567,17118.3(e)1441920.54739,1958341.V=S/f,2.F=V/Ve,Ve,3.S'=S-VexfAnovaDFfSV1F2S'3?(%)A11,6571,657201,5726.0B12,2142,214262,1298.1C11,5191,519181,4345.4DSmart11,3231,323161,2384.7E11,4081,408171,3235.0F11,4521,452171,3675.2G11,5411,541181,4565.5B11,9251,925231,8407.0e1710,6421,5201810,04738.1e2322,72085(e)12,720853,99515.14726,4025621.V=S/f,2.F=V/Ve,Ve,3.S'=S-Vexf•A1/A2-•B1-•C2-4.3•D1-Smart•E1/E2-•F2-•G1-(OSP)•N1-A•A2-265°C•B1-•C1-2.3•D1-Smart•E1-•F2-•G2-/(NiAu)•N1-AByAlSchneider,SanjuAroraandBinMoSn63/Pb37183°CSn99.3/Cu0.7227°CSn96.5/Ag3.5221°CSn95.5/Ag4/Cu0.5217~218°CSn96/Ag2.5/Bi1/Cu0.51214~218°CSn96.2/Ag2.5/Sb0.5/Cu0.82210~216°C1.#4,879,0962.#5,405,577••••Bibliography1.Bastecki,C.(1997).ABenchmarkProcessForTheLead-FreeAssemblyofMixedTechnologyPCB's,AlphaMetalspublication.2.IPC.(Nov.2000).IPC/ANSIJ-STD-006A,Proposal,AppendixASolderAlloys,TableA-1Composition,andTemperatureCharacteristicsofLead-freeSolderAlloys.3.IPC.(Oct.1998).IPC/EIAJ-STD-002A,SolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires.4.IPC.(Apr.1992).IPC/EIAJ-STD-003,SolderabilityTestsforPrintedBoards.5.IPC.IPC-TM-650,TestMethodsManual.Number2.4.14.2.Smelik,G.Internalcommunications.CooksonPerformanceSolutions.6.Zarrow,P.(1999).Lead-free:Don'tfightafact,dealwithit!CircuitsAssembly,pp.18-20.ByTerryMunsonPCBByAndyBeckerandMarcC.Apell••••PCBByBobWillis••••••ByPhilZarrow()()$0.450.410$0.500.258$0.650.324$0.800.239$3.400.354$3.500.264$84.200.379$125.000.264AlloyMeltingRange(°C)MetalCost/lb(US$)Densityat25°C(lbs/in3)MetalCostperin3(US$)MetalCostperin3?Sn63/Pb37Sn62/Pb371832.370.3180.750%Sn42/Bi581393.440.3161.09+45%Sn77.2/In20/Ag2.8179-18930.060.2678.02+970%Sn91/Zn91993.230.2630.85+13%Sn91.8/Ag3.4/Bi4.8208-1156.240.2721.70+125%Sn90/Bi7.5/Ag2/0.5Cu186-1125.090.2731.39+85%Sn96.2/Ag2.5/Cu0.8/Sb0.5213-1195.480.2671.46+95%Sn96.3/Ag3/Cu0.7217-1185.90.2681.58+110%Sn95/Ag3.5/In1.52188.150.2682.18+190%Sn93.5/Ag3.5/Bi3216-1205.920.2691.59+110%Sn96.5/Ag3.52216.320.3682.33+125%Sn99.3/Cu0.72273.480.2640.92+23%Sn95/Sb5232-1403.370.2630.88+17%Acknowledgment:TheauthorwishestoexpressspecialthankstoBruceMoloznickofAlphaMetals,HeatherWutkeofKesterSolderandDavidSuraskiofA.I.M.Solder.PhilZarrowispresidentandsurface-mountprocessconsultantforITMConsulting,Durham,NH;[phone];(phase-transition)()“”2.()--(mean-free-path)()3.()4.(CTE,coefficientofthermalexpansion)SMTCTEFR-4CTE16.0x10-6/°C(FR-4)23.0x10-6/°C(Sn63/Pb37)16.5x10-6/°C()6.4x10-6/°C(Al2O3)CTECTECTE5.(wettability)()1.()2.3.4.5.(solution-hardening)Sn/Pb(Sb)6.(precipitation-hardening)7.(W/m°K)40032080(Sn63/Pb37)50(Al2O3)355(FR-4,BT)0.2References1.J.S.Hwang,ModernSolderTechnologyforCompetitiveElectronicsManufacturing,McGraw-Hill,NewYork,1996.2.J.S.Hwang,Low-CycleFatiguevs.Thermo-mechanicalFatigue.SMTMagazine,January,1995.3.R.Satoh,et.al.,ThermalFatigueLifeofPb-SnAlloyInterconnections,IEEETrans.,CHMI,Vol.14,No.1,March1991,p.224.4.R.Darveaux,CrackInitiationandGrowthinSurfaceMountJoints,Proceedings,ISHM,1993,p.86.5.W.M.Wolveton,TheMechanismandKineticsofSolderJointDegradation,BrazingandSoldering,No.13,Autumn,1987,p.33.6.J.S.Hwang,BallGridArrayandFinePitchPeripheralInterconnections,ElectrochemicalPublicationsLtd.,GreatBritain,1995.7.J.S.Hwang,OverviewofLead-FreeSoldersforElectronicsandMicroelectronics,Proceedings,SMI,1994,p.405.ByEdwinB.SmithIIIandL.KristineSwangerpH7.567.05(mg/L)3105(mg/L)1065/(mg/L)1585(mg/L)445•-Superfund;SARA313;RCRA;CleanWaterActToxicPollutant;CaliforniaStateSuperfundHazardousSubstances;CAL-OSHADirector'sListofHazardousSubstances;CaliforniaHWCLHazardousWastes•-Superfund;SARA313;CleanAirActHazardousAirPollutant;CleanWaterActToxicPollutant;CaliforniaStateSuperfundHazardousSubstances;CAL-OSHADirector'sListofHazardousSubstances;CaliforniaHWCLHazardousWastes•-Superfund;SARA313;RCRA;CleanWaterActToxicPollutant;CaliforniaStateSuperfundHazardousSubstances;CAL-OSHADirector'sListofHazardousSubstances;CaliforniaHWCLHazardousWastesSn/PbPCBTCLP(3/8)Sn*Ag*Cu*Sb*Pb*10.009.3243