焊线及焊线工艺介绍

WIREBONDPROCESSINTRODUCTIONCONTENTSASSEMBLYFLOWOFPLASTICICWireBond原理M/CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT封裝簡介晶片Die金線GoldWire導線架LeadframWaferGrindingDieBondingWaferSawtoasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacementSingulationPacking封裝流程DejunkTRIMSolderPlatingSolderPlatingDejunkTRIMTRIM/FORMINGBGASURFACEMOUNTPKGTHROUGHHOLEPKGWireBond原理padleadGoldwireBallBond(1stBond)WedgeBond(2ndBond)GLASSCONTAMINATIONVIBRATIONSiO2SiGOLDBALLPRESSUREMOISTUREAL2O3AlB.PRINCIPLE銲接條件HARDWELDINGPressure(Force)Amplify&FrequecyWeldingTime(BondTime)WeldingTempature(Heater)THERMALBONINGThermalCompressureUltrasonicEnergy(Power)BondHeadASSY•Lowimpactforce•RealtimeBondingForcemonitoring•Highresolutionz-axispositionwith2.5micronperstepresolution•Fastcontactdetection•SuppressedForcevibration•FastForceresponse•FastresponsevoicecoilwireclampXYTable•Linear3phaseACServomotor•HighpowerACCurrentAmplifier•DSPbasedcontrolplatform•HighX-Ypositioningaccuracyof+/-1mm•Resolutionof0.2mmW/HASSY•changeover•·Fullyprogrammableindexer&tracks•·Motorizedwindowclampwithsoftclosefeature•·Outputindexerwithleadframejamprotectionfeature•ToollessconversionwindowclampsandtopplateenablesfastdeviceEagle•BondingSystem•BondingMethodThermosonic(TS)•BQMModeConstantCurrent,Voltage,PowerandNormal(Programmable)•LoopTypeNormal,Low,Square&J•XYResolution0.2um•ZResolution(capillarytravellingmotion)2.5um•FinePitchCapability35mmpitch@0.6milwire•No.ofBondingWiresupto1000•ProgramStorage1000programsonHardDisk•MultimodeTransducerSystemProgrammableprofile,controlandvibrationmodesMACHINESPECIFICATIONS(I)Eagle•VisionSystem•PatternRecognitionTime70ms/point•PatternRecognitionAccuracy+0.37um•LeadLocatorDetection12ms/lead(3leads/frame)•LeadLocatorAccuracy+2.4um•PostBondInspectionFirstBond,SecondBondWireTracing•Max.DieLevelDifferent400–500um•Facilities•Voltage110VAC(optional100/120/200/210/•220/230/240VACMACHINESPECIFICATIONS(II)Eagle•MaterialHandlingSystem•IndexingSpeed200–250ms@0.5“pitch•IndexerResolution1um•LeadframePositionAccuracy+2mil•ApplicableLeadframeW=17–75mm@bondingareainY=65mm=17–90mm@bondingareainY=54mmL=280mm[Maximum]T=0.075–0.8mm•ApplicableMagazineW=100mm(Maximum)L=140–300mmH=180mm(Maximum)•MagazinePitch2.4–10mm(0.09”–0.39“)•DeviceChangeover4minutes•PackageChangeover5minutes•NumberofBufferMagazine3(max.435mm)MACHINESPECIFICATIONS(III)BondingProcessTheWireBondTempPREHEATBONDSITECUL/F200+/-10200+/-10ALL/F210+/-10230+/-10BGA150+/-10160+/-10TFBGA150+/-10160+/-10LBGA150+/-10160+/-10NOTINCLUDEDEDICATELINEpadleadFreeairballiscapturedinthechamferpadleadFreeairballiscapturedinthechamferSEARCHHEIGHTpadleadFreeairballiscapturedinthechamferSEARCHSPEED1SEARCHTOL1FreeairballiscapturedinthechamferpadleadSEARCHSPEED1SEARCHTOL1FreeairballiscapturedinthechamferpadleadSEARCHTOL1SEARCHSPEED1FreeairballiscapturedinthechamferpadleadSEARCHTOL1SEARCHSPEED1FreeairballiscapturedinthechamferpadleadSEARCHTOL1SEARCHSPEED1FormationofafirstbondpadleadSEARCHSPEED1SEARCHTOL1FormationofafirstbondpadleadSEARCHSPEED1SEARCHTOL1IMPACTFORCEFormationofafirstbondContactpadleadheatPRESSUREUltraSonicVibrationFormationofafirstbondBasepadleadUltraSonicVibrationheatPRESSURECapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadCapillaryrisestoloopheightpositionpadleadRHFormationofalooppadleadRD(ReverseDistance)FormationofalooppadleadpadleadpadleadCalculatedWireLengthWIRECLAMP‘CLOSE’padleadCalculatedWireLengthpadleadSEARCHDELAYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadleadTRAJECTORYpadlead2ndSearchHeightSearchSpeed2SearchTol2padleadSearchSpeed2SearchTol2padleadSearchSpeed2SearchTol2FormationofasecondbondpadleadheatFormationofasecondbondContactpadleadheatheatpadleadheatheatFormationofasecondbondBasepadleadpadleadpadleadpadleadTaillengthpadleadpadleadpadleadDisconnectionofthetailpadleadDisconnectionofthetailpadleadFormationofanewfreeairballMaterialLeadframCapillaryGoldWireLeadfram(I)Leadfram(II)CAPILLARY(I)CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,FA&OR,IC)CAPILLARY(II)CAPILLARY(III)TIP..……PadPitchPadpitchx1.3~TIPHole..…..WireDiameterWirediameter+0.3~0.5=HCD………Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR….Padpitch(um)FA1000,4~90/1004,8,119011,15ICtype……looptypeGoldWireGoldWireManufacturer(Nippon,SUMTOMO,TANAKA….)GoldWireData(WireDiameter,Type,)SPECPadOpen&BondPadPitchBallSizeBallThicknessLoopheightWirePullBallshortCraterTestBPO&BPP單位:umorMilBPO:是指Pad內層X方向及Y方向的size,一般是取最小值為我們的dataBPO:是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推;或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP,但是一般我們要取一個Die上最小的BPPBondPadPitchBondPadOpenBondPadOpenBallSizeBallThicknessBallSize&BallThickness單位:um，Mil量測倍率:50XBallThickness計算公式60umBPP≧1/2WD=50%60umBPP≦1/2WD=40%~50%BallSizeLoopHe