目视检验规范IPC610

目視檢驗規范IPC610IPQCRUI_LI2010/1/20目視檢驗規范標准IPC6101.允收標准2.拒收標准零件本體僅下方有二接觸點的零件(ChipComponents/BottomOnlyTerminationscont.)–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.Nosideoverhang.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件本體寬邊(C)有75%以上焊接於錫墊上.零件本體與電路板錫墊間(G)錫厚至少0.2mm.Sideoverhang(A)isallowedifminimumendjointwidth(C)requirementsaremet.Minimumis75%.Minimumthickness(G)is0.2mmunlesssatisfactorycleaningcanbedemonstratedwithreducedclearance.拒收(NonconformingDefect)零件往錫墊寬邊(A)偏移,且零件本體小於75%寬邊(C)焊接於錫墊上.零件往錫墊長邊(B)偏移.Sideoverhang(A)isallowedifminimumendjointwidth(C)requirementsaremet.Minimumis75%.Minimumthickness(G)is0.2mmunlesssatisfactorycleaningcanbedemonstratedwithreducedclearance.零件本體有1,3,5面矩形金屬焊接點(RectangularEndComponents-1,3or5sideTermination)–偏移(Shift)允收(TargetCondition)零件金屬部份黏焊於錫墊中心位置,沒有任何偏移.零件本體錫墊完全沾錫.Nosideoverhang.Sidejointlength(D)equalscomponentterminationlength.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件本體金屬焊墊寬邊(W)75%以上焊接於電路板錫墊上.Endjointwidth(C)is75%widthofcomponentterminationarea(W)or75%widthofPBland(P),whicheverisless.拒收(NonconformingDefect)零件往錫墊寬邊(A)偏移,但零件本體不足75%寬邊(C)以上焊接於電路板錫墊上.零件往錫墊長邊偏移(B).Sideoverhang(A)causesminimumendjointwidth(C)requirementsnottobemet.Endoverhang(B)isnotpermitted.零件本體有1,3,5面矩形接觸點(RectangularEndComponents-1,3or5sideTermination)–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.零件本體錫墊完全沾錫.Nosideoverhang.允收極限(Acceptable)零件往錫墊寬邊偏移,但零件之焊接面佔75%以上.Endjointwidthis75%widthofcomponentterminationareaor75%widthofPBland,whicheverisless.拒收(NonconformingDefect)零件往錫墊長邊偏移.Endoverhangisnotpermitted.圓柱體零件(CylindricalEndCapTermination)–偏移(Shift)允收(TargetCondition)零件黏焊於錫墊中心位置,沒有任何偏移.吃錫面在圓筒零件直徑(W)與板上錫墊長(P)之間.Nosideoverhang.Endjointwidthisequaltoorgreaterthanthecomponentwidth(W)orwidthoftheland(P),whicheverisless.允收極限(Acceptable)零件往錫墊寬邊偏移(A),側邊偏移度允收極限為零件直徑(W)的25%或錫墊長度(P)的25%.Sideoverhang(A)is25%diameterofcomponentwidth(W)orlandwith(P).拒收(NonconformingDefect)零件側邊偏移度(A)超出25%零件直徑(W)或錫墊長度(P)的25%.零件往錫墊長邊偏移(B).Sideoverhang(A)is25%diameterofcomponentwidth(W)orlandwith(P).Endoverhangisnotpermitted.無導腳零件(LeadlessChipCarrierswithCastellatedTerminations)–偏移(Shift)允收(TargetCondition)零件未偏移.零件延伸引腳長等於電路板上錫墊長.零件立於電路板上錫墊中心.Nosideoverhang.Filletextensionequalslandwidth.Filletheightcoversterminal.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移度小於電路板上錫墊面(W)的25%.Maximumsideoverhang(A)is25%W.拒收(NonconformingDefect)零件偏移向錫墊寬邊之間(A),偏移度大於電路板上錫墊面(W)的25%.零件偏移向錫墊長邊之間(B).Maximumsideoverhang(A)is25%W.Endoverhang(B)isnotpermitted.允收(TargetCondition)零件腳未偏移.Nosideoverhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移小於電路板上錫墊寬度(W)的25%或偏移小於0.5mm.Sideoverhang(A)is25%Wor0.5mm.拒收(NonconformingDefect)零件偏移向錫墊寬邊之間(A),偏移大於電路板上錫墊寬度(W)的25%或偏移大於0.5mm.不允許任何的零件趾端偏移如(B).Sideoverhang(A)isgreaterthan25%Wor0.5mmwhicheverisless.Toeoverhang(B)isnotspecified平緞腳(L型)/鷗翼腳/圓柱L腳(FlatRibbonL/GullWingleads/Roundleads)–偏移(Shift)I腳(“I”Leads)–偏移(Shift)允收(TargetCondition)零件腳未偏移.Nosideoverhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移大於錫腳寬度(W)的25%仍不允許.不允許任何的偏移.Overhang(A)exceeds25%leadwidth(W).Nooverhangallowed.拒收(NonconformingDefect)不允許任何的零件趾端偏移如(B).Toeoverhang(B)isnotspecified.範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳(FlatRibbonL/GullWingleads/Roundleads)允收(TargetCondition)允收極限(Acceptable)拒收(NonconformingDefect)範例(Example)-平緞腳(L型)/鷗翼腳/圓柱L腳(FlatRibbonL/GullWingleads/Roundleads)拒收(NonconformingDefect)拒收(NonconformingDefect)拒收(NonconformingDefect)範例(Example)-J腳/I腳允收極限(Acceptable)拒收(NonconformingDefect)拒收(NonconformingDefect)ë範例(Example)拒收(NonconformingDefect)高翹/LIFTED範例(Example)高翹/LIFTEDOKNG範例(Example)拒收(NonconformingDefect)折腳/BENT缺件/MISSING偏移/SHIFT範例(Example)拒收(NonconformingDefect)破損/DAMAGE範例(Example)拒收(NonconformingDefect)撞件/BROKEN撞件/BROKEN範例(Example)允收極限(Acceptable)偏移/SHIFT錫洞/SolderHole範例(Example)ASR1:LED2反向/REVERSE拒收(NonconformingDefect)ë缺口端為負極/Nicksideis“－”5168:SW4反向/REVERSESwitch數字與PCBA同向/NumberoncomponentsamedirectionwithPCBA.範例(Example)折腳/PINBENT包焊/PoorSolder拒收(NonconformingDefect)範例(Example)拒收(NonconformingDefect)NGOK退PINTravisM/BDIPcomponentcosmetic1,整体高翘，且最大不可以超过0.3mm2.后邊、前邊緣高翹不可超過0.2mm整體高翹單邊高翹TravisM/BDIPcomponentcosmetic1.水平高翘，最大允许限度为0.3mm.2.不允许單边高翘。TravisbasesampleRAM的卡勾不可出现变形等不良。TravisM/BDIPcomponentcosmetic不能出现任何标记,特别是有铅异物。不能出现任何标记,特别是有铅异物。TravisM/BDIPcomponentcosmeticJUSB不可出现气泡和明显擦痕.TravisbasesampleMicrophone不能失掉海绵，禁止使用双面胶黏贴脱落海绵。TravisM/BsolderholeJDOCK不允許單邊高翹Travisbasesample1.FunctionPin吃锡量不应少于75%.2.固定pin锡量不应少于50%.（以固定住零件为标准）3.折脚（1）:如果pin折脚但是有露出，function測試pass可以判断为良品。(2)如果pin脚完全没有露出，则要判断为不良。固定pinFunctionpinTravisbasesamplepin脚不可刺穿该处MylarTravisbasesampleSmartcardsocket不可出现大幅度凹陷变形。TravisbasesampleJSIO,JCRT等零件不可出现沾锡等不良,PBATTlatesoldercanbeaccept。THEEND