JEDECSTANDARDMarking,Symbols,andLabelsforIdentificationofLead(Pb)FreeAssemblies,Components,andDevicesJESD97MAY2004JEDECSOLIDSTATETECHNOLOGYASSOCIATIONNOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSI/EIAstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECattheaddressbelow,orcall(703)907-7559or©JEDECSolidStateTechnologyAssociation20042500WilsonBoulevardArlington,VA22201-3834Thisdocumentmaybedownloadedfreeofcharge;howeverJEDECretainsthecopyrightonthismaterial.Bydownloadingthisfiletheindividualagreesnottochargefororreselltheresultingmaterial.PRICE:PleaserefertothecurrentCatalogofJEDECEngineeringStandardsandPublicationsonlineat!DON’TVIOLATETHELAW!ThisdocumentiscopyrightedbyJEDECandmaynotbereproducedwithoutpermission.Organizationsmayobtainpermissiontoreproducealimitednumberofcopiesthroughenteringintoalicenseagreement.Forinformation,contact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,Virginia22201-3834orcall(703)907-7559JEDECStandardNo.97-i-MARKING,SYMBOLSANDLABELSFORIDENTIFICATIONOFLEAD(Pb)FREEASSEMBLIES,COMPONENTSANDDEVICESForewordCertainelectroniccomponentsandsystemsarerequiredtobelead(Pb)freeasoneelementoftheconditionsformeetingthe'RestrictionofHazardousSubstances'(RoHS)EuropeandirectivebyJuly2006..TherearecertainproductandsolderexemptionstotheRoHSlegislationthatallowthecontinueduseoflead(Pb)thuscomplicatingthisstandard.Asaresultthereareseverallead-freealloysandmaterialsbeingpromotedforthevarioussolderingoperationsinelectronics.Eachofthesealloysmayrequiredifferentprocessparameters,includingtemperaturesformanufacturing,assembly,andrework.Somemeansofcommunicatingtheidentityofthelead-freematerialmustbeprovidedsothatthoseperformingassembly,rework,andrecyclingoperationsareawareofthecapabilitiesandlimitationsofthesematerials.Therequirementssetforthinthisstandardareconsideredminimalandadditionalinformationmaybesuppliedusingotherlabelsormarkingschemes.JEDECStandardNo.97-ii-JEDECStandardNo.97Page1MARKING,SYMBOLSANDLABELSFORIDENTIFICATIONOFLEAD(Pb)FREEASSEMBLIES,COMPONENTSANDDEVICES(FromJEDECBoardBallotJCB-04-41,formulatedunderthecognizanceoftheJC-14.1SubcommitteeonReliabilityTestMethodsforPackagedDevicesandtheJC-14.4SubcommitteeonQualityProcessesandMethods.)1ScopeThisdocumentshallapplytoallelectroniccomponentsincludingpassives,connectors,solidstatecomponentsandotherdeviceswhichusesoldertoattachthedevice/componenttotheboardorassembly.Thisstandardappliestobumpeddiethatareusedfordirectboardattach(COB).Thisstandardpresumesthatthesurfacefinishofbareboards(PCB),packagesubstrates,etc.isPb-free.NOTEThePb-freelabelingofelectronicsystems,suchascomputers,printers,servers,etc,isoutsidethescopeofthisstandard.Thepurposeofthispublicationistoprovideadistinctivesymbolandlabelingformattoidentifythoseassemblies,componentsordevicesthataretotallyPb-freeand/orarecapableofprovidingorhavePb-free2ndlevelinterconnects.ItalsoprovidesforidentificationofcertaintypesofPb-freematerialsandthemaximumsafeprocessingtemperatureduringassemblyorrework.ItismeanttoaddressonlythePb-freeaspectsRoHScomplianceanddoesnotaddresscompliancetootherbannedmaterials.2NormativereferenceDirective2002/95/ECoftheEuropeanParliamentandoftheCouncilontheRestrictionoftheUseofCertainHazardousSubstancesinElectricalandElectronicEquipment(“RoHSDirective”).TheexemptionsarelistedinanAnnexofthisdirective.3Termsanddefinitions3.12ndlevelinterconnect:Theinterconnectmadebytheattachmentofthedevice/componenttotheprintedcircuitboard,seeFigure5.3.22ndlevelinterconnectlabel:Alabelthatidentifiesboxes,bagsorcontainersthatcontainboards/assembliesorcomponentscapableoforthathavePb-free2ndlevelinterconnects.NOTEThislabelincludesthePb-freecategoryandmaximumprocessingtemp