IC代工生产管理培训

MPC教育资料1：什么是PC2：什么是MPC3：MPC需要关注和解决那些问题4：MPC专业词汇解释什么是PC•PC就是productioncontrolPC是着眼在公司层面，根据销售订单以及生产线产能进行制定生产投入产出计划职责：1.产品的投入计划2.确保产品交货期，以及产出计划。3.确认制品MOVE情况以及提醒交货期会有延迟的产品4.执行客户需求的产品释放以及停滞等等什么是MPC•MPC的客户是MPP,MPP客户是PC。也就是说详细的完成PC所下达的任务。1.按生产计划检查、跟踪并准确及时报告生产流程中的问题。2.依据WIP、制品交期、设备负荷、制程时间限制以及在制品及设备的运行状况等因素调整实时调度系统的运行3.提高人员及设备利用率制品流通率的管理及有关数据的提供4.依据生产数据计算生产能力。MPC需要解决哪些问题•Themissionofamanufacturingfab:Tosatisfycustomerandmaximizethecapacityandwaferoutput•Whatcustomerwants?OntimedeliveryGoodwaferqualityLowunitprice•MFGindicesindicatestheperformanceofaFabIndexnameShortdescCTCycleTimeTRTurnRatioMoveWafermovementWIPProductionwaferinprocessEngWIPEngineerwaferinprocessYieldFabYieldHoldHoldWIPTerminateEngineerwaferscrapScrapProductionwaferscrapReworkReworkwaferWSWaferstartWOWaferoutKEYC/T•英文全名：Cycle/Time•中文全名:运转周期•定义:theaverageleadtimewhichonewafermustpayforrunning,waiting,holding,andtimeonbankfromwaferstarttoQC-Inspection•计算方式:∑Cycle_Time_Waferi/Wafer_Output•计算频率/单位:天•指标意义:1.考量FAB的硅片的运转速度2.衡量FAB的run货效率TR•英文全名：TurnRatioT/R•中文全名:在制品周转率•定义:Averagenumberofstageswhichonewafercanpenetrateinoneday每片硅片平均每天跑过的Stage数•计算方式:StageMove/WIPWIP=(BOH+EOH)/2•计算频率/单位:每日•指标意义:1.由TurnRatio可知硅片处理速度是否正常2.此指标为StageMove与WIP的比值，因此由此可以得知目前的WIP量是否合理，在制品积压成本是否过高，以及生产流程是否顺畅Move•英文全名：WaferMoves•中文全名:硅片移动量•定义:一片硅片完成一个Stage称为一个StageMove;一片硅片完成一个Step称为StepMove•计算方式:由Fab中实际操作的硅片数加总得到•计算频率/单位:每日或每月•指标意义:1.由各个移动量可以了解目前硅片之处理速度是否正常2.由移动量预估硅片是否赶上速度3.籍此衡量各区域之生产绩效WIP•英文全名：广义上Workinprocess在半导体行业:WaferInProcess•中文全名:在制品•定义:从硅片投入到硅片产出，Fab内各站积压了相当数量的硅片，统称为Fab内的WIP•计算方式:堆积硅片求和•计算频率/单位:每日或每月/片•指标意义:衡量一个FAB的生产能力的标志PWIP:ProductionWIPEngWIP:EngineeringWIPYield•英文全名：Yield•中文全名:良率•定义:产出硅片良品数量与投入生产之硅片数量的比率•计算方式:硅片产出量/（硅片产出量+硅片报废量）•计算频率/单位:每月%•指标意义:由良率可以显示所生产硅片之制造环境，制程，规格方面之综合表现，故其为最重要的品质指标•英文全名:Hold•中文全名:硅片搁置•定义:在生产过程中因为控制或者工程原因暂时无法进行生产的硅片数量•计算方式:所有holdWIP数量相加•计算频率/单位:每日或每月片•指标意义:1.衡量工厂生产稳定度2.衡量因工程原因对生产周期的影响HoldTerminate/Scrap•英文全名：Scrap•中文全名:报废硅片•定义:totalwaferscrapquantityinFAB•计算方式:所有Scrap求和•计算频率/单位:每日或每月片•指标意义:1.衡量制程稳定度2.衡量一个FAB的生产良率3.EngWIPterminate用以衡量工厂研发或者保持制程稳定而用掉的costRework•英文全名:Rework•中文全名:返工•定义:TotalreworkcountinFablithoarea•计算方式:所有rework数目累加•计算频率/单位:每日或每月片•指标意义:1.衡量Litho制程稳定度2.衡量litho无效movement数量WS•英文全名:Waferstart•中文全名:硅片下线•定义:Totalwaferstartcount•计算方式:所有下线数目累加•计算频率/单位:每日或每月片•指标意义:衡量工厂生产规模WO•英文全名:Waferout•中文全名:硅片出货•定义:Totalwaferoutcount•计算方式:所有出货数目累加•计算频率/单位:每日或每月片•指标意义:衡量工厂生产规模MFGindicesintroductionWhatisa“Golden”FabIndexnameDirectionCTAsShortaspossibleTRAsLargeaspossibleMove/PWIPAsLargeaspossibleEngWIPAsFewaspossibleYieldAsLargeaspossibleHoldAsFewaspossibleTerminateAsFewaspossibleReworkAsFewaspossibleWSAabsoluteindex,relatedtocapabilityoftheFabWOAabsoluteindex,relatedtocapabilityoftheFabMoveAabsoluteindex,relatedtocapabilityoftheFabPWIPAabsoluteindex,relatedtocapabilityoftheFabMPC需要关注哪些问题•WaferMoves•WaferStepMove•LocationMove•WaferInProcess(WIP)•EndOnHand&BeginOnHand•TurnRatio(T/R)-Daily•EquipmentUPTime•WaferPerHour(WPH)•EquipmentEfficiency•Utilization•ManufacturingEfficiency•CycleTimePerMaskLayer(C/T)•WaferOut•LineYield•WaferAcceptanceTest(WAT)•FabYieldWaferMoves•DefinitionoWaferstepMove=1wafermovingfromoneSteptoanother.oWaferstageMove=1wafermovingfromonestagetoanother.•MethodofCalculationoSumofactualfaborsectionwaferstagemovestogivefabwafersmove,andsectionwafersmoverespectively.•PurposeofWaferMoveIndexoFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateofthesectionorfabisnormal.oUseasameasurementindextocompareshifttoshiftorfabtofabSampleCalculations•Scenario1:Particularlotof25waferscompleted4stagesonthe1stofFebruary2000.•Scenario2:Particularlotof25waferscompleted70stagesinthemonthofJanuary2000.•Scenario1Moves:Onthe1stofFebruary2000,WaferMove=25X4=100•Scenario2Moves:InthemonthofJanuary2000,WaferMove=25x70=1750WaferStepMove•DefinitionoWaferSTEPMove-1wafermovingfromonesteptoanother.(Note:1Stepisequivalentto1equipmentmoveor1metrologystep.)•MethodofCalculationoSumofactualfab,sectionorequipmentwaferSTEPmovestogivefabwafersmove,sectionwafersmoveandequipmentwafermovesrespectively.•PurposeofWaferStepMoveIndexoFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheequipmentorsectionisnormal.oUseasameasurementindextocompareequipmenttoequipmentorperformanceofoperatortooperator.SampleCalculations•Scenario1:Particularlotof25waferscompleted6stepsonthe1stofFebruary2000.•Scenario1StepMoves:Onthe1stofFebruary2000,WaferMove=25X6=150StepMoves(Assumingtheaveragenumberofstepsperstages3steps/stage)•StageMoveson1stofFebruary2000=150/3=50StageMovesLocationMove•DefinitionoTotalnumberofWaferStageMove–1wafermovingfromonestagetoanother.•MethodofCalculationoSumofstagemoveswithinprocessarea(CVD,PVD,PHOTO,etc).•PurposeofLocationMoveIndexoFrompresentamountofwafermoves,wecandetermineifthepresentproductionrateoftheprocessareaisnormal.oUseasameasurementindextocomparedaytodayormonthtomonthperformanceofaprocessarea.SampleCalculations•Scenario1:WaferMoveintheCVDareaforIMD=1200,PETEOS=800,SACVD=500,HDP=400andBPTEOS=400.•Scenario1LocatonMoves:CVDLocationM