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Doc.No.‡ö÷MEI032Issue-Rev.H,-î¢04-01GuangzhouTermbrayElectronicsTechnologyCompanyLimitedÞû)5Pр PløPage1of1DocumentRevisionHistory‡öô9e†Issue-Rev.H,-î¢EffectiveDateHåChangeDescriptionô9ÏðInitiator6¢º04-01Jul18,20151.Changethenameandlogoofcompanyô9løðÊÆ2.Affectedpage/×qÍu@ …¹SongGuoPing03-01Jul18,20131.Reviseitem2.0inGeneral2.Additem3.0inGeneral3.Upgradetheformatofcover/ô°
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15.2Section41.02.Affectedpage/×qÍuhèSongGuoPing02-01Aug17,20121.Reviseitem/î¢Section211.32.Upgradetheformatofdocumentô°‡ö3.Affectedpageallcontentsandattachedlists×qÍuh腹ÊDhSongGuoPing01-02Apr27,20111.Reviseitem/î¢Section31.2Section41.02.Reviseattachedlist/î¢Dh02~043.Affectedpage/×qÍuhèSongGuoPing01-01Jan11,2011NewdocumentSongGuoPingLF-HASLWorkInstruction4sàÅàÅ·!åÍ\:Status¶
Doc.No.‡ö÷MEI032Issue-Rev.H,-î¢04-01CatalogueGuangzhouTermbrayElectronicsTechnologyCompanyLimitedÞû)5Pр PløPage1of2CatalogueîUGeneral;º1.0Purposeî„2.0Scopeô3.0Applicabledocument(‡öSection1OperatingInstructionforEquipmentRev.03-01 ,è¾Í\:1.0HorizontalLF-HASL4sàÅ·!:2.0Oven‰3.0TapeLaminator˜:4.0UVmachineUV:5.0Micro-etchmakeuptank®€o86.0DisposalProcedureforOnholdOnHoldSection2ManufacturingInstructionRev.03-01 ,Œè6\:1.0Mainmachineparameterssetting;:èÂp¾n2.0Micro-etchtankscontrol®€8§63.0HASLprocessflowforGoldFingerboardsÑKåzA4.0HASLprocessflowforreworkingboardsÔååzA5.0FirstArticlemanufacturing–6\6.0Thickboards(e80mil)andBackplanemanufacturingše80mil ÊÌ6\7.0Manufacturinginstructionforhighlayerboards(e8layers)ØB6\:e8B 8.0Operationinstructionofoven‰Í\:9.0ControlforTinthickness!š§610.0Productioncheck§Àå11.0HandlingmethodofspecialissuepanelsyŠî˜„¹Õ12.0Specialoperationcriterionofprocess叄yŠÍ\Æ13.0LF-HASLTrouble-ShootingGuide8Áî˜ã³LF-HASLWorkInstruction4sàÅàÅ·!åÍ\:Status¶
Doc.No.‡ö÷MEI032Issue-Rev.H,-î¢04-01CatalogueGuangzhouTermbrayElectronicsTechnologyCompanyLimitedÞû)5Pр PløPage2of214.0MeasurementofholediameterT„KÏ15.0ProcesscontrolA§6Section3InstructionforMaintenance(Rev.03-01), èÝ{å\:1.0MainLF-HASLmachine;àÅ·!:2.0Pre-heater„í:3.0Fluxmachine~™:4.0CoolTableÎð5.0Pre-treatmentandPost-treatmentM
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Doc.No.‡ö÷MEI032Issue-Rev.H,-î¢04-01GeneralGuangzhouTermbrayElectronicsTechnologyCompanyLimitedÞû)5Pр PløPage1of3General;º1.0Purpose:î„ThepurposeofthisdocumentistoestablishastandardworkinginstructionforLF-HASLprocess.,‡ö„î„/:4sàÅàÅ·!åúË*Ƅå\:2.0Scope:ôThisdocumentisapplicableforthefollowingequipmentandthegeneralrequirementofsubcontractedLF-HALboard.,å\:(Ž‚¾Í\åÊàÅ·!ÑÁ(B2.1TheoperationofB3horizontalLF-HASLB34sàÅ·!¿Í\2.2TheoperationofUVmachine.UV:Í\2.3OvenandTapeLaminator.‰Œ˜:3.0Thegeneralrequirementofsub-contractedLF-HALboardsÑàÅ·!¡ú,Á(B3.1ThisrequirementisapplicableforthesubcontractorofLF-HALboards,B(,‚ÑàÅ·!3.2QualityrequirementÁ(B3.2.1RawmaterialŸP™NihouSN100Cl3.2.2Thecontrolinsolderbath!8„§6BSoldercontent™RequiremntRangeBôAnalysisFrequency‘‡Sn≥98.5%OnceadayandÏ)!Ni0.04-0.07%Cu0.5-0.9%Pb0.1%Onceaweek1!/hGe0.005-0.01%3.2.3ProcessparameterandproductqualitycontrolAÂpʧÁÁ(§6BItem÷PorjectyîControlrequirement§6B1SEC»PaӁB3.0ug.Nacl/Inch2OnceadayÏ)!2SurfaceTinthicknesshb!šB0.07-1.5milPADsize/PAD:ø1mm*1mm~2mm*2mm3HolewallthicknessT…!š0.1-2.0milLF-HASLWorkInstruction4sàÅàÅ·!åÍ\:Status¶
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