表面技术在电子器件生产中的应用

:2000202227:(19752),,98,.,(,510643):,,,1:;;;;:TB43:A:100727162(2001)0320067205,,,1,195840,,,,,[1]1,111,:(PVD);(CVD);1,,,122.1(PVD),:,[2]1,,1,,,,,[3]1,18320019JournalofGuangdongUniversityofTechnologyVol118No13September2001,,[48]1,,,,,1,,,,[9]1,Yba2Cu3O7,,[1011]1,1,,2V[12]1,119,50;60,;1965IBM,[13]1,:1,;,1,,1ZnSe1000,150[14]1,,,1,1,:SiO2,,,200nm/min,,SiO2,,,[15]1,,,;,11938,Berghaus,1963Mattox,1[16]1,Ta2NTa2AlAuCuNiSiO2Al2O3[17]1212(CVD)60,,,1,:AuAgCu,AgCu,,,Au,,1,,,1:WF6,,[18]1,,UTh,MOSa86181,1,()1,,[19]1,,(PCVD),,,,PCVD330,1,1,,,,,,577,4002,780800,.,PCVD.2Si,,2Si,.,,1975W1E1Spear,PCVD2Si2Si:H2Si:F2Si:F:H,,2Si:H,,[20].,PCVD,:CVD615617(),PCVD300619,PCVD,[21].(MOCVD),,.MOCVD,.,(LCVD),,,.213,:.,;,.,,,.,,,:Ni13%P,,,Ni()[22].,963,:[23].1m,,4m/h,.:,,,.,,.,.,.Ag,[24].,(CdSeCdTeAgSeGeAs)[25].,,60IBM,,(),[26].,,,.,,40m,,,,,[27].,:.,,:2,,,,,2.,2,PbTiO3,TiO22SiO2Al2O3.3,,,.,,21,.:[1]1[J]1,1996,10(6):7291[2]1[M]1:,1998,232271[3]1[M]1:,1996,362381[4],1[M]1:,1991,12621291[5]1VLSI[M]1:,1986,962991[6]1§±ƒ™[M]1,1988,29723011[7]1¯Ó©¶¤[M]1:,1987,17521761[8]THWood,JCWhite,BAThacker.ElectrodepositionofAlloys[J]1Appl.Phys,1983,42,408.[9]W.Koechner.SolidStateLaserEngineering[M].NewYork:Springer-Verlag,1976,32273,5742548,601260210718[10]1[R]1:,1988,14021581[11]1[M]1:,1999,261[12]1[M]1:,1985,32191[13][M]1:,1985,39,11[14],1[M]1:,1996,12821291[15]1[M]1:,1997,2011[16]1[M]1:,1998,231[17]1[M]1:,1985171[18]EKBroadbent,TWatanabe.Electrochem[C].Soc.,1984,1311[19],.[M]1:,1979,461[20]1[M]1:,1987,862881[21]RichardBrancato.AdvancedPackaging[J].ElectrochemSoc,2000,130:2264[22]1[M]1:,1985,372401[23]Bever,MichaelB.EncyclopediaofMaterialsScienceandEngineering[J]1Press,Oxford,1986(4),251222515,2506225081[24]1[M]1:,1989,21[25]1[J]1,2000,41[26],1[J]1,2000,41[27]MJCooke,ABrenner,Kknoedler1Electrochem[C].Soc.,1984,131.ApplicationofSurfaceTechnologiesintheProductionofElectronicApplianceZHANGBo,ZHUYou2lan(FacultyofMaterialandEnergy,GDUT,Guangzhou510643,China)Abstract:Severaltechnologiesofsurfacetreatmentwhichareextensivelyappliedintheareaofelectronicappliancearesumarized.theiradvantageandshortcomingareenalmeted.Thetrendinsurfaceengineeringisalsosuggested.Keywords:Surfacetechnology;electronicthinfilms;splash;packaging;evaporatingdeposite173,: