Assembly-Process-Flow

MacronixProprietary&ConfidentialICPackageAssemblyProcessICPackageAssemblyProcessFlowIntroductionFlowIntroductionMacronixProprietary&ConfidentialAssemblyFlowAssemblyFlowDicingSawDicingSawDiebondDiebondWireBondWireBondMarkingMarkingSolderPlatingSolderPlatingForming&DerailForming&DerailFinalvisualFinalvisualWaferGrindingWaferGrindingIncomingInspectionIncomingInspectionPMCPMCPacking&shippingPacking&shippingDeflash&TrimDeflash&TrimMoldingMoldingMacronixProprietary&ConfidentialWaferBack-grindingMethodofgrindingthebacksideofthewaferbasedontherequiredwaferthickness.Qualitycheckitems5POINTS1STWAFER/PERCASETTEWaferthicknessSamplesizeFreq.MonitoritemMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingWaferMountMethodofattachingthewaferintoUVtape.ThisUVtapeservedtoholdthewaferthruthehelpofwaferring.Qualitycheckitems1STWAFERPERCASETTEBubbleSamplesizeFreq.MonitoritemMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMethodtoseparate/cutthewaferbasedontherequireddiesize.DieSaw4CutlinePERMachine/ShiftKerfWidthSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMethodofattachingthedieintoL/Fbyusingrequiredforce,scrub,timeandtemperature.DieAttach1PCSONE/MACHINE/DAYDieShearAtleast4PCSONCE/MACHINE/SHIFTEpoxyVoidSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMethodtointerconnectthecktusinggoldwirefromdietoL/Fwithrequiredforce,power,timeandtemperatureWirebond12Balls/1PCSBallShear12WIRES/1PCSCHANGEDEVICE,ONCE/3SHIFTS/MC,CHANGECapillary,WirePullSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMoldingMethodofencapsulationofunits.Servedasphysicalprotectionoftheunitsincludingthegoldwire.1SHOTWireSweep1SHOTCHANGEDEVICEFIRSTSHOT(MFG)ONCE/SET/SHIFT(QC)InternalVoidSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMarkingMethodtomark/identifytheunits..6STRIPSEachmagazineVisualCheckSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingMethodofremovingthetiebarfromtheL/F.DeFlash/TrimBeforeAfter2STRIPS/TIME3TIMES/SUBLOTVisualCheckSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingPlatingMethodofapplyingsolderplatingforgoodelectricalconductivityandrustprotectedonthepinleads.BeforeAfter6STRIPSONCE/SHIFT/SETThicknessTinComposition5STRIPSPER30MINS-OPERATIONVisualCheckSamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeFlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingForm/SingulationMethodofcuttingandformingtheleadpinsBeforeAfterMIN.5PCS2TIME/MC/SHIFT(MFG)ConplanaritySamplesizeFreq.MonitoritemQualitycheckitemsMacronixProprietary&ConfidentialPROCESSFLOWDieSawDieAttachWaferMountWireBondMoldMarkingDeDlash/TrimPlatingForming/DerailLeadScan/FVI/PackWaferBackgrindingFVI/PackMethodof100%inspectionoftheunits.100%2TIME/MC/SHIFTVisualCheckREST100%SCAN2TIME/MC/SHIFTCoplanaritySamplesizeFreq.MonitoritemQualitycheckitems