Cu-Wire-bonding-Challenges-28-29-May-08-rev2

CuWirebondingChallengesJoeTanASMPacificTechnologyLtd.©20082AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingMarketOverview0.8–3.0milsDiscrete/powerpackagesInMassManufacturingDevelopment4.0–6.0milsCuwiretoreplacethickerAlwirePowerSOQualification&PreProductionPBGAQFN0.8–2.0milsFinepitch/ICpackagesASMPacificTechnologyLtd.©20083AdvancesinSemiconductorMaterials&PackagingTechnologies2008CostAdvantage•RisingMaterialPrices64%-72%-27%ASMPacificTechnologyLtd.©20084AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireMarketDemandYR2006–07.Forecasted2008-2011Source:SEMIIndustryResearchandStatistics,October20070500010000150002000025000Actual2006Actual2007Forecast2008Forecast2009Forecast2010Forecast20110.00%0.50%1.00%1.50%2.00%2.50%3.00%3.50%4.00%4.50%5.00%AuWireConsumptioninMillionMetersRatioCu/AuConsumptionCAGRAuWire:7.47%CAGRCuWire:40.98%MillionMetersCuConsumptionYR06-YR07:76%IncreaseASMPacificTechnologyLtd.©20085AdvancesinSemiconductorMaterials&PackagingTechnologies200850.0%55.0%60.0%65.0%70.0%75.0%80.0%85.0%90.0%95.0%0%10%20%30%40%50%25um50umFoodforThoughtUnderstandingUPHReductionImpact•25um:200wires,3mmWireLengthAu:Cu=USD215:USD22•50um:36wires,3mmWireLengthAu:Cu=USD1012:USD50•ReductioninUPHbringsadditionalMachineInvestment9.5%2.1%UPHReduction%Savingsin%ASMPacificTechnologyLtd.©20086AdvancesinSemiconductorMaterials&PackagingTechnologies2008FoodforThoughtUnderstandingUPHReductionImpact-50.0%-30.0%-10.0%10.0%30.0%50.0%70.0%90.0%0%10%20%30%40%50%3mm50um0.5mm50um50umCuWire3.0mmCostAdvantagereducesby22.6%Savingsin%UPHReduction%0.5mmASMPacificTechnologyLtd.©20087AdvancesinSemiconductorMaterials&PackagingTechnologies2008-50.0%-30.0%-10.0%10.0%30.0%50.0%70.0%90.0%0%10%20%30%40%50%3mm25um0.5mm25um25umCuWire3.0mm0.5mmLimitingThresholdFoodforThoughtUnderstandingUPHReductionImpactUPHReduction%UPHReduction%ASMPacificTechnologyLtd.©20088AdvancesinSemiconductorMaterials&PackagingTechnologies2008FoodforThoughtUnderstandingUPHReductionImpact•SmallerCuWDcouldbesensitivetoUPHreduction–CapillaryConsumption–ForminggasConsumption–NewMachineinvestment–MovementinAu:CuWirePriceRatio•ThoroughCost/UPHcalculation–Shortwirepackages;e.g.:CSP–ConvertingtoSmallerAuWD0.6mils–0.7mils–MixWireApplicationASMPacificTechnologyLtd.©20089AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingDevelopmentTrendPackageTypes&WireDiameter•ASMCustomerDatabaseQ12008–QFN–SO/SOT–TSSOP/SOIC0.8-1.0mils50%1.2-1.5mils10%2.0mils33%2mils7%0.8–1.0mils50%2.0mils33%2mils7%1.2–1.5mils10%TSSOP/SOIC10%Others(LED,Opto)7%QFN31%SO/SOT35%BGA14%QFP3%QFN31%BGA14%SO/SOT35%TSSOP/SOIC10%QFP3%LED,OPTO7%ASMPacificTechnologyLtd.©200810AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingDevelopmentTrendMarketTrendPushforLeadFreePPFPushforHigherMSLPlatingMaterialInnovationFinishingInnovationRougheningRecognizingchallengesat2ndbondSource:SonySemiconductorsSource:ToshibaSemiconductorASMPacificTechnologyLtd.©200811AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingChallengesImpactfromLeadFree+MSL•Challengesat2ndbond–FunctionofMaterialandPackages•QFNPackagesisthemostchallengingDifferentPlating0246810AgPPFMSL1AuTO220/SOQFP/TQFP/LQFPQFN/DFNBGAIncreasingDifficultyASMPacificTechnologyLtd.©200812AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingonQFNTheParametersConstraintPower/ForceRatio43%39%35%30%26%22%Left1Bottom21RightTop44311Power/ForceRatio=43%Power/ForceRatio=35%Power/ForceRatio=26%NeckconditionwithchangesBondPower/BondForceASMPacificTechnologyLtd.©200813AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingonQFNCommon2ndbondFailureSymptomsMajorChallenges–LowStitchPull–LiftedStitch/NSOL–HeelStress/Crack–FishTail/ShortTailBrokenHeelLiftedStitchPull/NoRemainFishTailASMPacificTechnologyLtd.©200814AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingonQFNProcessEnhancement•CommonApproach:Scrub•Top3CommonConcerns–NSOL–FishTail–ShortTailConventionalScrubStitchEnhancerASMPacificTechnologyLtd.©200815AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingonQFNProcessEnhancement•StitchEnhancer–Altertheinitialset-inofscrubmotion•Controltouchdowntopreventover-deformed–ImprovestheNSOLPerformanceConventionalScrubStitchEnhancer1milsCuWireBottomRightLeftTop7.859.256.547.826.577.707.536.146.9010.106.207.837.9010.685.575.778.758.436.796.898.017.726.316.287.238.237.225.856.877.027.305.588.856.617.616.746.308.667.576.567.655.558.076.197.087.24Max10.68Min5.55Average7.29SD1.14BottomRightLeftTop5.657.499.635.755.938.265.795.513.244.748.256.005.868.227.236.784.937.198.514.254.847.086.964.895.675.704.183.246.366.317.254.47NSOL7.707.584.958.668.538.017.376.337.76NSOL7.33NSOL7.14Max9.63Min3.24Average6.45SD1.52ASMPacificTechnologyLtd.©200816AdvancesinSemiconductorMaterials&PackagingTechnologies2008CuWireBondingonQFNProcessEnhancement•StitchEnhancerToX-Stitch–FurtherEnhancedthe2ndbondperformance•FishTail•ShortTailConventionalScrubX-StitchASMPacificTechno