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印制电路板设计规范——SMD元器件封装库尺寸要求目次1范围............................................................................12引用标准........................................................................13术语............................................................................14使用说明........................................................................25焊盘图形........................................................................25.1SMD：表面贴装方焊盘图形尺寸.............................................25.2SMDC：表面贴装圆焊盘图形尺寸............................................35.3SMDF表面贴装手指焊盘图形尺寸............................................45.4THC通孔圆焊盘图形尺寸...................................................55.5THS通孔方焊盘图形尺寸...................................................65.6THR通孔矩形焊盘图形尺寸.................................................76SMD元器件及焊盘图形尺寸.........................................................86.1SMD分立元件.............................................................86.1.1SMD电阻.............................................................86.1.1.1SMD电阻元件尺寸.....................................................86.1.2SMD电容............................................................106.1.3SMD电感............................................................126.1.4SMD钽电容..........................................................146.1.5MELF（金属电极无引线端面元件）.....................................166.1.6SMD排阻............................................................186.1.7SOT23.............................................................206.1.8SOT89.............................................................226.1.9SOD123............................................................246.1.10SOT143........................................................266.1.11SOT223........................................................286.1.12TO252/TO268..................................................306.1.13SMD220元件（对应物料代码为15100085等）........................326.1.14SMA元件(对应物料代码为15100016a)...............................346.1.15SOT-323元件(对应物料代码为15100001)...........................366.1.16SOT-363元件(对应物料代码为15100001)...........................386.2两侧翼形引脚元件.......................................................406.2.1SOIC[SmallOutlineIntegratedCircuits:小外形集成电路].............406.2.2SSOIC[SmallOutlineIntegratedCircuits:小外形集成电路].............426.2.3SOP[SmallOutlinePackageIntegratedCircuits:小外形封装集成电路]...446.2.4TSOP[ThinSmallOutlinePackage:薄小外形封装]......................466.2.5CFP[CeramicFlatPacks:陶瓷扁平封装]...............................486.3两侧“J”形引脚元件[SOJ]...............................................506.3.1SOJ元件尺寸.......................................................506.3.2SOJ的焊盘尺寸......................................................516.4四边有翼形引脚的元件...................................................546.4.1PQFP(PlasticQuadFlatPack).......................................546.4.2SQFP(ShrinkQuadFlatPack),方形...................................566.4.3SQFP矩形...........................................................646.4.4CQFP[CeramicQuadFlatPack].......................................686.5四边有“J”形引脚的元件................................................706.5.1方形PLCC[Plasticleadedchipcarriers].............................706.5.2PLCC，矩形.........................................................726.5.3LCC[Leadlessceramicchipcarriers]...............................746.6改进型双列引脚元件.....................................................766.6.1DIP[ModifiedDual-In-Linecomponents]..............................766.7BGA....................................................................786.7.1PBGA[PlasticBallGridArray],方形.................................786.7.21.27mmR-PBGA......................................................92印制电路板设计规范——元器件封装库尺寸要求1范围本标准规定了印制电路板（以下简称PCB）设计所使用的元器件封装库中的焊盘图形及SMD焊盘图形尺寸要求。2引用标准下面引用的标准，以最新标准为有效版本。IPC-SM-782SurfaceMountDesignandLandPatternStandard。3术语SMD:SurfaceMountDevices/表面贴装元件。RA：ResistorArrays/排阻。MELF：Metalelectrodefacecomponents/金属电极无引线端面元件.SOT：Smalloutlinetransistor/小外形晶体管。SOD：Smalloutlinediode/小外形二极管。SOIC：SmalloutlineIntegratedCircuits/小外形集成电路.SSOIC:ShrinkSmallOutlineIntegratedCircuits/缩小外形集成电路.SOP:SmallOutlinePackageIntegratedCircuits/小外形封装集成电路.SSOP:ShrinkSmallOutlinePackage/缩小外形封装集成电路.TSOP:ThinSmallOutlinePackage/薄小外形封装.TSSOP:ThinShrinkSmallOutlinePackage/收缩薄小外形封装.CFP:CeramicFlatPacks/陶瓷扁平封装.SOJ:SmalloutlineIntegratedCircuitswithJLeads/“J”形引脚小外形集成电路.PQFP：PlasticQuadFlatPack/塑料方形扁平封装。SQFP：ShrinkQuadFlatPack/缩小方形扁平封装。CQFP：CeramicQuadFlatPack/陶瓷方形扁平封装。PLCC：Plasticleadedchipcarriers/塑料封装有引线芯片载体。LCC：Leadlessceramicchipcarriers/无引线陶瓷芯片载体。DIP：Dual-In-Linecomponents/双列引脚元件。PBGA：PlasticBallGridArray/塑封球栅阵列器件。4使用说明4.1表格中的“min”表示最小尺寸；“max”最大尺寸；“ref”表示参考尺寸；“basic”表示基本尺寸；封装名称中的“mm”表示公制型号；[in]表示英制型号。4.2区域网格表示图形占用的网格数，表中给出为网格的数量，换算成mm时，应乘以0.5mm。5焊盘图形5.1SMD：表面贴装方焊盘图形尺寸表面贴装方焊盘图形尺寸因应符合图1的要求。见图1：焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)焊盘名称X（mm）Y(mm)SMD0r17X1r600.171.60SMD0r80X3r400.803.40SMD2r20X2r002.202.00SMD0r25X1r600.251.60SMD1r00X0r901.000.90SMD2r20X2r602.202.60SMD0r30X1r600.281.80SMD1r00X1r001.0