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J-STD-002CSolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWires3rdWorkingDraftFebruary2004J-STD-002C3rdWorkingDraftFebruary200421SCOPE1.1ScopeThisstandardprescribestestmethods,defectdefinitions,acceptancecriteria,andillustrationsforassessingthesolderabilityofelectroniccomponentleads,terminations,solidwire,strandedwire,lugs,andtabs.Thisstandardisintendedforusebybothvendoranduser.1.2PurposeSolderabilityevaluationsaremadetoverifythatthesolderabilityofcomponentleadsandterminationsmeetstherequirementsestablishedinthisstandardandthatsubsequentstoragehashadnoadverseeffectontheabilitytosoldercomponentstoaninterconnectingsubstrate.Determinationofsolderabilitycanbemadeatthetimeofmanufacture,atreceiptofthecomponentsbytheuser,orjustbeforeassemblyandsoldering.Theresistancetodissolutionofmetallizationdeterminationismadetoverifythatmetallizedterminationswillremainintactthroughouttheassemblysolderingprocesses.1.3MethodClassificationThisstandarddescribesmethodsbywhichcomponentleadsorterminationsmaybeevaluatedforsolderability.TestA,TestB,orTestCandTestD,unlessotherwiseagreeduponbetweenvendoranduser,aretobeusedforeachapplicationasadefault.1.3.1TestswithEstablishedAccept/RejectCriteriaTestA–SolderBath/DipandLookTest(LeadedComponentsandStrandedWire)TestB–SolderBath/DipandLookTest(LeadlessComponents)TestC–WrappedWireTest(Lugs,Tabs,HookedLeads,andTurrets)TestD–ResistancetoDissolution/DewettingofMetallizationTestTestS–SurfaceMountProcessSimulationTest1.3.2TestwithoutEstablishedAccept/RejectCriteriaTestE–WettingBalanceTest(LeadedComponents)TestF–WettingBalanceTest(LeadlessComponents)Thesemethodsareincludedforevaluationpurposesonly.DatacollectedshouldbesubmittedtotheIPCWettingBalanceTaskGroupforcorrelationandanalysis.1.4CoatingDurabilityThefollowingareguidelinesfordeterminingtheneededlevelofsteamconditioningcategoryassurance(seeTable1-1).Theuserandvendorneedtoagreeonthecoatingdurabilityrequirements.Ifthisisnotprovided,CoatingDurabilityCategory3becomesthedefaultconditionfortinandtin/leadfinishes.Category1—MinimumCoatingDurabilityIntendedforsurfacesthatwillbesolderedwithinashortperiodoftime(e.g.,uptosixmonths)fromthetimeoftestingandarelikelytoexperienceaminimumofthermalexposuresbeforesoldering(see5.8).Category2—TypicalCoatingDurability(fornontinandnontin-leadfinishes)IntendedforsurfacesfinishedwithotherthanSnorSn/Pbcoatingsthatwillbesolderedafteranextendedtimefromthetimeoftestingandwhichmayseelimitedthermalexposuresbeforesoldering(see5.8).Category3–TypicalCoatingDurability(defaultfortinandtin-leadfinishes)IntendedforsurfacesfinishedwithSnorSn/Pbcoatingsthatwillbesolderedafteranextendedstorage(e.g.,greaterthanfourmonths)fromthetimeoftestingand/orwhichseemultiplethermalexposuresbeforesoldering(see5.8).Table1-1SteamConditioningCategoriesforComponentLeadsandTerminationsCategory1Category2Category3NoSteamConditioningRequirements1Hour±5min.SteamConditioning8hours±15min.SteamConditioningJ-STD-002C3rdWorkingDraftFebruary200431.5RefereeVerificationSolderDipforTestsA,B,CWhenthedippedportionoftheterminationexhibitsanomaliessuchassurfaceroughness,ordross,oranomaliesthatmayhavebeeninducedbyimpropersolderdipping,arefereeverificationsolderdipofthesuspectanomalymaybenecessary.Uponreinspectionifthesuspectanomalyhasbeenremoved,theanomalywillhavebeenverifiedasanonrejectablecosmeticsurfacedefect.Iftheanomalypersists,regardlessofarea,itshallbeclassifiedarejectablesolderabilitydefect.Thisproceduremayonlybeusedononecomponentperlot.Continuousneedofprocedureisanindicationofeitherimpropertestingprocedure,examinationinterpretation,orofpoorcomponentquality.1.6LimitationThisstandardshallnotbeconstruedasaproductionprocedureforthepretinningofleadsandterminations.1.7ContractualAgreementIncaseswherethestatedtestparametersareinappropriateorinsufficient,alternativeparametersmaybeagreeduponbetweenvendoranduser.2APPLICABLEDOCUMENTSThefollowingdocumentsoftheissuecurrentlyineffectformapartofthisstandardtotheextentspecifiedherein.THISCONTENTWILLBEUPDATEDBYSTAFFJUSTPRIORTOPUBLICATION.ANYDOCUMENTREFERENCEDINTHESTANDARDWILLBELISTEDHERE.ITISNOTAPPROPRIATETOLISTDOCUMENTSINTHISSECTIONTHATARENOTREFERENCEDINTHESTANDARD.2.1Industry2.1.1IPCIPC-T-50TermsandDefinitionsIPC-CS-70GuidelinesforChemicalHandlingSafetyinPrintedBoardManufacturingIPC-TR-464AcceleratedAgingforSolderabilityEvaluationsandAddendumJ-STD-004RequirementsForSolderingFluxesJ-STD-005RequirementsforSolderingPastesJ-STD-006RequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolderforElectronicSolderingApplications2.2Government2.2.2Federal(CID)A-A-59551Wire,Electrical,Copper(Uninsulated)3REQUIREMENTS3.1TermsandDefinitionsThedefinitionoftermsshallbeinaccordancewithIPC-T-50.TermsthathavebeenrepeatedfromIPC-T-50forconvenienceareindicatedbyanasterisk(*).Dewetting*Aconditionthatresultswhenmoltensoldercoatsasurfaceandthenrecedestoleaveirregularly-shapedmoundsofsolderthatareseparatedbyareasthatarecoveredwithathinfilmofsolderandwiththebasismetalnotexposed.DissolutionOfTerminationMetallization(Lea