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•MemoryBusinessUnitUpdate•SerialEEPROMProducts•June2013•BryceMorgan•StrategicMarketingManager—MemoryandTempSensorProductsAtmelConfidentialInformationAgenda2©2012CopyrightAtmelCorporation•UpdateonCurrentDevices•UpdateontheNewHighDensityDevices(1M&2M)•UpdateontheNewCSandMACDevices•ReleaseoftheNewAT34C04DevicesforDDR4DIMMsAtmelConfidentialInformationProductBrochuresCompletelyRevised3©2013CopyrightAtmelCorporation•NewFullLineSEEPROMProductBrochureAvailableNowContributedArticleforAT24MACxxxProductsProductBrochureforAT24CSxxx/AT24MACxxxProductsProductBrochureforallSEEPROMProductsAtmelConfidentialInformationAtmelSerialEEPROMOverview•VeryDiverseProductPortfolio•1-Kbitto1-Mbitdensitiesinproduction•FulllineofI2C(2-wire),SPI,andµWire(3-wire)devices•Industrialandautomotivetemperatureofferings•CompleteLineofStandardandSmallFootprintPackages•SOIC•TSSOP•SOT-23•LeadlessDFNpackages•BGAsandWLCSPs(wafer-levelchip-scalepackages)•Bumpeddiesolutions•ContinuousDevelopmentofNewandInnovativeSolutions•Newfunctionsandfeaturestoenhanceapplicationsandsavesystemcost•Improvedperformanceandspecifications4©2013CopyrightAtmelCorporationAtmelConfidentialInformationSerialEEPROMProductMatrixI2CSPIµWireDeviceFamilyAT24C/34CxxxAT25xxxAT93CxxxDensities1-Kbitto1-Mbit2-Mbitindevelopment1-Kbitto1-Mbit2-Mbitindevelopment1-Kbitto16-KbitVoltageRange1.7Vto5.5V1.8Vto5.5V1.7Vto5.5VClockFrequencyUpto1MHzUpto20MHzUpto2MHzAutomotiveGradeAvailableAvailableAvailablePackageOptionsPDIP,SOIC,TSSOP,SOT-23,DFN,BGA,WLCSP*PDIP,SOIC,TSSOP,DFN,BGA,WLCSP*PDIP,SOIC,TSSOP,DFN,BGA,WLCSP**ContactAtmelforMoreDetails1.8mmx2.2mmx0.4mm5©2013CopyrightAtmelCorporationAtmelConfidentialInformationSerialEEPROMTechnologyDevelopment201220132014201520166©2013CopyrightAtmelCorporation•AtmelContinuestoInvestinNext-GenEEPROMTechnology•ActiveprocessdevelopmenttoaddresslowandhighdensityproductsAtmelConfidentialInformationWLCSPUpdate•ContinuingWithDevelopmentofMoreWLCSPs•Usedinapplicationslikecameramodules,hearingaids,sportswatches,etc.7©2013CopyrightAtmelCorporation•100%WillingandAbletoOfferNewWLCSPs•~8weeksneededtotoolpackageanddeliversamples•Earlycustomerengagementiscritical•Findtherightopportunityandwecandoit!DeviceDensitySampleAvailabilityI2CAT24CM022-MbitPendingproductlaunch(targetQ4’13)AT24CM011-MbitNowAT24C512C512-KbitNowAT24C64D64-KbitNow(6-ballversion)AT24C64D64-KbitDesigned,waitingforleadcustomer(5-ball)AT24C32D32-KbitDesigned,waitingforleadcustomerAT24C08C8-KbitDesigned,waitingforleadcustomerAT24C04C4-KbitDesigned,waitingforleadcustomerSPIAT25M022-MbitPendingproductlaunch(targetQ4’13)AT25M011-MbitDesigned,waitingforleadcustomerAtmelConfidentialInformationDevelopingNext-GenerationDesigns•NewDevicesDesignedforUltra-LowPowerConsumption•Reducedstandbycurrents(sub-100nA)andwritecurrents(sub-1mA)•NewFeaturestoImproveProgrammingThroughputs•Importantforhigh-densityproducts•Implementinghigh-speedwritemodestoreducewritetimesby~50%•Improvesmanufacturingthroughputtoreducecosts8©2013CopyrightAtmelCorporationAtmelConfidentialInformationAgenda9©2012CopyrightAtmelCorporation•UpdateonCurrentDevices•UpdateontheNewHighDensityDevices(1M&2M)•UpdateonNewCSandMACDevices•ReleaseoftheNewAT34C04DevicesforDDR4DIMMsAtmelConfidentialInformation2-MbitSerialEEPROMs•TwoDevicesinDevelopment•I2C(AT24CM02)andSPI(AT25M02)versions•FirstNewDeviceDesignedforUltra-LowCurrentConsumption•Extendsapplicationbatterylife•500µAtypicalwritecurrentandlessthan100nAstandbycurrent•FirstNewDevicewithHigh-SpeedWriteMode(AtmelExclusive)•Improvesmanufacturingthroughputsbyreducingprogrammingtimes•OptionalBuilt-InSupportforSerialNumberandMACAddress•FirstSiliconOutofFabandUnderEvaluation•SamplesQ4-201310©2013CopyrightAtmelCorporationAtmelConfidentialInformation1MSPISerialEEPROMs•TwoVersionsNowSampling•AT25M01–“Standard”24-bitaddressversion•Utilizesthreecompletebytes(24clockcycles)foraddressing•AT25M017–17-bitaddressversion•Atmelexclusivefeature•Reducesinitiallatencyandoverhead(onlyrequires17clockcycles)•Latencyforeachrandomaccesscanbereducedby1.4µswith5MHzclock•FirstAtmelSPISEEPROMthatSupports1.7VMinimumVCC•PackageOptions•Availableinnarrow-body(JEDEC)andwide-body(EIAJ)SOICs•WLCSPdesignedandjustwaitingforaleadcustomer/opportunity11©2013CopyrightAtmelCorporationAtmelConfidentialInformationCustomerDesignActivity•Design-winfromaMajorHearingAidManufacturer•AT25M017•SEEPROMneededbecauseoflowwritecurrentsandthespecialaddressingfeature•Samplesprovidedandqualified.ProductionstartinQ3,2013•Volume480K/year12©2013CopyrightAtmelCorporationSerialEEPROMsAtmelConfidentialInformationAgenda13©2012CopyrightAtmelCorporation•UpdateonCurrentDevices•UpdateonNewHighDensityDevices(1M&2M)•UpdateontheNewCSandMACDevices•ReleaseoftheNewAT34C04DevicesforDDR4DIMMsAtmelConfidentialInformationCS-SeriesDevices•DevicesIncorporateanAtmelFactory-ProgrammedESN(SerialNumber)•128-bit,permanentread-onlyvalue•CustomerscannotalterorerasetheSerialNumber•SerialNumberisstoredinextra,dedicatedmemory•Separateaddress/commandusedforaccess•SerialNumberiscompletelyunique•UniqueacrossallCS