测温板的制作Porfilerboard_Porfiling

Profilerboard&ProfilingDate:2002.05.12Rev.No.:01ApprovedBy:PreparedBy:Xiaoping.chen1.Scope:范围:ThisprogramappliesforTemperatureProfilingforallproductinFlextronicsIndustrial(zhuhai).适合伟创力实业有限公司所有产品温度曲线的制作.Date:2002.05.12Rev.No.:012.Instrument:仪器及工具hightemperaturegluepaperhightemperaturesolderDATAPAQ9000thermocoupleDate:2002.05.12Rev.No.:013.Thermocouplepreparation准备热电偶线3.1Only“K”typethermocouplewirebeusedfortemperatureprofiling.做温度曲线只能使用＂Ｋ＂型热电偶线．Date:2002.05.12Rev.No.:013.Thermocouplepreparation准备热电偶线3.2Ensurethermocouplewireisminimum15cmextensionfromboardedge.确定热电偶线从板边延长最少15cm．Date:2002.05.12Rev.No.:0115cm4.preparationofprofilingboard准备温度曲线测试板4.1Getreadytheboardfortemperatureprofiling,selecttheactualproductorapproximateproductasthesampleboard.用生产产品的板或者近似生产产品的板做为温度曲线的测试样板4.2Identifythelocationsforsolderingthermocouplewires.确定焊接热电偶线的位置．Date:2002.05.12Rev.No.:01A)AminimumofthreepointsmustbemeasuredonaPCB.Thethreepointstobemeasuredarethelead,endandcenteroftheSMDcomponent.一块板上最少有三个测试点，这三个点分别在板面上前，后及中间的ＳＭＤ元件．4.preparationofprofilingboard准备温度曲线测试板Date:2002.05.12Rev.No.:01B)TheselectionwillbebasedonthecoldestandthehottestlocationonthePCB.在ＰＣＢ上选择最冷的及最热的位置．1)Thecoldestwillbethemostmassivecomponentandinthemostdenselyloadedarea最冷的位置在最大的元件和元件最密集的区域．2)Thehottestwillbethehighlyexposedorisolatedarea最热的位置在非常曝露或者单独一个的区域．4.preparationofprofilingboard准备温度曲线测试板Date:2002.05.12Rev.No.:01C)Selecttheheatsinklocation选择吸热多的位置．D)Selectthetemperaturesensitivitycomponent.选择对温度敏感的元件位置．E)Selectthethermalshocklocation选择有热冲击的位置．Note:Refertotheproductprocessinstructionforthethermocouplelocationoftherespectiveproducts.注意：参考各自产品的工艺流程指示确定热电偶线的位置．4.preparationofprofilingboard准备温度曲线测试板Date:2002.05.12Rev.No.:014.3Addhightemperaturesoldertothecomponent’sterminationwhichhadbeendesoldered.在需要焊接的元件端子加高温锡．4.4Thermocouplewirewillbelinkedtothereservedlocation.热电偶线连在指定的位置．4.preparationofprofilingboard准备温度曲线测试板Date:2002.05.12Rev.No.:014.5Uponsolderingiscompleted.ensurethefollowingiscomplied.焊接后，确认是否遵守下列内容：A)Noexcessivesoldercoverupthethermocoupletermination.没有过多的锡盖在热电偶线的端子上B)Thethermocoupletermination(spot–welded)isfullysubmergeintothesolderwithoutanyexposure.热电偶的端子全部焊在焊锡中，没有曝露的．4.6Re-dosolderingifitdoesnotcomplywiththeaboutrequirements.如果没有达到要求，重新焊接．4.preparationofprofilingboard准备温度曲线测试板Date:2002.05.12Rev.No.:015.Boardloadingcondition板的传送状况5.1Flowtheprofileboardintheunloadedconditionduringtheinitialandconcurrentstagesofprofiling.thisistoattainanacceptableprofile.在起初阶段，炉内没有加载板的情况下，测试的曲线作为一个初步的可接受的曲线．Entrydirection进板方向Date:2002.05.12Rev.No.:015.Boardloadingcondition板的传送状况5.2Forthefinalprofile,flowtheprofileboardunderaloadedconditiontosimulateafullyproductionoperatingcondition.Ensurethattherearetwo“productionboards”infrontoftheprofileboardandonebehind.曲线确定以后，再做曲线时以模拟炉内充满ＰＣＢ的状态．在测试板的前面有两个产品板，在它的后面有一块产品板．Note:“productionboards”caneitherbeboardsofsameproducttypeorofsamedimension.注意：产品板既可以是相同的产品或相近似的产品板．Date:2002.05.12Rev.No.:01Entrydirection进板方向Profileboard测试样板Productionboard产品板5.Boardloadingcondition板的传送状况Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.1SolderpastereflowforPCBAprocess.ＰＣＢＡ锡膏焊接工艺Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.1.1Thefollowingparameterhadtoconsideronthetemperatureprofile.在温度曲线上必须考虑到下列参数：6.1.1.1MaximumPre-heatTemp.Rampfromambienttosoaktemperature从室温到软化保温区的温度的最大的预热温度和斜率．6.1.1.2Soaktemperatureandtime软化保温区的温度及时间．6.1.1.3Reflowtemperatureandtime回流的温度及时间．6.1.1.4Peaktemperature最高温度Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：PeaktemperatureReflowSoakCoolPreheatDate:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.2WavesolderforPCBAprocess.ＰＣＢＡ波峰焊工艺Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.2.1Thefollowingparameterhadtoconsideronthetemperatureprofile.在温度曲线上必须考虑到下列参数：6.2.1.1Pre-heatTemp.andtime预热温度和时间．6.2.1.2Soldertemp.andtime焊锡温度和时间．Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：PreheatPeaktemperatureDate:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.3AdhesivecuringforPCBAprocess.ＰＣＢＡ胶水固化工艺Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.3.1Thefollowingparameterhadtoconsideronthetemperatureprofile.在温度曲线上必须考虑到下列参数：6.3.1.1Curingtemp.andramp固化温度及斜率；6.3.1.2Curingtime固化时间；Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：CoolPreheatCuringDate:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.4Rework返工Date:2002.05.12Rev.No.:016.Thermalprofilerequirement:温度曲线需要表达的内容：6.4.1Thefollowingparameterhadtoconsideronthetemperatureprofile.在温度曲线上必须考虑到下列参数：6.4.1.1themaximumtemperaturewhichcomponentscanbear.元件本身能承受的最高温度；6.4.1.2themaximumtemperatureandlongesttimeonsolderpoint.锡点的最高温度及时间．Date:2002.05.12Rev.No.:017.Temperatureprofilefrequency:温度曲线測試频率：7.1NormalProcessTemperatureprofilefrequency:正常工藝温度曲线测试频率：7.1.1WhenthereisPP.当ＰＰ试产时；7.1.2Whenthereismachinechange当机器改变时；7.1.3Whenthereisamodelchange当产品型号改变时；7.1.4Whenproductqualityisoutofcontrol当产品质量超出控制限时；7.1.5Afterpreventivemaintenance预期的维护之后；7