半导体铜线键合工艺研究

学校代码：10289分类号：TN606密级：公开学号：103030005江苏科技大学专业硕士学位论文（在职攻读专业学位）半导体铜线键合工艺研究研究生姓名汤振凯导师姓名朱志宇申请学位类别工程硕士学位授予单位江苏科技大学学科专业电子与通信工程论文提交日期2014年4月19日研究方向半导体元器件的球焊工艺论文答辩日期2014年6月7日答辩委员会主席林明评阅人2014年4月22日论文题目半导体铜线键合工艺研究姓名汤振凯江苏科技大学II分类号：TN606密级：公开学号：103030005工学硕士学位论文（工程硕士）半导体铜线键合工艺研究学生姓名汤振凯指导教师朱志宇教授江苏科技大学二O一四年四月AThesisSubmittedinFulfillmentoftheRequirementsfortheDegreeofMasterofEngineeringResearchofsemiconductorcopperwirebondingprocessSubmittedbyTangZhenkaiSupervisedbyProfessorZhuZhiyuJiangsuUniversityofScienceandTechnologyApril,2014AbstractII摘要I摘要在当今21世纪，半导体产业蓬勃发展，半导体IC和半导体器件已经在各行各业广为使用，从卫星通信、军事产品、信息工业至普通家用产品、小家电，同时伴随着半导体产业和器件的发展，人们的生活愈来愈便捷和智能。半导体产业在发展的过程中，分工逐渐精细，而半导体封装产业也成为了一个在半导体产品中占据较大比例的产业，如何能够提高半导体封装的效率和性能，降低成本，就摆在了所有半导体产业人员面前。随着产品的I/O口变多，半导体封装中的键合成本也占据着较大比例，在键合中采取新的材料，新的工艺，在保证产品性能和可靠性的前提下，降低材料成本，是产业发展的一个趋势。随着设备技术的发展，采用铜丝代替原来的金丝作为焊丝，已经成为了可能。由于金和铜的材料价格存在着较大差异，很多公司和研究人员投入了很大精力，进行各方面的尝试，经过多年的研究，长电科技已经在这方面取得了较大的突破。本文主要研究用铜丝代替传统的金丝材料，采用新的技术和工艺参数，运用DOE试验法，找到了最佳的铜线球焊的工艺参数（主要是球焊功率、球焊压力、球焊时间）窗口，加上设备的改进（原有将焊线高温熔化时加上氢气和氮气保护装置），并将做出来的成品与原来的产品进行性能和可靠性的比较，发现铜线球焊产品的主要电性能参数与原来金线产品的参数分布一致，可靠性能还能避免原有的金铝合金的脆化现象，推进了半导体封装产业和半导体器件的不断发展。关键词球焊；焊接工艺；封装；铜线球焊；可靠性AbstractIIAbstractIntwenty-firstCentury,thesemiconductorindustrywithdevelopment,ICandsemiconductordevicehasbeenwidelyusedinallwalksoflifetocarryout,fromthesatellitecommunications,militaryproducts,informationtechnologyindustryandordinaryhouseholdproducts,smallhouseholdelectricalappliances,accompaniedbythedevelopmentofthesemiconductorindustryanddevices,people'slifemoreandmoreconvenientandintelligent.Thesemiconductorindustryinthedevelopmentprocess,graduallyfinedivision,andsemiconductorpackagingindustryhasalsobecomeaoccupyalargerproportionofsemiconductorproductsintheindustry,howtoimprovetheefficiencyandperformance,semiconductorpackagingcostreduction,isplacedinfrontofallofoursemiconductorindustrypersonnel.AlongwiththeproductI/Oportnumber,bondingthesemiconductorpackagealsooccupyagreatproportion,adoptnewmaterialsinthebondingprocess,newtechnology,inordertoensuretheproductperformanceandreliability,reducethecostofthematerials,isanindustrytrend.Insteadoftheoriginalwithgoldasthewire,thewirematerialandtechnology,withthedevelopmentofequipmentandtechnology,hasbecomepossible,sincetherearelargedifferencesbetweengoldandcoppermaterialprices,manycompaniesandresearchershavedevotedgreatenergy,tryingvariousaspects,afteryearsofresearch,withtheexperienceaccumulation,JCETtechnologyhasmadeagreatbreakthroughinthisrespect.Thispapermainlystudiesthecopperwireinsteadofthetraditionalgoldwirematerial,thetechnologyandthenewprocessparameters,plusimprovementofequipmentperformanceandreliability,comparedtodooutofthefinishedproductandtheoriginalproduct,promotethecontinuousdevelopmentofsemiconductordeviceandsemiconductorpackagingindustry.Keywordswirebonding;bondingtechnology;packaging;copperballbonding,reliability;目录I目录摘要....................................................................................................................................IAbstract..................................................................................................................................II第一章绪论...........................................................................................................................11.1引言..........................................................................................................................11.2国内外研究现状、发展动态..................................................................................11.3本文的内容安排......................................................................................................3第二章半导体封装中引线键合的基本原理.......................................................................42.1引言..........................................................................................................................42.2半导体封装介绍......................................................................................................52.3键合工艺的特点..................................................................................................................52.4超声波球焊的原理..............................................................................................................62.5超声波球焊的过程..............................................................................................................72.5.1初始位置..........................................................................................................................82.5.2第一焊接检查..................................................................................................................92.5.3第一焊接..........................................................................................................................92.5.4拉线位置..........................................................................................................................92.5.5第二焊接瞄准..................................................................................................................92.5.6第二焊接检查位置..............................................