封装键合劈刀SPT型号及规格

∫∫2N9AuWireBondingChallengingSubstratesEnhancedStitchBondabilitysmallprecisiontoolsSPTRothLtdWerkstrasse28,CH-3250Lyss,SwitzerlandTel:++41323878080Fax:++41323878088E-Mail:[e-mail]c1330CleggStreet,Petaluma,CA94954,USATel:17077654545Fax:[phone]E-Mail:[e-mail]970ToaPayohNorth,#07-25/26,Singapore318992Tel:[phone]Fax:[phone]E-Mail:[e-mail](Phil.)Corp.35LibertadStreetMandaluyongCity1550PhilippinesTel:632533-7067Fax:[phone]E-Mail:[e-mail].A2Building,LiyuanEconomicDevelopmentZone,Wuxi,Jiangsu,P.R.China214072Tel:[phone]Fax:[phone]E-Mail:[e-mail].K.9thfloor,Shin-YokohamaU.UBuilding,2-5-2,Shin-Yokohama,Kohoku-ku,Yokohama-shi,Kanagawa,222-0033JapanTel:81-45-470-6288Fax:[phone]E-Mail:[e-mail]∫∫Asweareaggressivelypursuingnewtechnologiestoimprovetheperformanceofpackagesandproductminiaturization,thecurrentproblemsassociatedwithwirebondingremains.BondingissuesduetoNSOP,NSOL,padpeelinghaveconstantlybeenanightmareforwirebondengineers.Theseissuesbecamemoreseverewiththepressuretoreducethecostofproducts.AlthoughitiscommonlyknownthatthestitchbondreliabilitycanbeimprovedbyincreasingthetipdiameterandFA/ORoptimizationofthecapillaryprofile,thelimitationlieswithfine-pitchandultra-finepitchbonding.Therestrictionwiththebondpadpitchlimitstheflexibilityofusingalargertipdiameter.TheuseofasmallerFAhelpstoimprovethestitchbondabilitybutattheexpenseoflowerstitchpullreadingandpossibly,shortertoollife.Workingwithintheselimitations,anewcapillarydesignistodaydevelopedtoimprovethestitchbondability.SmallPrecisionTools(SPT)StitchIntegratorcapillaryhasbeendevelopedwiththeobjectivetoimprovethebondabilityofthestitchbondthroughbettercouplingeffectbetweenthebondingtoolandthewireduringbonding.Throughextensivestudiesandoptimizations,theStitchIntegratorcapillaryhasbeenderivedandhasproventoenhancethestitchbondabilityascomparedtononSIcapillarydesigninmanyfieldapplications.Features:•Improvedstitchintegrationwiththesubstratewithbetterultrasonicenergytransfer.•Enhancedcouplingeffectbetweenthecapillaryandthewirewithbetterstitchbondability.•HigherMTBAwithfewermachinedowntimeandhigherproductoutput.Today,theStitchIntegratorcapillaryhasbeentested,provenandqualifiedbymajorassemblyhousesandMNCsandusedinvolumeproductionforabroadrangeofbondingapplicationswithimprovedyieldperformanceandlessbonderstoppages.Dependingonthespecificbondingapplication,theStitchIntegratorcapillarycanbeusedtogetherwithanyexistingdesignfeature,suchastheDFX(forsmallballlargewirebonding),Infinity(forextendedtoollife),etc.Indeed,theStitchIntegratorcapillaryhasproventobeanewrevolutionforenhancedstitchbondability.SI33090435FZB34TP122N9AuWireChallengingSubstratesEnhancedStitchBondability∫∫Capillarycondition@600KbondsStitchbondbeforeandafterdestructivetestTheuseof2N9AlloyedAuwireisbecomingpopularforfine-pitchandultra-finepitchbonding.Thesewiresconsistof99%Aupuritywith1%Pdandareformulatedwithdopanttoenhancetheloopingcapabilityandballbondreliability.However,thesewiresaregenerallyharderandmorepronetowirebreakageandnon-stickingproblemduringstitchbondformationresultinginhigheryieldlossduringproduction,especiallyforleadeddevices.Thenatureoftheleadframedesignwithcertaindegreeofbouncingeffectduringbondingfurthercomplicatestherobustnessofthebondingprocess.Thechallengeistobeabletoimprovethestitchbondabilityfor2NAlloyedAuwire.TheStitchIntegratorcapillaryhelpstoimprovethebondingperformanceasshowninthefollowingapplication.BondingCondition:KeyNotes:●TheenhancedcouplingeffectbetweentheSIcapillaryandthealloyedwirehasproventoimprovethebondabilityofthestitchbondwithminimuminterruptiontothebonder.At600Kbonds,theload-upconditiononthecapillaryissatisfactorywithnoexcessiveload-upaccumulationatthetipofthecapillary.(Note:standardtoollifeissetat500Kbonds)Destructivetestperformedthroughwirepull@1/3wirelengthat1Kand600Kbon[e-mail]chbondadhesionissatisfactorywithnobondreliabilityissue.Samplesize=1500wires.Bonderstoppagesduetowireopenandshorttaildefectratewererecordedatlessthan1000ppmwhileregularbonderstoppageswasencounteredwithnon-SIcapillary.●●●BondingresponsesmonitoringforSIcapillary:3CapillarySI-33090-435F-ZB34TPBondPadPitch70umBonderASM339EagleWireType1mil2NAuwireDeviceLeadframebase,TQFP2N9AuWireBondingHowToOrderWirePullProcessCapabilityThepressuretoreducethecostofproductshasindirectlyinstilledcertainelementsofinconsistencytotheleadframeandsubstratematerials,whichdirectlyaffectthebondreliabilityofthestitchbonds.InconsistentleadframeandsubstratequalityoftenresultsinNSOL,shorttailorlowstitchpullreadingsduringwirebond.Mostofthetime,theproblemisonlyknownafterdieattachandduringwirebond.Thechallengeistobeabletoimprovethestitchbondabilityforthesetypesofleadframes/substrates.TheStitchIntegratorcapillaryhelp