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BondingCapillariesBondingRealityGlobalVision.WorldwideNetwork.LocalPresence.TheSPTRothGroup’sstrategycentersondevelopingtheCompanyintoanintegratedglobalcorporation.Overthelasttwentyyears,wehavebuiltonourglobalvisionandinvestedinbuildingmanufacturingandsalesfacilitiesstrategicallyaroundtheworldtobeclosetoourcustomers.Theworldwidenetworkcombinedwithexcellentlogisticfacilitiesensurespromptandfullcompliancewithcustomerrequirementsincludingship-to-stockorjust-in-timedeliveryprograms.Dedicatedandhighlyqualifiedsalesandserviceengineersandapplicationspecialistsensurethatcustomersreceiveprofessionalserviceandsupportatalltimesfromthedesignphasetostartingmassproduction.SPTisopenaroundtheworld,roundtheclock.1890ROTHGroupLyss,Switzerland1964AprovaLtd.Lyss,Switzerland1974SmallPrecisionToolsInc.California,USA1979SPTAsiaPteLtd.Singapore1982Moldinject,PerfectamouldAG.Lyss,Switzerland1991SmallPrecisionTools(Phils.)Inc.Manila,Philippines1995SmallPrecisionToolsCo.Ltd.Wuxi,China2001SPTJapanK.K.Yokohama,JapanPioneer.WorldLeader.SmallPrecisionTools-SPT-isthepioneerandleaderofsemiconductorbondingtoolsforoverthreedecades.SPTistheonlybondingtoolmanufacturerinternationallyestablishedwithmarketingandproductioncentresstrategicallypositionedallovertheglobe,tobeclosetoourcustomers.BondingCapillaryµBGATabToolFinePitchBondingWedgeProductTechnology.Excellence.Unsurpassed.SPTpositionsitselfasaprogressivehigh-technologytoolmanufacturerusingstate-of-theartprocesses.OurproductioncapabilitiesrangefromconventionaltoCNCmachiningincludingmilling,turning,surfacegrinding,honing,Electro-DischargeMachiningorEDM,jiggrindingandmore.OurexclusiveInjectionMoldingtechnologyofsmallcomplexpartsthroughSPT’sownin-houseformulationandsinteringassurescustomersofthehighestqualityinhighaluminaceramicandcarbidematerials.Ourequipmentandmanufacturingtechniquesarethemostadvancedintheultraprecisiontoolindustry.Wemakestandardandcustomdesignsforspecificcustomerrequirements.AlltoolsmeetthehighprecisiondimensionalandqualitystandardsmaintainedbySmallPrecisionTools.DieAttachColletsBushingsPrecisionPartsWaffleTabToolCIM&MIMPartsWatchGearCreativeSolutions.Research&Development.CustomerPartnership.Customerpartnershipisourbelief.AtSPT,welistentoourcustomers.Because,everycustomer’sneedsaredifferent,everysolutionisuniquelydesignedtosatisfythoseneedsinthemosteffectiveway.SPToffersawiderangeofproactivesupportandservicessuchasconsulting,design,analysis,trainingseminarsandbenchmarkingpartnerships.SPT’smaterialandprocesstechnologylaboratoriesinSwitzerlandandSingaporeoffertechnicalsupportandservicessuchasmaterialanalysis,processevaluationandcharacterizationandtooldesignoptimization.DevelopmentDesignResearchPartnershipQuality.Product&ServiceExcellence.SPTiscommittedtoqualityandcustomercare.OurcommitmenttoproductexcellenceandcontinuedsupportofourcustomersispartofthesustainingcultureofSPT.SPT’spartnershipphilosophyhasearnednumerousprestigiousawardsandrecognitionfromourcustomers.TechnologyEvaluationOptimizationPrecisionExcellenceTrainingIntroduction1TechnologyOverviewBasicsofBallBondingProcess2GoldBallWireBondingProcess3WireBondingCycleTechnicalGuideforBondingCapillary4CapillaryDesignRules7BallBond9Looping:In-LineGoldBallBonding/StaggeredGoldBallBonding11StitchBond14CapillaryMaterial15CapillaryFinish16CeramicInjectionMolding(CIM)WireBondingProcessOptimization18TypicalWireBondProcessOptimization19Reliability:DifferentModesofBallShearTest20TheBallShearReading(BSR)andBallShearStress(BSS)Factor21StitchBond-ReliabilityNonFinePitchSeries22UTSeries24CSASeries26HowToOrderFinePitchSeries27SBNSeries28HowToOrderUltra-FinePitchSeries30Ultra-finePitchInterconnectApplication60µmBondPadPitch33Ultra-finePitch60µmBondPadPitchSBN-DFXCapillarySeries34PopularCapillaryDesignsForVariousBondPadPitchApplicationsSpecificPackageApplication36CopperWireBonding-CUBSeries37CSP-QFNSeries38CSP-CSPSeries(forlowShortLoop/LowLoop)39CSP-BSBSeries(BallStitchOnBall)40CSP-SBBSeries(StudBallBump)41SpecialCapillaryTipConeOptions42HowToOrderAccessories43OtherAccessoriesForWireBondingProcessNotes44CapillaryWireBondingToolsRequirementChecklistAlldimensionsareinµm/inchunlessotherwisestated.Wereservetherighttomakechangestodesignorspecificationsatanytimewithoutnotice.CONTENTSSpecificPackageApplicationNonFinePitchReliabilityTechnicalGuideBasicsDesignRulesOptimizationFinePitchUltraFinePitchThenewgenerationofadvancedelectronicpackageshasdriventhedevelopmentofthewirebondingtechnologytoitsfulllimits.Innovativepackageminiaturizationapproacheshavebeenconcertedlydevelopedtodealwithitsphysicallimitation.Theendresultisacompact,andlighterdevicewithanincreasedI/O’s.Importantfactorssuchashigherreliabilityandpossiblyatalowercost,theneedforhigherintegration,higherspeed,higherpincountandmorefeatureswereallconsideredintheoverallpackagedesign.Thishasposedagreatdealofnewchallengesandinnovationinthewirebondinginterconnecttechnologytodevelopanewgenerationofwirebonders;processdevelopmentandcharacterization/optimizationofnewmaterials;andmanufacturingandfinishingp