SMT中英文专业术语教程

中英文专业术语教程更新日期：2011.09专业英语有所了解，能够看懂一些专业素材培训目的培训对象培训讲师学习重点培训课时印刷工艺英语插件印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序SMT：SurfaceMountTechnology/表面贴装技术：ProcessoftransferringsolderpasteontothepadsofaPCB,byforcingitthroughmatingaperturesonastencil,usingasqueegeeBoardloader/上板机：PCBstobetransportedtothescreenprinterusingconveyorsPrinter/印刷机：depositssolderpasteontopadsonthecircuitboard（Printedcircuitboard）/印制线路板Solderpaste/锡膏：Mixtureofsolderpowdersandfluxdepositedontopadsofcircuitboardonacontrolledvolume.Afterreflowprovideselectrical,mechanicalandthermalconnectionbetweencomponentandboard刮刀:Criticaltoolusedto“push”pastethroughthedesignatedopeningsStencil/钢网：VehiclebywhichthevolumeandplacementlocationofsolderpastedepositioniscontrolledFoil/钢片Frame/外框FlexMask/绷网Aperture/开孔印刷机要素InputConveyor/输入导轨Solventtank/容剂曹Monitor/监控器OutputConveyor/输出导轨Lighttower/指示灯Emergencystopbuttons/紧急制动开关视觉系统Clamps/夹子Boardsupport/支撑块OrsupportPins/支撑顶针stencil/钢网Squeegee/刮刀印刷参数AngleofAttack(45°or60°withstencil)/角度：TheanglemadebythefrontofsqueegeebladeinrelationtothestencilSnap-Off(ContactorNon-Contact)/印刷间隙：ThedistancefromthetopsurfaceofthePCBtothebottomsurfaceofthestencilSqueegeePressure/刮刀压力：Controlstheshearstress，ThetotalforcewithwhichthesqueegeeispushingontotheboardSqueegeeSpeed/刮刀速度：Controlstheshearrate，ThevelocityatwhichthesqueegeetraversesacrossthestencilSeparationSpeed/分离速度：ThevelocityatwhichthePCBreleasefromthestencil分离距离:ThedistancewhenthePCBreleasefromthestencilwhichkeeptheseparationspeedStencilAlignment/钢网对位:VisionBased:FullyautomaticwithfiducialsorSemi-automaticManualCleaningFrequency/清洗频率Cleaningmode/清洗模式:Dry/wet/vacuum印刷缺陷Misalignment/偏位BridgeorShort/短路Icicle/拉尖Scooping少锡Excessiveprint/多锡Pasteresidue/锡膏脏污Slump/坍塌元件贴装工艺英语插件印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序常用表面贴装设备BoardAlignment板对位Robot/机械臂ComponentFeeding/供料器ComponentAlignment/器件对位Frame/外框PlacementHead/贴装头PCBTransport/PCB传输用户界面PlacementrobotComponentfeeding/供料器料车feeder/飞达Toolbitornozzle吸嘴深圳市共进电子有限公司Boardalignment深圳市共进电子有限公司Theotherprofessionalenglishusedinplacementprocess贴装工艺其他专业英语Loadinglist/站位表Offset/偏差Pick/吸取Place/贴装PlacementAccuracy/贴装精度LinearMotor/线性马达BallScrew/丝杆Image/影像回流工艺英语插件印刷（Printing）：目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上贴片（Mount）：目的：将贴片元件准确的贴装到PCB焊盘上回流焊（Reflow）：目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接AOI（自动光学检测）：目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序焊接1.Processofjoiningmetallicsurfaces(金属表面连接)throughthemassheating(加热)ofsolderorsolderpaste2.Createsamechanical(机械的)andelectrical(电的)connectionbetweenthecomponentsandPCB3.Solderalloymetal(焊料合金)ismelted(熔化)toformtheconnection4.Liquidsolderattachestothebasemetalsbyformingintermetalliccompounds(IMC:内部合金),throughtheprocessofwetting(润湿)表面张力:Surfacetensionisamolecularforce(分子作用力)existinginthesurfacefilmofallliquidsWetting/润湿:Theabilityofthemoltensolderalloy(熔融焊锡合金)toadheretothesurfacesbeingsolderedCapillaryAction/毛细作用：Interactionbetweenaliquid(solderorflux)andasmallopeningorsurfaceinasolid(Pad,componentLead)WettingAngle/润湿角IMC（Intermetalliccompounds）/内部合金层：WhenthemoltensolderalloymakescontactwiththePCBfinishorcomponentleadfinish,asmallamountofSninthesoldercombineswiththefinishmetalorthebasecoppertoformametallurgicalcompound典型的热风回流炉(a)PCBAConveyor/链条HeatingBlowers/热风器CoolingFan/冷却风扇Reflowoven/回流炉Lower/下温区Upper/上温区典型回流曲线Thereflowofsolderisachievedinafurnacewithpredeterminedthermalprofiles.Thedifferentstagesare:炉子里的回流焊接用预先设定的温度曲线来达到.温度曲线的阶段分为:1.PreheatZone/预热区2.Soak(dryout)Zone/衡温区3.ReflowZone/回流区4.Cooling/冷却区测温仪Thermalcouplewi