Camera-Module封装方式

CameraModule封装方式PreparedBy：KimJin内容大纲常见封装方式1.PLCC/CLCC（Plastic/CeramicLeadedChipCarrier）2.CSP（Chip-ScalePackage）3.COB（ChipOnBoard）4.COF（ChipOnFpcb）5.FLIPCHIP（芯片倒装）CameraModule常见封装方式SingleChipSolution(ISPembeddedtype)1)ModuleassemblyusingwithprepackagedplasticorceramicunitCONNECTORLENSHOLDERFPC(CIS+ISP)CHIPPCBPrepackagedCeramicunitLENSASS’YIRCUTFILTERPASSIVESTIFFENERCameraModule常见封装方式SingleChipSolution(ISPembeddedtype)2)ModuleassemblyusingwithprepackagedGlassCSPunitCONNECTORLENSHOLDERFPCPrepackagedGlassCSPunitPASSIVESTIFFENERLENSASS’YIRCUTFILTERSTIFFENERCameraModule常见封装方式SingleChipSolution(ISPembeddedtype)3)ModuleassemblyusingwithChipOnBoard(COB)CONNECTORLENSHOLDERFPCWIREPASSIVEDVC(CIS+ISP)CHIPLENSASS’YPCBIRCUTFILTERCameraModule常见封装方式ACFPassiveIRFilterCMOSCONNECTORSingleChipSolution(ISPembeddedtype)4)ModuleassemblyusingwithChipOnFPC（COF）CameraModule常见封装方式SingleChipSolution(ISPembeddedtype)5)Moduleassemblyusingwithflip-chipbondingtechnologyCONNECTORLENSHOLDERFPCPASSIVEDVCLENSASS’YSUBSTRATEIRCUTFILTERORGLASSCISCHIPACFCameraModule常见封装方式SingleChipSolution(ISPembeddedtype)4)ModuleassemblyusingwithchipstackingmethodCONNECTORLENSHOLDERFPCWIREPASSIVEDVCDSPCHIPLENSASS’YPCBIRCUTFILTERCISCHIPCameraModule常见封装方式TwoChipSolution(Imagesensor&DSP)2)ModuleassemblyusingwithDSPembeddedPCBCONNECTORLENSHOLDERFPCWIREPASSIVEDVCDSPCHIPLENSASS’YPCBIRCUTFILTERCISCHIPCameraModule常见封装方式TwoChipSolution(Imagesensor&DSP)3)ModuleassemblyusingwithDSPonthebacksideCONNECTORLENSHOLDERFPCWIREPASSIVEDVCDSPCHIPLENSASS’YPCBIRCUTFILTERCISCHIPCameraModule常见封装方式CameraModuleDesignProcessStructureforsamplebuildModuleDimensionChipInformationA.VideoFormatB.PixelSizeC.ImageAreaSizeD.ImageAreaPosition(X,Y)E.ChipSizeF.WaferThicknessG.ChipshiftLensdesignLensSpecA.LensconstructionB.AngleofviewC.FocallengthD.RelativeapertureE.RelativeilluminationF.BackfocallengthG.EtcLensass’ydesignSubstrateDimensionA.PCBsize&thicknessB.Bottommoldsize&thicknessC.PCBpinholesize&positionHolderdesignIRfiltersizeFPCinformationA.Modulemountingmethod(DirectmainboardinsertorFPC)B.FPCbondinglandlayoutC.ZIFconnectormodelD.FPClengthFPCdesignPackinginformationA.TraydimensionB.TrayarrayTraydesignBoarddesign