半导体工艺介绍PACKAGE

12



                



 



Puman3



    WaferManufacturing
FrontEnd WaferTestBackEndCMP4



 (QFP



)WaferbackgrindingWafermountWafersaw&cleanDieattachEpoxycurePlasmacleanWirebondMoldingMarkingPostmoldcureDeflash&TrimSolderplatingForming&singulationFVIPacking5








:BT



EpoxyPTFEPolyimidecompoundUBMPSVAPPESoldermaskP.R…
95Pb/5Sn37Pb/63Sn(,183)NoLeadAllySn3.9/Ag0.6/Cu5.5,235Low- Ally…
:AubondAllybond…
LeadFrame:
Substrate:(tape)HiTCETMBCBTM!!!!…
TAPE:BlueTapeUVTape…
HeatSink:####6




Polishingmachine&CMP
UVtapeattachmachine
Dicingmachine
UVirradiationmachine
Taperemovermachine
Pick&Placemachine
Packagemachine

    (F/T):trim&form
    7



2000~nowMultichipmodelMCM80



Dualin-linepackageDIP2000~nowWaferlevelCSPWLCSP1999-2001Flip-chipFc1998~2000ChipscalepackageCSP1996~1998ChiponboardCOB1995~1997TapeAutomatedbondingTAB1995~1997QuadFlatPackageQFP80



SmalloutlinepackageSOP8
!
!
!
!IC



$%$%$%$%IC,&'&'&'&'chip((((system)*+,-./0)*+,-./0)*+,-./0)*+,-./0.12121212IC3453453453456789:;=?6789:;=?6789:;=?6789:;=?IC@ABC45DEFG@ABC45DEFG@ABC45DEFG@ABC45DEFGHHHHIJIJIJIJKKKKLMNLMNLMNLMNO89EP=QRSTO89EP=QRSTO89EP=QRSTO89EP=QRSTUUUUVEWXVEWXVEWXVEWXchipsizeBCBCBCBCYYYYIC3Z[3Z[3Z[3Z[\\\\UUUU]]]]chip^_`abcdef^_`abcdef^_`abcdef^_`abcdefUUUUVEgVEgVEgVEgchiphijefkkhijefkkhijefkkhijefkkHHHHIC
 
 
 
 DIPlmnolmnolmnolmnolpqrmslpqrmslpqrmslpqrmsttttrusvwnqxyqzv{rusvwnqxyqzv{rusvwnqxyqzv{rusvwnqxyqzv{=|}~€‚ƒ„@A…N=|}~€‚ƒ„@A…N=|}~€‚ƒ„@A…N=|}~€‚ƒ„@A…Nd†d†d†d†UUUU‡ˆ‰jŠT‹…Nd‡ˆ‰jŠT‹…Nd‡ˆ‰jŠT‹…Nd‡ˆ‰jŠT‹…NdoooomŒ{mŒ{mŒ{mŒ{}~Ž@Aƒ„}~Ž@Aƒ„}~Ž@Aƒ„}~Ž@Aƒ„UUUUhihihihij‘’“”•j‘’“”•j‘’“”•j‘’“”•–——–——–——–——˜˜˜˜HHHH}~}~}~}~lmnlmnlmnlmn@A@A@A@AŒn™Œn™Œn™Œn™†š›hi†š›hi†š›hi†š›hiUUUUœE‚žœE‚žœE‚žœE‚žlmnlmnlmnlmnŸ †‚¡¢Ÿ †‚¡¢Ÿ †‚¡¢Ÿ †‚¡¢HHHH£¤£¤£¤£¤UUUU¥¦2§‚¨©ª«¬j(­¥¦2§‚¨©ª«¬j(­¥¦2§‚¨©ª«¬j(­¥¦2§‚¨©ª«¬j(­®›€Nd¯¢°±«§®›€Nd¯¢°±«§®›€Nd¯¢°±«§®›€Nd¯¢°±«§HHHHlmnlmnlmnlmn@A†¨²†‚¡¢‚³´µ@A†¨²†‚¡¢‚³´µ@A†¨²†‚¡¢‚³´µ@A†¨²†‚¡¢‚³´µ¶·T¸¶·T¸¶·T¸¶·T¸UUUU2¹º»hi2¹º»hi2¹º»hi2¹º»hiHHHH9
DIP    –¼–¼–¼–¼½¨½¨½¨½¨nŒ¾onŒ¾onŒ¾onŒ¾o¿ÀNd¯¿ÀNd¯¿ÀNd¯¿ÀNd¯{{{{¢Á¬«§¢Á¬«§¢Á¬«§¢Á¬«§UUUUÂÃÄÅÂÃÄÅÂÃÄÅÂÃÄÅHHHHƼƼƼƼ†0ÇÈ@A0Ç)*IÉʈ†0ÇÈ@A0Ç)*IÉʈ†0ÇÈ@A0Ç)*IÉʈ†0ÇÈ@A0Ç)*IÉʈUUUUËÌǥʈËÌǥʈËÌǥʈËÌǥʈHHHH
DIPÍÎÏÐwÑÒuxysvÓÓÍÎÏÐwÑÒuxysvÓÓÍÎÏÐwÑÒuxysvÓÓÍÎÏÐwÑÒuxysvÓÓKKKK–ÔÔÕur–ÔÔÕur–ÔÔÕur–ÔÔÕurnÖ×wwÑÒuxysvÓÓØwÙԗnÖ×wwÑÒuxysvÓÓØwÙԗnÖ×wwÑÒuxysvÓÓØwÙԗnÖ×wwÑÒuxysvÓÓØwÙԗÕurÕurÕurÕurÚvqÏwÛuÏÑÒØw–ܼ–ÕurÚvqÏwÛuÏÑÒØw–ܼ–ÕurÚvqÏwÛuÏÑÒØw–ܼ–ÕurÚvqÏwÛuÏÑÒØw–ܼ–ÕurÚvqÏwÝuÑxÒØw–——ÕurÚvqÏwÝuÑxÒØw–——ÕurÚvqÏwÝuÑxÒØw–——ÕurÚvqÏwÝuÑxÒØw–——Õur
DIPPDIPPlasticDIPCDIPCeramicDIPSPDIPShrinkplasticDIP10



SOP/SOJ1980ÞßÞßÞßÞßUUUUSMTSurfaceMountingTechnologyBC4àáBC4àáBC4àáBC4àáUUUU¨¨¨¨SMTâ8ƒãŠâ8ƒãŠâ8ƒãŠâ8ƒãŠUUUUSOPSmallOut-LinePackage/SOJSmallOut-LineJ-Leadpackageä)åæä)åæä)åæä)åæUUUUhi¨hi¨hi¨hi¨ICšçšçšçšçHHHH
SOP/SOJ   
      ! ##$%&'   ($  #) *   +,*+,-.,/012,,  *3  / +   11
SOP(    )ÍÎÏÐwÑÒuxysvÓÓØÜè閗êÕurÍÎÏÐwÑÒuxysvÓÓØÜè閗êÕurÍÎÏÐwÑÒuxysvÓÓØÜè閗êÕurÍÎÏÐwÑÒuxysvÓÓØÜè閗êÕurnÖ×wwÑÒuxysvÓÓؖ—ëé–nÖ×wwÑÒuxysvÓÓؖ—ëé–nÖ×wwÑÒuxysvÓÓؖ—ëé–nÖ×wwÑÒuxysvÓÓؖ—ë閖ÜÕur–ÜÕur–ÜÕur–ÜÕurÚvqÏwÛuÏÑÒØw–êwÕurÚvqÏwÛuÏÑÒØw–êwÕurÚvqÏwÛuÏÑÒØw–êwÕurÚvqÏwÛuÏÑÒØw–êwÕurÚvqÏwÝuÑxÒØwԗwÕurÚvqÏwÝuÑxÒØwԗwÕurÚvqÏwÝuÑxÒØwԗwÕurÚvqÏwÝuÑxÒØwԗwÕurSOJ(SmallOut-LineJ-Leadpackage)ÍÎÏÐwÑÒuxysvÓÓؖ——wÕÍÎÏÐwÑÒuxysvÓÓؖ——wÕÍÎÏÐwÑÒuxysvÓÓؖ——wÕÍÎÏÐwÑÒuxysvÓÓؖ——wÕururururnÖ×wwÑÒuxysvÓÓؖٗé–nÖ×wwÑÒuxysvÓÓؖٗé–nÖ×wwÑÒuxysvÓÓؖٗé–nÖ×wwÑÒuxysvÓÓؖٗé–Ô—ÕurԗÕurԗÕurԗÕurÚvqÏwÛuÏÑÒØw–èéƗwÕuÚvqÏwÛuÏÑÒØw–èéƗwÕuÚvqÏwÛuÏÑÒØw–èéƗwÕuÚvqÏwÛuÏÑÒØw–èéƗwÕurrrrÚvqÏwÝuÑxÒ