一、基本信息:材料,层数,板厚,铜厚,表面处理,尺寸。Material,layer,boardthickness,copperweight,surfacefinish,dimension.1、material:铝基板Aluminum,贝格斯Bergquist,罗杰斯Rogers,阿龙Arlon,聚酰亚胺Polyamide,软板flexibleboard,硬板rigidboard.2、层排序:layerorder/layersequence.内层:innerlayer;外层:outerlayer3、基铜copperfoilbeforeplate;完成铜厚:finishcopper.4、Surfacefinish:沉金immersiongold/ENIG,沉银immersionsilver,沉锡immersionTin,有铅喷锡HASL,无铅喷锡LFHASL,镀厚金hardgoldplating,金手指goldfinger.(金手指斜边goldfingerchamfer,斜边倒角chamferangle,斜边深度chamferdepth)5、Dimension:单只尺寸singlepartsize/unitsize,拼板尺寸panelsize/arraysize.6、加工方式:数控铣routing;V-cut/score;锣槽routpath;连接位tabs;V割余厚V-cutwebthickness;V割余厚公差webtolerance.最小孔铜:minimumcopperinplatedhole最大maximum7、阻焊:soldermask;字符:silkscreen哑光:matte;光亮:gloss;半光亮:semi-gloss8、过孔方式:viaholestreatment;BGA区域过孔塞孔:ViaspluggedinBGAarea.过孔覆盖:viastobetented/covered过孔覆盖不塞:viastobetented/covered,notplugged.顶层或底层塞孔:plugviastopside/bottomside9、标记:markings(本公司标记ourcompanylogo,周期datecode)标记加外包装及标签上:“BagandTag”创建顶层/底层字符仅供添加标记:createdGTO/GBOforaddmarkingsonly.蚀刻标记:etchingmarkings10、Holes:工具孔toolinghole,光学点fiducial,定位孔pinholes,器件孔apparatushole,压接孔pressfithole,盘中孔viainpad,半孔halfhole/castellatedhole,沉孔countersinkhole,喇叭孔barrelhole11、槽slot(圆槽roundslot,方形槽squareslot,长形槽oblongslot)二、列句扩展:1、请问是否可以用**(厚度)的芯板或PP代替**的芯板或PP?Plshelptoconfirmifwecanuse~core/prepreginsteadof~core/prepreg?2、请问层排序是否为**?Plshelptoconfirmifthelayerorderis**?3、为了满足阻抗要求,层压结构稍做了调整。请问层压结构是否可按已下/以上制作?Inordertomeetyourimpedancerequirement,wechangedthelayerstackupalittle.Plshelptoconfirmifthelayerstackupinbelow/abovepictureisOKornot?4、为了平衡板翘,请确认是否可以在工艺边上铺铜点/抢电拍?Inordertoreducetheboardwarpandtwist.Canweadddummycopperonthepanelframe?5、文件中有部分字符上焊盘,请问是否可将上焊盘的字符叠掉?There’sseveraltextsoverpad,plshelptoconfirmifwecantrimmedoffthetextsoverpads?6、顶层金属化孔无焊环属客户设计。ThePTHwillnothaveannularringontopsidepercustomerdesign。7、蓝油板V-cut处需叠铜**mil,请确认是否OK?Forbluesoldermask,weneedtotrimoff**milcopperofV-scorearea,plshelptoconfirm.8、请问是否可按我司常规在工艺边上添加定位孔(4*2.0mm)和光学点(4*1.0mm)?Plshelptoconfirmifwecanadd4*2.0mmtoolingholesand4*1.0mmfiducialsonthepanelframebyourstandard?9、上图贵司的孔径公差超我司加工能力范围,请确认是否可按我司常规PTH+/-3mil,NPTH+/-2mil?Theholetoleranceinabovepictureisoutoffourcontrol,plshelptoconfirmifwecantakethetoleranceof+/-3milforPTHand+/-2milforNPTH?10、请确认上图/下图中的阻焊开窗是否正常?Plshelptoconfirmwhetherthesoldermaskopeninginabove/belowpictureisnormalornot?PCB常用英语语句1、Plsconfirmifwecandeletethelegendsoverpad?请确认是否可以删除焊盘上的字符。2、Referringtotheattachedpicture.根据所提供的图片3、PlsconfirmifthepointholeisPTHorNPTH?请确认标示的孔是金属化孔还是非金属化孔。4、Theannularringofthe3.2mmdia.NPTHis6MIL,Plshelptoconfirmifwecandeletethering?Ifnot,canweenlargeitto12mil?直径为3.2MM的非金属化孔的孔环是6MIL,请确认是否可以删除。如果不能删除,建议将它加大到12MIL。5、Thetoleranceof3.2mmdia.NPTHis+/-0.03mm,it’soutoffourcontrol.Plshelptoconfirmifwecantakeitstoleranceas+/-0.05mm?直径为3.2mm的非金属化孔的公差为+/-0.03mm,超我司工艺制作范围,建议按照+/-0.05mm制作。6、There’stotal4holeswhichmarkedM149inGerberfile,butindrillfilethere’sonly3.Plsconfirmwhichoneweshouldfollow?GERBER文件中,标记为M149的孔数为4个,但是在钻孔文件中却是3个,请确认我们以哪个文件制作。7、Thecopperwillbeexposedwhenrouting.Canwetrim10miloffboardtoavoidcopperexposing?外形时将会露铜。为了避免露铜我们建议叠边10MIL8、PlshelptoconfirmiftheworkingfileisOKornot?请确认工作稿。9、TheNPTHistooneartothepad,theclearanceisonly0.2mil.非金属化孔离PAD太近,仅仅0.2MIL。10、Astheroutingtolerance(+0/-0.15mm)yougivenisoutoffourcontrol,Plshelptoconfirmthatroutingtolerancetobe+/-0.15mm.外形公差0~0.15mm,建议按照+/-0.15mm制作。11、Couldyouhelptooffernewgerberfileforus?可否提供新的GERBER文件?12、There’snotoolingholesandfiducialsonthebreakaway.Plsconfirmifwecanaddtoolingholesandfiducialsonthepanelframe?Ifyes,plshelptonotethepositionoritspositiondecideditbymanufacturer.工艺边上没有定位孔和光学点,请确认工艺边上是否需要添加定位孔和光学点。如果需要,请告诉我们具体的位置或者我们自己添加。13、Couldyouhelptoofferthelayerorderforus?GERBER文件中没有提供层排序,请提供层排序。14、The3.2MMdiaholewithoutpad.plsconfirmifitisPTHorNPTH?直径为3.2MM的孔上无焊盘,请确认其是金属化孔还是非金属化孔。15、Plsconfirmiftheboardshouldbeshippedbyindividuallyorpanel(4up)?请确认PCB是4PCS/PNL还是分开出货。16、PlsconfirmwhichlayershouldweaddtheULandDateCode?请确认UL标记、周期应加在哪一层。17、IntheGerberfile,youmarkedtheplaceforULandDateCode.Buttheredoesn’thaveenoughspacetoaddthem.PlsconfirmifwecanaddULandDateCodeonthepanelframe?文件中要求添加UL标记和周期在指定的地方,但是板中无法添加标记,请确认我们是否可以添加在工艺边上。18、There’s2holesshowindrillmap,buttheyarenotexistingintheGerberfile.单只的分孔图中有两个孔,但此两个孔GERBER文件中并没有存在。19、PlshelptoconfirmwhethertheULmarkingshouldbeaddedinGTLorGBL?UL标记要求添加在顶层线路,但GERBER文件中却要求添加在L2。20、Thepadsontopandbottomlayerareround,butitssoldermaskopeningissquare.Canwemodifythesquaresoldermaskopeningtoround?顶底层焊盘为圆形,阻焊开窗为方形,我们建议将方形开窗更改成圆形。21、Wecan’tmeetit.我们不能达到。22、PlsconfirmifsurfacefinishisHASLorimmersionTin?请确认表面涂层是喷锡还是沉锡。23、Plshelptoconfirmwhethertheboardsizeis209*100mmor210*101mm?请确认外形尺寸是209*100mm还是210*101mm.24、Inthegerberfile,theviasinBGAareahasbeensoldermaskopening.Itwillcauseshortcircuitswhenwelding.GERBER文件中BGA区域的过孔是开窗的,在焊接时可能会引起短路。