01绿色供应链之要求及因应

1••令••理•理••理例說2PBB/PBDE6+3EIA700•料•CRT量27•路了•SMD•••路•金•料PVC2004年315•量•兩••六4(EPR)™(ExtendedProducerResponsibility,¾(post-consumerstage)¾聯EPR™“”(distancecommunication)1.2.3.(IPP)(益)()()(綠)(綠)IPP立略5律利(65)蘭丹令(94/62/EC)紐16金聯(PBB)類PBDE金(六)六6律聯(PCB)(1)律(PCN)(1)律(CP)度10-13量50wt%律,(藍/TC095)(/)(1)律勞理利•OECD2001年1立2004年•TCO’99TCO’95了金TCO’01行•WEEE利•RoHS更六(CFCsPCBsPVC)7TCO’01•TCO12ISO14001EMAS•–(行)–()–(PBB,polybrominatedbiphenyl,PBDE,10零)–(10零)–利TCO’01•度–2ppm–5ppm–10ppm–0.05%8DirectiveonWasteElectricalandElectronicEquipment(WEEE)(recovery)(recycling)降(ExtendedProducerResponsibility)數量RoHSDirective*WEEEDirective*---*2006-----(polybrominatedbiphenylsPBB)-(polybrominateddiphenylethersPBDE)9(JGPSSI…)EEEGuideforStandardizationofMaterialDeclaration2003.1.92003.7.2212004.6.3210•––––(A)––參(B,料)•零料說–說–零例–Excel•–更Excel111213141516••量•金量•••不量••(類類)••不量律•不不量料•量理17•量理理論行•量•零量不零料理•金金•金例不•金対•金量金量行18例1(Sb2O3)100mg量數0.835量100mg0.83583.5mgÆ84mg(留2數)例2了(S3.5Ag)100mg量不量100mgAg量3.5mg•不留不•量•了參()來說量留留理19•拉滑•料•滑金類金•輪類•料20()(HPSony…)EEE21•理•綠來_鍊省…•切_CER•/料來Nokia(2002)(Nokia)•諾(NokiaSupplierRequirements)/•立了Supplieraudits度來22說理(EMS)立理來量例ISO14001(DfE)行量例(checklist)力料料(Rawmaterialcontent)錄料/零Nokia料/(Legalcompliance)力力行/理/行狀(subcontractors)若理/()料來Nokia(2002)(NokiaSubstanceList)•(“RestrictedList)類(banned)(restricted)(零料())•(“MonitoredList”)Nokia類行度行勵更/23(HP)•不勞益•力行•更•立/度•行/行/HP’sSupplierCodeofConduct24(HP)•不勞益•力行•更•立/度•行/行/理勞勞率/露料量/利利HP行(suppliercodeofconduct)HP(GSE)立立行量ODSHP行(pdffile)(pdffile)(pdffile)勞(pdffile)()年料來HP•理•–()–(量不50ppm)––PBB,PBBE,PBBO–PBC,PBT零料•–量不5ppm–量不10ppmHP•–ODS–金(6量100ppm)•–HP列利26(Panasonic)•綠•綠(2002年12)(1)(說綠)(說/)(2)(說料)()(料)(3)領六(說)料理行行力行立理量利念說行料&料料率料不不料不料(料)料()料料()不料來(1)•綠––龍六–•24Eco-symbol量–不NEC(PCB,Polyvinylnaphthalene,asbestos,PBBE,PBB)–不列(CFCs,Halon,1,1,1-trichloroethane,CCl4,HBFC)NEC(2)•不PVC•不•量–LCA•1994年•1998年LCA益念•2001年Eco-Product•2001年3LCA61類–零料•1997年10零料2000年8立料•金(silicone)28NEC(3)–綠vitrofactoryECO(VF-ECO),LCA零量量量例(Sony)•力SS-00259理理力零量行理若量•力(OEM)(assemblies)(attachments)零料零(零料)•理理行理•說29•SonySony()SonySony•料(零…)(contained)(impurity)不(1)(2)(Cd)••(料料料…)•理••Level3料(…)•2005-01-01Level1Level2Level3•5ppm30(Pb)••路料料…••露(2004.04.01)•(1000ppm-85wt%)••金Level3金•Level1•••料•金2005-01-01Level1Level2Level3金類量(wt%)0.350.441000ppm•100ppm(Hg)••料料料••(10ppm)(20ppm)•••Level3•(5ppm10ppm)•(10ppm20ppm)••(5ppm)•(10ppm)•2005-01-01Level1Level2Level331•••2005-01-01Level1Level2(類不金金)Level1•Polychlorinatedbiphenyls(PCB)•Polychlorinatednaphthalenes(PCN)•Mirex(Perchlordecone)•PolybrominatedBiphenyls(PBB)•Organictincompounds—•Asbestos—•Polybrominateddephenylethers(PBDE)—2002年12Level232(Formaldehyde)••2005-01-01Level1Level2()•路()•Lelevel1Level1Level3(蠟列C10-13量50wt%)33•()•類料•不類Level1Level3PVCPVC•()•連•PVC••()•Level22005-01-01Level2Level334SOP理綠理(IQC)綠理()綠理/理(更)料理立Lab.(EDXRF)()立◊綠◊理◊綠理◊不◊理RoHSN理綠/零/料料練練Y12金3理456綠_12理3綠行4理()5行6理7()89理35?•Howtotakethedecision?=exampleofanERAdecisiontreeapproach()•Someparameterstoconsider:•Relationwithyoursuppliers(newsupplier,doubts,…)•UseofnewcomponentsormaterialswhichcanpresentariskFromERA36/綠理/理錄/•料•料•度•料/理RoHS?•Obtainconformitydeclarationsfromyoursuppliers•Thereisnostandardformat•ThedeclarationsmustincludeatleastanexplicitsentencewhichsaysthatthecomponentcanbeusedfortheproductionofRoHScompliantproducts.•Acertification/analysisbyanindependentbodycanbeusefulforcriticalcases37GSC•不理力行•料()•SOP理•GSC•/()•綠理()•(理)•()•(度)•零更(/)38RoHSRoHS1量不5/2量不10583量4錄量5量6金量0.35%量0.4%金量4%7料料金量85%料2010年路理路料例876/769/EEC令91/338/EEC令9冷六1072DecaBDE料路路理令392005Leadexemptions:•Lead-basedalloyscontainingmorethan85%leade.g.Sn/Pbsoldersetc.Timelimit(until2010)deletedforleadsoldersinservers,storage&storagearraysystems.(Allexemptionswillbere-assessedin2010,aspartoftheirreviewevery4yearsafterimplementation.)•Compliant-pinVHDM(VeryHighDensityMedium)connectorsystems.•Useasacoatingmaterialforathermalconductionmodulec-ring.•Opticalandfilterglass.•Soldersconsistingofmorethantwoelementsfortheconnectionbetweenthepinsandthepackageofmicroprocessorswithaleadcontentofmorethan80%andlessthan85%byweight.•SolderstocompleteaviableelectricalconnectionbetweensemiconductordieandcarrierwithinintegratedcircuitFlipChippackages.Cadmiumexemptions:•Cadmiumanditscompoundsinelectricalcontacts.e.g.cadmiumoxideinsilver/cadmiumoxidecontacts(AgCdO).•Opticalandfilterglass.•Exemptionpossibleformaterialsandcomponentsif:–不行–•RoHSEUcommission利見見TAC•22利4020051.Leadintinwhiskerresistantcoatingsforfinepitch(0.65mm)applications(e.g.connectors).2.Leadboundinglass,crystalglass,leadcrystalorfullleadcrystalingeneral.3.Chromium(VI)andcadmiumascolouringagents(upto2%content)inglass,crystalglass,leadcrystalorfullleadcrystalfordecorativeand/orfunctionaluse.4.Solderscontainingleadand/orcadmiumforspecificapplications.5.Hexavalentchromiumanti-corr