Unit1ElectronicDevicesLesson1VLSITechnology《电子信息工程专业英语教程》任治刚主编电子工业出版社《电子信息工程专业英语教程》2Lesson1VLSITechnology•Backgrounds•Texttour•Languageinuse–Vocabulary–Structure–Reading/writingtechniques2019/12/21《电子信息工程专业英语教程》3•Terminology–Transistorvs.vacuumtube–Conductivity&semiconductor–Miniaturization,IC,LSI,VLSI•TimelineofElectronicTechnologyEvolution•CompanyInformation–BellLaboratories–TexasInstruments–IntelCorporationBackgrounds2019/12/21《电子信息工程专业英语教程》4Terminology2019/12/21《电子信息工程专业英语教程》5•真空管是一种内部气体全部或部分抽空的电子管,从而使电子在不受或少受气体分子的干扰下运动。Transistorvs.vacuumtube•Thevacuumtubeisanelectrontubefromwhichallormostofthegashasbeenremoved,permittingelectronstomovewithnoorlowinteractionwithanyremaininggasmolecules.2019/12/21《电子信息工程专业英语教程》6•Atransistorisadevicethatconductsavariableamountofelectricitythroughit,dependingonhowmuchelectricityisinputtoit.Inotherwords,itisadigitalswitch.However,unlikethevacuumtube,itissolidstate.•晶体管是一种依据输入电量大小而传导可变电量的器件。换言之,晶体管是一种数字开关。然而,和真空管不同,晶体管是“固态”的。Transistorvs.vacuumtube2019/12/21《电子信息工程专业英语教程》7•Solidstatemeansthatitdoesn'tchangeitsphysicalformasitswitches.Therearenomovingpartsinatransistor.•“固态”的意思是当晶体管切换状态时,它的物理形式不发生变化。晶体管中不存在可以移动的部分。Transistorvs.vacuumtube2019/12/21《电子信息工程专业英语教程》8•Comparedtothevacuumtube,transistorsweremuchsmaller,faster,andcheapertomanufacture.Theywerealsofarmorereliableandusedmuchlesspower.Transistorvs.vacuumtube•和真空管相比,晶体管尺寸小得多,速度快得多,生产成本低得多,性能更加可靠,功耗也少得多。2019/12/21《电子信息工程专业英语教程》9•Whilemostmaterialseitherinsulatefromelectricalflow(air,glass,wood)orconductelectricityreadily(metals,water),therearesomethatonlyconductelectricityasmallamount,oronlyundercertainconditions.Thesearecalledsemiconductors.•大多数材料要么对电流绝缘(如空气、玻璃、木头),要么很容易传导电流(如金属、水溶液),但也有一些材料只传导少量电流,或者只在特定条件下传导电流。这些材料被称作半导体。Conductivity&semiconductor2019/12/21《电子信息工程专业英语教程》10•Themostcommonlyusedsemiconductorisofcoursesilicon.•最常用的半导体材料当然是硅了。Conductivity&semiconductor2019/12/21《电子信息工程专业英语教程》11•Miniaturizationmeansthereductioninsizeofcomponentsandcircuitsforincreasingpackagedensityandreducingpowerdissipationandsignalpropagationdelays.•微型化是指减少元件和电路的几何尺寸,从而增加封装密度、降低功耗、减少信号传播延迟。Miniaturization,IC,LSI,VLSI2019/12/21《电子信息工程专业英语教程》12•Theintegratedcircuitisagroupoftransistorsmanufacturedfromasinglepieceofmaterialandconnectedtogetherinternally,withoutextrawiring.IntegratedcircuitsarealsocalledICsorchips.•集成电路就是一组用单片材料制造的,内部互联的(无外部连线)晶体管。集成电路也叫IC或者芯片。Miniaturization,IC,LSI,VLSI2019/12/21《电子信息工程专业英语教程》13•LSI:Large-scaleIntegration大规模集成(电路)•Large-scaleintegration(LSI)cametorefertothecreationofintegratedcircuitsthathadpreviouslybeenmadefrommultiplediscretecomponents.•VLSI:VeryLarge-scaleIntegration超大规模集成(电路)•VLSIcircuitscancontainmillionsoftransistors.Miniaturization,IC,LSI,VLSI2019/12/21《电子信息工程专业英语教程》14TimelineofElectronicTechnologyEvolution2019/12/21《电子信息工程专业英语教程》15•1900's:TheVacuumTube.•1905:FirstelectronicdiodevacuumtubeisbuiltbyEnglishphysicistJ.AmbroseFleming,allowingthechangeofalternatingcurrentintoadirectone-waysignal.•1906:FirstelectronictriodevacuumtubeisbuiltbyAmericanelectricalengineerLeeDeForest,allowingsignalstobecontrolledandamplified.Technologyofelectronicsisborn.•Late1940's:TheTransistor.•1947:Thepoint-contactbipolartransistorisinventedbyBellLab'sBardeen,Shockley,andBrattain.•1951:Junctionfield-effecttransistor(JFET)isinvented.•1952:Single-crystalsiliconisfabricated.•1954:Oxidemaskingprocessisdeveloped.2019/12/21《电子信息工程专业英语教程》16•Late1950s:KeyICdiscoveries.•1958:FirstsiliconintegratedcircuitisbuiltbyTexasInstrument'sJackKilby.•1959:Planarprocesstodistributetransistorsonsilicon,withpassiveoxidelayerstoprotectjunctions,isdevelopedbyFairchildSemiconductor'sNoyceandMoore.Amodernversionofthisprocessisusedtoday.•1960's:SmallScaleIntegration(SSI),upto20gatesperchip.•1960:Metal-Oxide-Silicon(MOS)transistorisinvented.•1962:Transistor-transistorLogic(TTL)isdeveloped.•1963:ComplementaryMetalOxideSilicon(CMOS)isinvented.•Late1960's:MediumScaleIntegration(MSI),20-200gatesperchip.•1968:MOSmemorycircuitsareintroduced.2019/12/21《电子信息工程专业英语教程》17•1970's:LargeScaleIntegration(LSI),200-5000gatesperchip.•1970:8-bitMOScalculatorchipsareintroduced,7micrometerchipgeometries.•1971:16-bitMicroprocessorsareintroduced.•1980's:VeryLargeScaleIntegration(VLSI),over5000gatesperchip.•1981:VeryHighSpeedIntegration(VHSIC),tens'ofthousandsofgatesperchip,1.5micrometerchipgeometries.•1984:0.5micrometerchipgeometries.2019/12/21《电子信息工程专业英语教程》18CompanyInformation2019/12/21《电子信息工程专业英语教程》19•AT&TBellLaboratories,Inc.,bynameBellLabs,thelongtimeresearchanddevelopmentarmoftheAmericanTelephoneandTelegraphCompany(AT&T).ItnowservesthesamefunctioninLucentTechnologiesInc.,whichwasspunofffromAT&Tin1996.HeadquartersforthelaboratoriesareinMurrayHill,N.J.BellLaboratories2019/12/21《电子信息工程专业英语教程》20•TexasInstrumentsIncorporated(TI)isanAmericanmanufacturerofcalculators,microprocessors,anddigitalsignalprocessorswithitsheadquartersinDallas,Texas.TexasInstruments2019/12/21《电子信息工程专业英语教程》21•IntelCorporationisanAmericanmanufacturerofsemiconductorcomputercircui