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进料检验IncomingQCInspection(IQC)IQI磨片WaferGrindBackGrind贴片WaferMount甩干Spinning划片WaferSaw装片DieAttach(D/A)焊丝球焊，打金丝，打线，焊线WireBond(W/B)倒装芯片FlipChip(FC)热压焊ThermalCompressionBond(TCB)烘烤烘箱BakingCuring全检三号目检3rdOpticalInspection(3rdOpt.)包封塑封MoldingEncapsulation冲塑冲胶Degate后固化PostMoldCure(PMC)切筋冲筋,切中筋DamcarCutTrim去飞边Deflash打印Marking激光打印Lasermarking油墨打印InkUVmarking电镀Plating锡铅电镀铅锡电镀TinLeadPlating无铅电镀纯锡电镀LeadFreePlatingPureTinPlating成型Forming分离Singulation外观检产品出厂检OutGoingInspection(OGI)4thOpticalInspection测试Test分选编带Tape&Rail包装Packing出货Shipping组装FrontOFLine(FOL)芯片Die色点芯片InkDie引线框LeadFrame助焊剂Flux导电胶Epoxy蓝膜BlueTape/Mountingtape圆片Wafer金丝Goldwire推晶Dieshear弧高LoopHeight弧度WireLoop布线图Bonddiagram布线错误WrongBonding焊丝拉力测克,拉丝WirePull推球金球剥离Ballshear细刀Capillary扭曲Bending翘曲Bow/Warpage硅屑SiliconDust沾污Contaminate压伤Dented变形Distort缺角ChipDie锡膏回流SolderReflow银厚度SilverThickness毛刺针刺Burr塌丝DepressWire超波膜UVTape火山口CraterRing断丝BrokenWire昂球LiftedBond飞球SkyBall金属剥落LiftedMetal昂楔LiftedWedge高尔夫球GolfBall扁球FlatBall半球InsufficientBallSize不粘Non-Stick芯片裂缝CrackDie错方向WrongOrientation焊不牢IncompleteBond无焊NoBonding翘芯片LiftedDie误置芯片MisplacedDie芯片装斜TiltedDie芯面粘胶EpoxyOnDie导电胶不足InsufficientEpoxy多胶ExcessEpoxy导电胶气孔EpoxyVoid镀层气孔SolderVoid导电胶裂缝EpoxyCrack金属划伤SawIntoMetal擦痕Scratches墨溅InkSplash薄膜气泡TapeBubbles边沿芯片EdgeDie镜子芯片MirrorDie飞片FlyDie封装EndOfLine(EOL)排气Airvent托块Insert刀片Punch型腔Cavity料饼塑料,树脂,环氧MoldCompoundMoldpallet基岛Paddle(PAD)DAP共面性Coplanity点温计Digimite空封DummyMoldedStrip废胶跑料,废料MoldFlash小脚GateRemain脚间距开档,总宽,跨度LeadTiptoTipTotalWidth,LeadDistance.包封偏差MoldingMismatch包封模具MoldChase冲切,成型模具Dieset清模MoldCleaning多肉PackageBump引线条MoldedStrip溢胶MoldBleed包反WrongOrientationMolding印偏OffsetMarking焊丝冲弯WireSweep错位MoldingMismatch偏心MoldingOffset气孔空洞,气泡Void排气不畅AirVentClog偏脚OffsetPunch注浇口，进浇口InjectionGate1stGate上料框FrameLoader冲圆FanOut模温MoldTemperature表面粗糙RoughSurface未填充IncompleteMold料饼醒料CompoundAging顶针EjectorPin顶孔顶料孔EjectorPinhole定位块LocatorBlock粘模StickyMold烘箱Oven麻点镀层起毛SolderBlister锡桥搭锡SolderBridge镀层起泡拉尖SolderBump镀层剥落SolderPeelOff锡丝SolderFlick露铜露底材ExposeCopper细脚小脚NarrowLead镀层厚度PlatingThickness变色(发黄,发黑,发花,水渍,酸斑)Discolor(Yellowish,Blacken,WaterMark)锡球SolderPad镀层偏厚或偏薄ThickorThinPlating易焊性Solderability退锡SolderRemove站立高度StandOff切中筋凸出或凹陷DambarProtrusionorIntrusion连筋UncutDambar脚长LeadLength管脚刮伤LeadScratches管脚反翘LeadTipBend反切WrongOrientationForming.缺脚缺管,断脚MissingLeadBrokenLead裂缝胶体破裂CrackPackage微裂缝MicroCrack崩角缺角,缺损ChipPackageChipOff成型角度Footangle共面性Coplanarity倒角TouchUp印章印记MarkingLayout断字Brokencharacter印记磨糊褪色FadMark打印不良IllegibleMarking打印字间距MarkCharacterDistance印记倾斜SlantMarking漏打Nomarking缺字MissingCharacter错字WrongMarking弄脏Smear定位针LocationPin烧氢HydrogenFrame扫描打印Writinglaser模板激光MaskLaser常用的术语集成电路IntegratedCircuit(IC)塞头Plug托盘Tray编带,带盖Rail,RailCover料管Tube静电袋AntiStaticBag支持棒SuspensionBarFishtail,tiebar随件单TravelingCardRunCard去离子水D.I.Water散热片HeatSink品管QualityControl(QC)品保QualityAssurance(QA)关卡QCGate校验Calibrate照明放大镜DazorLightRingLight显微镜Microscope返工Rework质量标准Criteria扩散批WaferLotMotherLot批Lot抽样SampleSize(SS)良品AcceptUnit(Acc)不良品RejectUnit(Rj)良率Yield次品率不良率YieldLost外次率O.G.I.YieldX管率X-rayYield目检VisualInspection正面TopSurface反面Bottomsurface冷藏库料饼存放库ColdRoomCompoundstorage表面贴装式SurfaceMountTechnology(SMT)报废Scrap开短路Openshort调机MachineBuyOff单列直插式SingleSideLeadInsert双列直插式DualSideLeadInsertType内控Internal/In-houseControl在制品WorkInProgress(WIP)