IC模具基本介绍(GMM)

AUTOMOLDPRESS•.CLAMPSECTION•»»».»–力:60ton•.TRANSFERSECTION•»»»»Pot/plunger–力:0.3~3ton•.PRESS–––()–•()–––––––•.參數•a.•b.•c.•d.力量•e.度()•f.力量•g.•h.,5101520253035246810121416•.•1.LEADFRAME•1.PELLET(1)(2)滑(3)•2.PACKAGEOUTLINEa.SOPb.SOJc.QFPdBGA…..•3.DIE(CHIP)•4.CULL•5.RUNNER•6.GATE•7.AIRVEN.•1.TOPMold–1.Cullblock–2.Topcavity–3.Topchase–4.Topriser–5.Tope-pinholder–6.Tope-pinsupport–7.Topbaseplate–8.Topinsulatorplate–9.Topplate–10.Topmoldhook–11.Dimation:332L*224W*120H–12.weightapprox.:45kg78910654123InterlockpillarconnectorE-pin•2.BTMMold–1.Btmcavityplate–2.Btmchase–3.E-pinholder–4.E-pinsupport–5.Riser–6.Btmbaseplate–7.Btminsulatorplate–8.Btmplate–9.Guidebeam–10.Ejectorsection–11.Transfersection–12.Dimation:320L*224W*107H–13.Weightapprox.:42kg1234511678910interlockconnector•,•a.heater()•b.thermoswitch()•c.connector•d.thermocouple()•六.見–1.packagesize–2.offset,mismatch–3.e-pin–4.flash–5.clampmark–6.不–7.gateremain–8.crack–9.chipout–10.void–11.incompletefilling–12.wiresweep•.–1.量(參例)–2.率,(參率)–3.力(參例)–:leadframesize:15~75mm100~240mm–pelletsize:11~18mm30mmmax.•–1.top101----topcullblock–102---topcavityplate–103---topchase–104---tope-pinholder–105---tope-pinsupport–106---tope-pinbaseplate–2.btm201---btmcavityplate–202---btmchase–203---btme-pinholder–204---btme-pinsupport–205---btmbaseplate–3.SF00ECHO–2000MOLD.–4.SD00SMARTAUTOMOLD.–.•()L/F•1.•2.Material•3.thickness•4.料(MAG.料)–()compound•1.type•2.diameter•3.weight•4.compounddata•()packageoutline•1.•2.gate(top,bottomordoublegate)•3.gateinsert?•4.chipsize•5.engravepin•6.pin1type•7.gateremain•8.度.•.率•0.06%~0.35%,參率–:率.(參compounddatasheet)•.package•1.packagee-pin,•2.packagee-pin,度••.compoundlayout•1.packageweight(率)•2.cullweight•3.runnerweight•*compoundweight略compoundweight.•cullpositive•*Compound-1mm,/=1.7•六culldesig•1.cull•2.•3.度1.5mm,compoundweighttolerance•4.度不,裂(度2mm)•5.cullcavityR0.5•6.若流,12mm(10mm)•7.留1mm,relief0.005~0.010mm•runnerdesign•1.runner10理•2.度不裂度•3.runnere-pin,度不•4.runnerR0.3