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Kulicke&SoffaW/B生产流程及参数控制与MTBA改善建议(ForOperator&Technician)(Copiedout/Translatedfromoperationmanualandtrainingmaterial)Date:Oct./2004ApplicationEngineer:NathanSJLee-1-Kulicke&Soffa1.0Background/Objective针对生产过程中可能出现的问题,在此对相关主要参数进行解释,并列举分析方法及建议,以便改善质量,稳定性及MTBA.2.0相关参数讲解2.0.1BondParameter(1’st&2’nd)Tip1&2(mil)DieTIP1123DieLeadTip2TOLHi-speeddescendZ向以通常速度开始下降至搜索高度,在此段搜索高度再以C/V运动,WireClamp将在Z到达Tip1值时关闭,此值将影响焊接力,球形,球厚,第二点力等,并且不同的产品应选择相应的数值.通常,小间距(Padpitch/ballsize)应相应加大此值以求稳定.普通产品可选择:1’st:5~10mils2’nd:3~6milsApplicationEngineer:NathanSJLee-2-Kulicke&SoffaC/V1&2(mil/ms)Die5DieTIP14CV1Z向到达Tip时,在Tip与焊接表面间以搜索速度下降,接触到焊接表面时再以ContactThreshold所设定的灵敏度来检测是否接触.通常,小间距(Padpitch/ballsize)应相应减小此值以求稳定.普通产品可选择:1’st:0.6~1.0mil/ms2’nd:0.8~1.5mil/msSquashedBallSizeC/V-170um0.6-0.860um0.5-0.650um0.4-0.4545um0.3-0.440um0.25-0.3CapillaryTipDiaC/V-24.0-4.5mils0.8-1.03.5-4.0mils0.6-0.72.8-3.3mils0.5-0.6ApplicationEngineer:NathanSJLee-3-Kulicke&SoffaUSG1&2(建议使用CurrentMode)DiegUSGOutputUSGOutputLead应由工艺工程师根据第一/二点的不同要求,结合Force及BondTime选择不同的参数组合,应考虑BallFormation,BallShear,WirePull,DieCratering等多种要求.USGBondTime1&2(ms)此时WireClamp打开,据此时间进行超生波焊接.一般可选择6~15ms,时间过长过短都会影响焊接强度.BondForce1&2(g)DiegBondForce1ApplicationEngineer:NathanSJLee-4-Kulicke&SoffaBondForce与BondUSG,Time及温度共同作用完成焊接,此值也将直接影响焊接力,球形,厚度等指标.通常,小间距(Padpitch/ballsize)或细线应相应减小此值.TargetBallSizeBondForce-1CapTipDia.BondForce-270um20g-25g100um80-100g60um15g-20g76um40-60g50um10g-15g71um35-50g40um6g-12gN/A20-35gApplicationEngineer:NathanSJLee-5-Kulicke&SoffaBondHeadZAxisDisplacementCurveFollowingFigureisadiagramshowingtheBondHeadZ-axisdisplacementcurve.NotedontheTimelinearetheultrasonicandwireclampoperation.Thisdiagramwillaidinunderstandingtheparametersdescribedinthefollowingsubsections.2.0.2LoopParameterApplicationEngineer:NathanSJLee-6-Kulicke&SoffaLooping参数对于产品很重要,尤其对于多线数,多层或特殊线形的产品更需特别注意,应由产品/工艺工程师在大批量生产前制定,生产中不应随便改动线形或参数,若出现异常,应先判断是否是机器硬件调整或材料问题.ToolTrajectoryDiagramNOTE:Whenusedtogether,KINKHEIGHT,REVERSEMOTIONandRMOTANGLE(ReverseMotionAngle)createawireformingmotionthatgeneratesthewirebendovertheball.Theyaretheprimaryparametersforcontrollingloopheightandtheangleofthewireoverfirstbond.TypicalloopsrequireaReverseMotionof~80%ofthedesiredloopheightandanequalKinkHeight.Thereversemotionangleisgenerallysetto90?however,variouscombinationsoftheseparameterscanyieldspecificloopshapes.CautionshouldbeusedforReverseMotioninexcessofKinkHeightandReverseMotionsinexcessof90?asneckdamagemayresult.loopfactorThisparameterisusedtofinetuneloopheightbyaddingorsubtractingwirefromtheloop.Itadjuststhelengthofwirepay-outforagivenlooplengthbeforethewireclampsareclosed.Itisadeterminingfactorforloopheightandwirestraightness.Itisusedtoincreaseordecreasewirepayoutfromthatcalculatedbythemachine.Mostapplicationsrequirethatsomewirebesubtractedfromthewirepay-outinordertoachievealoopwiththehighestpointlocatedoverfirstbond.Apositivevalueforthisparameterwillincreasewirepayout.Atypicalvaluewouldbe-4mils.2.0.3BallParameterApplicationEngineer:NathanSJLee-7-Kulicke&SoffaCurrent,Gap,Extension通常使用各项推荐值即可.但BallSize是第一点各项参数及测试结果的基值,要首先对第二点参数进行优化,因为第二点会影响线尾及FAB的形成及稳定性,并应在完成第一点参数调整前根据所选用的Capillary,金线及Pad尺寸确定此数值,确定后,应尽量不对此值进行改动.3.0开机自检4.0校准次序ApplicationEngineer:NathanSJLee-8-Kulicke&Soffa应注意的是:KNS机器的一大特点就是几乎所有的基准都是根据Z值及PRS来定义的.所以应优先/保证Z及PRS的精度/准确性,使机头与工作台,上下料部同时去靠拢同一基准,此基准也是焊接的水平高度.(校准与操作步骤详见操作手册)MaxumPlusBonderSpecifications1.1MaterialHandlingCapabilityLeadframeDimensionsLength:3.5to10.5in.(90to267mm)Width:0.60to3.2in.(15.2to81.3mm)Thickness:0.004to0.035in.(0.10to0.89mm)DiePadDown-Set:Upto0.090in.(2.3mm)DieSitePitch:0.1to3.5in.(2.5to90mm)LeadPitch(minimum):0.0026in.(66mm)with1mil(25mm)wireLeadWidth(minimum):0.0016in.(40mm)with1mil(25mm)wireMinimumLeadSpacing:1mil(25mm)MagazineDimensionsWidth:0.8to3.75in.(20to95.3mm)Length:5.00to10.75in.(127to273mm)Height:2.0to7.0in.(50to178mm)SlotPitch:0.05to1inch(1.27to25mm)WireBondingCapabilityBondingArea2.2in.x2.6in.(56mmx66mm)-forleadframewidthsupto3.2in.(81.3mm).Forleadframesgreaterthan3.2in.(81.3mm),thebondableareawillbereducedintheYdirectionto2.3in.(58.4mm).BondHeightDifferential0.9mm(35mils)maximumoffsetbetweenfirstbondandsecondbondwith2Xand6Xfocusatrespectivebondplane.ApplicationEngineer:NathanSJLee-9-Kulicke&SoffaWireCapacity3000wiresperprocessprogram,standard;10,000wires,optional.WireDiameter0.7mil(18mm)to1.3mils(33mm),standardEyepointCapacity300PatternRecognitionSystem(PRS)eyepointsperprocessprogramNOTE:Someloopshapeoptionsareadded-costpremiumfeatures,andarenotincludedinthestandardmachinesoftwareversion.Premiumloopingfeaturesmustbeaddedatthefactorybeforemachineshipment.ContactanyK&SSalesandServicerepresentativeformoreinformation.MaximumWireLength0.300in.(7.6mm)forstandard/lowloop(otherloopshapeoptionsmayincrease/decreasemaximumwirelength)ProgrammableBondForceMinimum:10gramsMaximum:300grams(subjecttomaximumpowerlimit)Resolution:1gramAccuracy:?grams@?10g,?0%@10to50g,?g@50to300gProgrammability:OperatorprogrammableonaperbondbasisProgrammableBondTimeMinimum:1millisecond(msec)Maximum:2000msec(subj