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工程英文确认常用词及常用语句汇总厚度公差线路层孔层阻焊层字符层外形层叠层单词1.附件：attached2.样品：sample3.承认：approval4.答复：answer;reply5.规格：spec6.与...同样的：thesameas7.前版本：previousversion(oldversion)8.生产：production9.确认：confirm10.再次确认：doubleconfirm11.工程问题：engineeringquery（EQ）12.尽快：ASAP(assoonaspossible)13.生产文件：productiongerber14.联系某人：contactsomebody15.提交样板：submitsample16.交货期：deliverydate17.电测成本：ET（electricaltest）cost18.通断测试：Openandshorttesting19.参考：referenceto20.IPC标准：IPCstandard21.IPC二级：IPCclass222.可接受的：acceptable23.允许：permit24.制造：manufacture25.修改：revision26.公差：tolerance27.忽略：ignore(omit)28.工具孔：toolinghole29.安装孔：mountinghole30.元件孔：componenthole31.槽孔：slot32.邮票孔：snapoffhole33.导通孔：via34.盲孔：blindvia35.埋孔：buriedvia36.金属化孔：PTH(platingthroughhole)37.非金属化孔：NPTH(noplatingthroughhole)38.孔位：holelocation39.避免：avoid40.原设计：originaldesign41.修改：modify42.按原设计：leaveitasitis43.附边：wastetab44.铜条：copperstrip45.拼板强度：panelstrong46.板厚：boardthickness47.删除：remove(delete)48.削铜：shavethecopper49.露铜：copperexposure50.光标点：fiducialmark51.不同：bedifferentfrom(differfrom)52.内弧：insideradius53.焊环：annularring54.单板尺寸：singlesize55.拼板尺寸：panelsize56.铣：routing57.铣刀：router58.V-cut：scoring59.哑光：matt60.光亮的：glossy61.锡珠：solderball(solderplugs)62.阻焊：soldermask(solderresist)63.阻焊开窗：soldermaskopening64.单面开窗：singlesidemaskopening65.补油：touchupsoldermask66.补线：trackwelds67.毛刺：burrs68.去毛刺：deburr69.镀层厚度：platingthickness70.清洁度：cleanliness71.离子污染：ioniccontamination72.阻燃性：flammabilityretardant73.黑化：blackoxidation74.棕化：brownoxidation75.红化：redoxidation76.可焊性：solderability77.焊料：solder78.包装：packaging79.角标：cornermark80.特性阻抗：characteristicimpedance81.正像：positive82.负片：negative83.镜像：mirror84.线宽：conductorwidth85.线距：conductorspacing86.做样：buildsample87.按照：asper88.成品：finished89.做变更：makethechange90.相类似：similarto91.规格：specification92.下移：shiftdown93.垂直地：vertically94.水平的：horizontally95.增大：increase96.缩小：decrease97.表面处理：SurfaceFinishing98.波峰焊：wavesolder99.钻孔数据：drillingdate100.标记：Logo101.Ul标记：UlMarking102.蚀刻标记：etchedmarking103.周期：datecode104.翘曲：bowandtwist105.外层：outerlayer106.内层：internallayer107.顶层：toplayer108.底层：bottomlayer109.元件面：componentside110.焊接面：solderside111.阻焊层：soldermasklayer112.丝印层：legendlayer(silkscreenlayeroroverlayer)113.兰胶层：peelableSMlayer114.贴片层：pastemasklayer115.碳油层：carbonlayer116.外形层：outlinelayer(profilelayer)117.白油：whiteink118.绿油：greenink119.喷锡：hotairleveling(HAL)120.水金：flashgold121.插头镀金：platedgoldedge-boardcontacts122.金手指：Gold-finger123.防氧化：Entek(OSP)124.沉金：Immersiongold(chem.Gold)125.沉锡：ImmersionTin(chem.Tin)126.沉银：ImmersionSilver(chem.silver)127.单面板：singlesidedboard128.双面板：doublesidedboard129.多层板：multilayerboard130.刚性板：rigidboard131.挠性板：flexibleboard132.刚挠板：flex-rigidboard133.铣：CNC(mill,routing)134.冲：punching135.倒角：beveling136.倒斜角：chamfer137.倒圆角：fillet138.尺寸：dimension139.材料：material140.介电常数：Dielectricconstant141.菲林：film142.成像：Imaging143.板镀：PanelPlating144.图镀：PatternPlating145.后清洗：FinalCleaning146.叠层：layup(stack-up)147.污染焊盘：contaminatepad148.分孔图：drillchart149.度数：degree150.被…覆盖：becoveredwith151.负公差：minustolerance152.标靶盘：targetpad153.外形公差：routingtolerance154.芯板：core155.超出能力：Beyondourcapacity156.角度：angle157.V-CUT余厚：V-CUTweb常用语句－、厚度1.要求孔内铜厚0.001太紧对我们的生产，建议按IPC二级0.0008。Thecopperthicknessofthewalloftheplated-throughholesisspecified0.001.It'stootightforourproduction.WesuggestasperIPCclass2.that'stosay,It's0.0008.2.要求金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。TheplatingthicknessofAuinedgecontactisspecified1.2-1.5um,itistootoughforus,wesuggestfollowingournormalstandard,thatistosay0.45uminstead.3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。Thecopperthicknessisspecified2OZ.Wesuggestthefinishedcopperthickness2OZ.Andwewillusethebasematerialwith1.5OZcopperthicknessandplateto2OZforourproduction.4.要求锡厚为0.0005-0.003，我们做不到这么厚，建议按IPC二级，即保证可焊性，Thesolderthicknessisrequiredtoplated0.0005-0.003,Wecannotreachtherequirement.WesuggestfollowingIPCclass2forthesolderthicknessandwewillassurethesolderability.二、公差1.XXX.的尺寸公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008。ThetoleranceofdimensionisspecifiedXXX.+/-0.005.Itistightforourproduction.Wesuggest+/-0.008instead。2.在*.pdf文件中要求外形公差为+/-0.005，建议按IPC二级+/-0.01代替。Theprofiletoleranceisspecified+/-0.005in*.pdffile.WesuggestasperIPCclass2，thatistosay,itis+/-0.01.3.在叠层图中要求板厚公差为+/-0.007，而notes1中要求板厚公差为+/-0.005，他们是不同的，建议0.062+/-0.007是可接受的，因为+/-0.005对我们来说太难控制了。Thetoleranceoftheboardthicknessisspecified+/-0.007inlayupdetailwhichisdifferentformNOTES1+/-0.005.Wesuggest0.062+/-0.007isacceptablefor+/-0.005isverytoughforustocontrol.4.外形公差要求+/-0.1mm，这超出了我们生产，建议按+/-0.2mm控制。Thetoleranceoftheoutlineisspecified+/-0.1mm.It'saboveus.Wesuggest+/-0.2mminstead.5.v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。Theremaintoleranceofv-cutisspecified+/-0.06mmandoffsettoleranceis+/-0.05mm.theyaretootightforus,wesuggestbothtoleranceare+/-0.1mminstead.6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。Thetoleranceoftheholepositionisspecified0.05mm.It'stootightforus,Wesuggest+/-0.076mminstead.7.角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5度。Thetoleranceofangleis+/-0.5degree,itistightforus,wewouldliketocontroltheangleofv-cutwithin30+/-5degree.8.在1M