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工艺流程、材料、设备、生产常用中英文标准名称版号：1.0总页数：23制定部门：生效日期：年月日拟制：审核：标准化：会签：批准：发布实施第2页共23页更改状态更改内容更改人更改日期一．TFT工艺流程中英文标准名称ArrayProcessFlow阵列段工艺流程Input投料Unpacking拆包装Initialclean预备清洗Particlecount尘埃粒子测试Gate栅电极层Cleanbeforedepo成膜前清洗Gate（Mo/Alalloy)Filmdepo栅电极成膜RSmeter电阻测量MacroInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry(VCD)光刻胶低压干燥PRsoftbake前烘Expose曝光TitlerExpose/EdgeExpose打标/边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查CDafterdevelop显影后关键尺寸检查Totalpitch长寸测量GateWetetch栅电极湿刻Contactangle接触角测量PRstrip光刻胶剥离CDafteretch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查LaserRepair激光修补Active层Cleanbeforedepo成膜前清洗ActivefilmdepoActive成膜AOI自动光学检查第3页共23页MacroInspection宏观检查ThicknessMeasurement厚度测量CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Mic/MacInspection宏微观检查ActivefilmDryetch&AshingActive膜干刻与灰化ThicknessMeasurement厚度测量PRstrip光刻胶剥离AEI刻蚀后自动光学检查Mic/MacroInspection宏微观检查S/D源/漏电极层Cleanbeforedepo成膜前清洗S/DMofilmdepo源/漏电极成膜RSmeter电阻测量MACROInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Edgeexpose边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查MIC/MACInspection宏微观检查CDafterdevelop显影后关键尺寸检查Hardbakebyoven烘炉坚膜S/DMoWetetch源电极/漏电极湿刻n+a-SiDryetchn+高掺杂膜干刻PRstrip光刻胶剥离ThicknessMeasurement厚度测量CDafteretch刻蚀后关键尺寸测量AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查CleanbeforeO/Stest短路/开路测试前清洗第4页共23页Open/ShortTest短路/开路测试Passivation保护层Cleanbeforedepo成膜前清洗Pass'nfilmdepo保护膜成膜AOI自动光学检查MACROInspection宏观检查ThicknessMeasurement厚度测量CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Edgeexpose边缘曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Micro/MacroInspection宏微观检查SinXDryetch&ASHING氮化硅干刻与灰化PRstrip光刻胶剥离AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查ITOITO层CleanbeforePR成膜前清洗a-ITOfilmdepoITO成膜RSmeter电阻测试Anneal煺火MacroInspection宏观检查CleanbeforePR涂胶前清洗Prebake预烘PRCoating光刻胶涂布PRvacuumdry光刻胶低压干燥PRsoftbake前烘Expose曝光Develop显影PRhardbake坚膜ADI显影后自动光学检查Micro/MacroInspection宏微观检查ITOfilmetchITO膜湿刻PRstrip光刻胶剥离AEI刻蚀后自动光学检查Micro/MacroInspection宏微观检查FinalE/T最终电测Anneal煺火Arraytest阵列测试第5页共23页Arrayrepair阵列修补TEGtestTEG测试Sort分级CellProcessflow制盒段工艺流程CFInput彩膜投料CFInitialClean彩膜预备清洗CFAOI彩膜自动光学检查CFSort彩膜分级PI配向膜CleanbeforePI配向膜涂布前清洗PIPrint配向膜涂布Pre-cure预固化PIInspection配向膜检查PIThicknessMeasurement配向膜厚度测量Main-cure固化PIrework配向膜返工ODFCF&TFTMatchingCF&TFT匹配Rubbing配向摩擦RubbingInspection摩擦检查Loader&Unloader上料机/下料机Buffer缓冲器CSTBuffer工装栏缓冲器Rotation/CoolingUnit旋转/冷却单元TurnAlignUnit旋转/对位单元TurnOverUnit翻转单元AfterRubbingCleaner摩擦后清洗SpacerSpray衬垫球散布SpacerCounter衬垫球计数Spacerrework衬垫球返工SpacerCure衬垫球附着固化ShortDispense导电胶涂布SealantDispense边框胶涂布SealInspection边框胶检查LCDispense液晶滴下VacuumAssembly真空贴合UVCure紫外线固化Mis-alignmentcheck错位检查SealOven边框胶热固化EyeInspection目视检查CellgapMeasurement盒厚测试Cutting切割1/4(1/6)SheetCutting,1/4(1/6)切割StickCutting,切条CellCutting切粒第6页共23页VisualTestVisual测试ECPEdgeGrind磨边Dippingclean浸泡式清洗CleanbeforePol贴片前清洗PolAttach贴片PolInspection贴片检查Polrework贴片返工AutoClaveAutoClave消泡LaserTrimmerLaserTrimmer激光切线Test测试GrossTest终检Repair修补Binsorter分级OQCTest出货检查Store货栈第7页共23页ModuleProcessFlow模块段工艺流程COGPadcleaning端子清洗ICBondingIC邦定MicroscopeInspectionAOI镜检自动光学检查Adhesivetest粘接力测试FOGACFAttachingACF粘贴FOGBondingFOG邦定MicroscopeInspection镜检Peelingstrengthtest拉力测试ETtest1电测1ICorFPCRepair修补UVgluesealing封胶FPCreinforcement补强UVgluecuringUV胶固化Assembly组装ETtest2电测2anti-ultraviolettapeattaching遮光胶带粘贴protectedtapeattaching保护胶带粘贴Backlightassembly背光源组装Backlightsoldering背光源焊接Touchpanelassembly触摸屏组装FinalETtest最终电测Rework返工Aging老化QCtestQC检验Codeprinting喷码Packing包装OQCTest出货检验Finishedgoodshipment合格品出货CIMname集成控制系统名称CIM计算机集成制造系统CIMSystem计算机集成制造系统ManufacturingExecutionSystem(MES)制造执行系统（MES）PreventiveMaintenanceSystem(PMS)设备预防保养系统（PMS）StatisticalProcessControl(SPC)统计过程管理（SPC）EquipmentAutomationProgram(EAP)设备自动化（EAP）Report报表EngineeringDataAnalysis(EDA)工程数据分析（EDA）FinishedGoodManagementSystem(FGMS)成品管理系统（FGMS）Product产品第8页共23页Glass玻璃基板Panel面板ProcessFlow工艺流程Operation操作EDC工程数据收集Equipment设备Chamber腔体Unit单体SubUnit副单体Port端口OIC(OperatorInterfaceClient)操作者界面EDB工程数据库FGMS成品管理系统Dispatcher派货Create建立Start下线Scrap报废Unscrap取消保废Complete完成Ship出货Unship取消出货Receive收料TrackIn入账TrackOut出账Wait等待Hold滞留Release释放Rework返工Vehicle搬运车Robot机械手AGV(AutomaticGuidedVehicle)自动搬运车MGV(ManualGuidedVehicle)人工搬运车Cleanlifter净化电梯LIM(LinearInductionMotor)Carrier线性感应马达传送载具OHS(OverheadHandlingSystem)天车搬送系统Stocker(cleandepot)工装篮存放架Battery电池Bay作业区Inter-bay作业区和作业区之间Intra-bay作业区之内Bumper减震缓冲器第9页共23页Charger充电器Controller控制器Conveyor传送带Crane吊车（在Stocker内）FFU(FanFilterUnit)风扇过滤器Host主机I/O(Input/Output)输入/输出IR(Infra-Red)红外线IRIF(Infra-RedInterface)红外接口Load上料Unload下料Magnetictape磁条(AGV路径所使用的磁条)Retrieve检索RTM(RotaryTransferMachine)旋转传送机构SCARAarmAGV传送臂Reset重新设定Transportation传输Recipe工艺参数的组合Stockout将工装篮取出货栈Request要求,请求Transfer传送,运送Instruction命令,指令Select选择Cancel取消Operation作业,操作Support支援,支持Process工艺Start开始Batch批量Lot批(指生产线的在制品或产品控制单位)ID(Identity)识别码(如LotIDorChipID)Sheet片(Array区玻璃基版计数单位)Inspection检验Defect缺陷Hold滞留Release释放Equipment设备（简称为EQP）Tool工具,机台WIP(WorkInProcess)在制品（工艺在制品）Maintenance维修保养第10页共23页Cassette工装篮(阵列段),卡匣(制盒段及模块段)