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电子组装（Assembly）IPC-T-50FTermsandDefinitionforInterconnectingandPackagingElectronicCircuits电子电路互连与封装的定义和术语IPC-S-100StandardsandSpecificationsManual标准和详细说明汇编手册IPC-E-500IPCElectronicDocumentCollection已出版的IPC标准电子文档资料合订本IPC-TM-650TestMethodsManual试验方法手册IPC-ESD-20-20AssociationStandardfortheDevelopmentofanESDControlProgram静电释放控制过程(由静电释放协会制定)IPC/EIAJ-STD-001CRequirementsforSolderedElectrical&ElectronicAssemblies电气与电子组装件锡焊要求IPC-HDBK-001HandbookandGuidetoSupplementJ-STD-001—IncludesAmendment1J-STD-001辅助手册及指南及修改说明1IPC-A-610CAcceptabilityofElectronicAssemblies印制板组装件验收条件IPC-HDBK-610HandbookandGuidetoIPC-A-610(IncludesIPC-A-610BtoCComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)IPC-EA-100-KElectronicAssemblyReferenceSet电子组装成套手册，包括：IPC/EIAJ-STD-001C，IPC-HDBK-001，IPC-A-610C。IPC/WHMA-A-620RequirementsandAcceptanceforCableandWireHarnessAssemblies电缆和引线贴装的要求和验收IPC/EIAJ-STD-012ImplementationofFlipChipandChipScaleTechnology倒装芯片及芯片级封装技术的应用IPC-SM-784GuidelinesforChip-on-BoardTechnologyImplementation芯片直装技术实施导则IPC/EIAJ-STD-026SemiconductorDesignStandardforFlipChipApplications倒装芯片用半导体设计标准J-STD-027MechanicalOutlineStandardforFlipChipandChipSizeConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准IPC/EIAJ-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps倒装芯片及芯片级凸块结构的性能标准SMC-WP-003ChipMountingTechnology芯片贴装技术J-STD-013ImplementationofBallGridArrayandOtherHighDensityTechnology球栅阵列(BGA)及其它高密度封装技术的应用IPC-7095DesignandAssemblyProcessImplementationforBGAs球栅阵列的设计与组装过程的实施IPC/EIAJ-STD-032PerformanceStandardforBallGridArrayBallsBGA球形凸点的标准规范IT-98000JPLChipScalePackagingGuidelinesJPL发布的CSP导则注：IT(TheCaliforniaInstituteofTechnology)JPL(TheJetPropulsionLaboratory)IT-98080JPLBallGridArrayPackagingGuidelinesJPL发布的BGA封装导则IT-98093ITRIChipCarrier,Phase1ReportITRI关于芯片载体的报告ITRI(TheInterconnectTechnologyResearchInstitute)IPC-MC-790GuidelinesforMultichipModuleTechnologyUtilization多芯片组件技术应用导则IPC-M-108CleaningGuidesandHandbookManual清洗导则和手册IPC-TP-1113CircuitBoardIonicCleanlinessMeasurement:WhatDoesItTellUs?电路板离子洁净度测量：它告诉我们什么？IPC-CH-65AGuidelinesforCleaningofPrintedBoards&Assemblies印制板及组装件清洗导则IPC-SC-60APostSolderSolventCleaningHandbook锡焊后溶剂清洗手册IPC-SA-61PostSolderSemi-aqueousCleaningHandbook锡焊后半水溶剂清洗手册IPC-AC-62AAqueousPostSolderCleaningHandbook锡焊后水溶液清洗手册IPC-TR-476AElectrochemicalMigration:ElectricallyInducedFailuresinPrintedCircuitAssemblies电化学迁移：印制电路组件的电气诱发故障IPC-TR-580CleaningandCleanlinessTestProgramPhase1TestResults清洗及清洁度试验计划1阶段试验结果IPC-TR-582CleaningandCleanlinessTestProgramfor:Phase3--LowSolids,FluxesandPastesProcessedinAmbientAirIPC第3阶段非清洗助焊剂研究IPC-TR-583AnIn-DepthLookAtIonicCleanlinessTesting深入离子洁净度测试IPC-9201SurfaceInsulationResistanceHandbook表面绝缘电阻手册IPC-TP-104KCleaning&CleanlinessTestProgram,Phase3WaterSolubleFluxes,Part1&Part2第3阶段水溶性助焊剂清洗，第一和第二部分IPC-M-109ComponentHandlingManual元件处理手册IPC/JEDECJ-STD-020BMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices非密封固态表面贴装器件湿度／再流焊敏感度分类IPC/JEDECJ-STD-033AHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用IPC/JEDECJ-STD-035AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents非气密封装电子元件用声波显微镜IPC-9500-KSetoffourdocuments9501-95049501至9504手册合订本IPC-DRM-18FComponentIdentificationDeskReferenceManual零件分类标识手册IPC-DRM-SMT-CSurfaceMountSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册IPC-DRM-40EThrough-HoleSolderJointEvaluationDeskReferenceManual接插件焊接点评价手册IPC-DRM-56WirePreparation&CrimpingDeskReferenceManual导线和端子预成形参考手册IPC-DRM-53IntroductiontoElectronicsAssemblyDeskReferenceManual电子组装基础介绍手册IPC-M-103StandardsforSurfaceMountAssembliesManual所有SMT标准合订本IPC-M-104StandardsforPrintedBoardAssemblyManual10种常用印制板组装标准合订本IPC-TA-722TechnologyAssessmentofSoldering锡焊技术精选手册IPC-TA-723TechnologyAssessmentHandbookonSurfaceMounting表面安装技术精选手册IPC-TA-724TechnologyAssessmentSeriesonCleanRooms清洁室技术精选系列IPC-SM-780ComponentPackagingandInterconnectingwithEmphasisonSurfaceMounting以表面安装为主的元件封装及互连导则IPC-SM-785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountAttachments表面安装焊接件加速可靠性试验导则IPC-PD-335ElectronicPackagingHandbook电子封装手册IPC-7525StencilDesignGuidelines网版设计导则IPC-TR-581IPCPhaseIIIControlledAtmosphereSolderingStudyIPC第3阶段受控气氛焊接研究IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册IPC/EIAJ-STD-004RequirementsforSolderingFluxes-IncludesAmendment1锡焊焊剂要求（包括修改单1）IPC/EIAJ-STD-005RequirementsforSolderingPastes-IncludesAmendment1焊膏技术要求（包括修改单1）IPC-HDBK-005GuidetoSolderPasteAssessment焊膏性能评价手册IPC/EIAJ-STD-006ARequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSolders电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求IPC-SM-817GeneralRequirementsforDielectricSurfaceMountingAdhesives表面安装用介电粘接剂通用要求IPC-CA-821GeneralRequirementsforThermallyConductiveAdhesives导热胶粘剂通用要求IPC-3406GuidelinesforElectricallyConductiveSurfaceMountAdhesives表面贴装导电胶使用指南IPC-3408GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms各向异性导电胶膜的一般要求IPC-CC-830BQualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies印制板组装电气绝缘性能和质量手册IPC-HDBK-830GuidelineforDesign,SelectionandApplicatio