PTAPlantProcessApplicationsMonicaZhong11/30/20072Sinopec–ChemicalProcess化工事业部物流简图DMT:对苯二甲酸二甲酯Xylene:二甲苯3WhatisPTAPurifiedTerephthalicAcid(精对苯二甲酸)OtherNames–Benzene-1,4-dicarboxylicacid(二羧基酸),TPA,PTA,para-PhthalicacidAppearance(外観)–WhiteCrystalsorpowderMeltingPoint(融点)-402°CMolecularFormula(化学分子式)–C6H4(COOH)2PTAaremainlyfeedstocks(91%+)fortheproductionofPolyesterknownasPET(聚酯),其余作为聚对苯二甲酸丙二醇酯(PTT)和聚对苯二甲酸丁二醇酯(PBT)及其它产品的原料WhatisPTACH3CH3COHCH3O2COOHCH3O2COOHCOHO2COOHCOOHO2PX对二甲苯甲基醇PT酸4-CBA(4-羧基苯甲醛)TABYPRODUCTS(副产品)PTAinPolyesterValueChainMixedxylenes混合二甲苯Paraxylene对二甲苯PurifiedTerephthalicAcid(PTA)OxygenPolyester聚酯EthyleneGlycolHomefurnishingsTextiles&ClothingFlexiblePackagingEngineeringResinsVideo&AudiofilmFoodContainersBeverageContainersRigid刚性Packaging(PTA在聚酯价值链中的位置)PET(Polyethyleneterephthalate,聚对苯二甲酸乙二醇脂)聚酯(PET)的生产方法:–DMT法(酯交换法):由对苯二甲酸二甲酯(DMT)与乙二醇(EG)反应,然后缩聚制得;–PTA法(直接酯化法):由高纯度对苯二甲酸(PTA)或中纯度对苯二甲酸(MTA)与乙二醇直接脂化,缩聚制得;这种直接酯化法是自1965年阿莫科公司对粗对苯二甲酸精制获得成功后发展起来,此后发展迅速,PET生产也随之得到了很快的发展。–PTA法较DMT法优点更多(原料消耗低,EG回收系统较小,不副产甲醇,生产较安全,流程短,工程投资低,公用工程消耗及生产成本较低,反应速度平缓,生产控制比较稳定)等,目前世界PET总生产能力中大多采用PTA法。PETProduction7ApplicationsofPETApplicationsofPTA&PET:–Fibres(纤維)–Resin(樹脂)–Filmes(胶卷)–Specialties(特殊品)–ElectricalInsulation(電气絶縁)–Mouldings(模型)–PolyesterPowderCoatings(聚酯塗料)HowtogetPTA?CH3CH3CH3COOH++3O2=+2H2O+QCOOHCOOH催化剂:ManganeseAcetate乙酸锰,CobaltAcetate醋酸钴促进剂:SodiumBromide溴化钠,Tetrabroethane四溴乙烯氧化反应条件大体是:温度185~200℃,压力0.98~1.5MPPTAProcessOverviewMajorLicensers/Producers:–BP(英国石油)/Amoco,DuPont(杜邦)/Invista,MPC(三井油化),Dow-INCA(道化学-因卡),Interquisa(因特奎萨)两步法:4-CBA杂质教高粗对苯二甲酸EPTA(聚合级对苯二甲酸)ProcessOverview二步法与一步法的主要区别在于:二步法制得的PTA中,杂质4-羧基苯甲醛(4-CBA)的含量在25×10-6以下,而一步法制得的PTA中,4-CBA含量为200×10-6~300×10-6。后者又称为中纯度对苯二甲酸(MTA)。MajorLicensers/Producers:–Lurgi/Eastman(伊斯曼)/SK,DuPont(杜邦),MCC(三菱化学),Toray(东丽)一步法:PT酸杂质教高PTAProcessFlowDiagramPTAProcessFlowDiagram–Traditional1/2氧化反应釜OxidationReactor结晶器SurgeVessel(FlashTank)放热反应,生成CPTA氧化反应烘干含PT酸、4-CBA杂质过滤器含AA、催化剂、水等Residue脱水塔进料罐SlurryTray加氢反应器加氢精制是将对二甲苯氧化过程中尚未反应完全的4-羟基苯甲醛(4-CBA)转化为可溶于水的甲基苯甲酸,然后除去。该反应要在较高压力(约6.8MPa)和较高温度(约280℃)的条件下进行。还原反应结晶器Crystallizer离心分离器对苯二甲酸加氢产物再经结晶分离和干燥,就得到可用于纤维生产的精对苯二甲酸。ValveSelectionConsiderationsforPTAApplicationsTheFollowingmaterialsareunacceptableforusedintheoxidationsectionoftheplant,whereAAandbromidecatalystarepresent:–17-4PHtypealloys,ie,precipitation-hardeningSST–ANSI400seriesmaterialSST–NickelandChromiumPlating–MetalSprayedCoatings•ToavoidGalvanic(电化学)Corrosion;Alloy6CoatingshouldbeacceptedbyallexceptBPlicense)–CopperAlloys–Lowmeltingpoint(熔点)coatingssuchasCadmium(镉)orIndium(铟)UnacceptableMaterial(DupontLicense,OxidationArea)TheFollowingalloysarecommonusedinPTAPlants:–LowCarbongradesAusteniticSST(300Series)–DuplexSST–HastelloyC–TitaniumTypicalAlloyMaterials(典型的金属材料)Materialspecificationsforvalvebody:Notes:–For316L,Motobe2%min,3%max;Ctobe0.03%max.–For317L,Motobe3%min,4%max;Ctobe0.03%max.TechnicalRequirements–AusteniticSST18Technicalrequirements–AusteniticSST(Cont.)Testingrequirements–Radiography:100%examinedforvalvesizeupto6”.For8”andabovetobeexaminedonlycriticalareaonly.Acceptance:inaccordancetoASTME446orANSIB16.34toannexeBseveritylevels2forcategoriesAB&C.CategoriesD,EandFarenotpermitted.TechnicalRequirements–AusteniticSST(Cont.)TestingRequirement:–DyePenetrant:•着色探伤测试是一种非破坏性实验方法,用来探测诸如肉眼无法识别的裂纹之类的表面损伤。某种液体,着色剂被涂在材料的表面。着色剂渗入受损部位。放置一段时间后将表面的着色剂冲洗掉。在已经清洗干净的表面涂上显影剂,损伤部位由于着色剂渗入其中从而看得一清二楚。这些点被称为指示点。在验收标准中会规定什么样的指示点是不可以接受的(受损)或者是可以接受的。着色探伤测试主要用于焊接层,焊接点和热影响区。•EachcastingsubjectstoDyePenetrantExamaccordingtoASMEB16.34Annex“D”.TechnicalRequirements–AusteniticSST(Cont.)TestingRequirement:–PMI(磁阳性材料鉴别)•XRF-原理(X-射线荧光)是PMI方法中的一种。使用的设备包括低辐射源(同位素)或X线管。暴光的材料.反射射线,产生能量。由于每个元素有其自己的原子结构,这种反射,对于每个元素产生不同的能级。测量和检测该能量,识别合金元素。•其他PMI方法为火星放射光谱法。光谱法以光发射为基础。设备包括释放火星的探头,用来使被分析材料气化。蒸气中的原子和离子产生,能作光学测量的光谱,然后进行再计算,测定材料的成分MaterialSpecificationsforvalvebody:–ForgedSuplexSST:•ToASTMA351UNSS31803(2205);–CastDuplexSST:•ToASTMA182UNSS31803(2205);TechnicalRequirements–DuplexSSTTestingRequirements:–Radiography:•CriticalsectionasdefinedbyASMEB16.34;–DyePenetrant:•100%Examined;–TestCoupon测试取样:•Atestcouponshallbeprovidedforeachbatchofcasting.Itsubjectstothefollowingtests:–Tensiletesting–Bendtesting–Impacttesting–Microsectionexamination–HardnessDetermination–FerriteLevelDeterminations–CorrosionTestingTechnicalRequirements–DuplexSST(Cont.)DestroyedTesting:–Tensiletesting(张力测试)–Bendtesting(弯曲测试)–Impacttesting(碰撞测试)•Charpy•Izod(摆式冲击)–Microsectionexamination–FerriteLevelDeterminations–CorrosionTesting–Torsion(扭转测试)–Shear(剪切力测试)–Fatigue(疲劳测试)TechnicalRequirements–DuplexSST(Cont.)MaterialSpecificationsforValvebody:–ForgedHastelloyC276:•ToUNSN10276;–CastHastelloyC4:•ToASTMA494GradeCW2MUNSN06455andshallhaveamaximumironcontentof2.0%TestingRequirement:–Radiography:•CriticalsectionasdefinedbyASMEB16.34;•Acceptance:inaccordancetoASTME446orANSIB16.34toannexBseveritylevels2forcategoriesAB&C.CategoriesD,EandFarenotpermitted.–DyePenetrant:•100%Examined;–PMITechnicalRequirements–Hast.CMaterialSpecificationsforValveb