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河北工业大学毕业设计说明书作者：高善顺学号：100204学院：机械工程学院系(专业)：测控技术与仪器题目：超声波测厚仪设计指导者：张鹏讲师评阅者：2014年6月1日河北工业大学2014届本科毕业设计说明书毕业设计（论文）中文摘要题目超声波测厚仪设计摘要：超声波测厚仪是根据超声波脉冲通过被测物体达到材料的分界面时，脉冲被发射回去，并被接收探头接收，通过计算脉冲返回的时间来确定被测材料的厚度。由于超声波具有处理方便，并有良好的指向性的特点，超声波测厚仪可以适应多种场合的测厚工作。本课题研究的超声波测厚仪主要是纸张厚度的测量工作。由于纸张纤维分布不均匀，存在较大间隙的特点，一般的测厚仪很难达到很高的测量精度。课题结合接触式测量和非接触测量的优点，机械部分设计了新型的超声波测厚传感器，分别设计了水平放置和垂直放置多种适应不同工作条件的传感器，硬件部分采用MSP430F247作为微控制器，TDC-GP22作为脉冲检测器，可通过按键控制工作过程，也可以自动实现纸厚测量，并通过LCD显示时间信息和测量结果。关键词：超声波测厚仪MSP430TDC-GP22河北工业大学2014届本科毕业设计说明书毕业设计（论文）外文摘要Title：ThedesignofUltrasonicthicknessmeterAbstract:Themeasurementprincipleofultrasonicthicknessmeteriswhentheultrasonicpulseenterthetestedmaterialandreachtheinterfaceofthetestedmaterial,theultrasonicpulsewillbereflectedandthenreceivedbytheultrasonicprobe,thenwecangetthethicknessofthetestedmaterialbycalculatethetimeoftheultrasonicpulsesreturnfromtheinterfaceofthetestedmaterial.Becausetheultrasonicpulsehasthecharacteristicsofeasymanagementandgooddirectivity,ultrasonicthicknessmetercanadapttomanythicknessmeasurementoccasions.Myresearchsubjectofultrasonicthicknessmeterisaboutpaperthicknessmeasurement.Becausethepaperhasthecharacteristicsofunevendistributionoffiber,normalultrasonicthicknessmetercannotachievehighaccuracyofmeasurement.Myresearchsubjectcombinesthecharacteristicsofcontactmeasurementanduncontactmeasurement,inthemechanicalparts,Idesignanewtypeofultrasonicthicknesssensor,inthehardwarepart,usingtheMSp430F247asthemicrocontroller,TDC-GP22asthepulsedetector.Usingthekeystocontroltheprocess,andalsocanachieveautomeasurement,thenusingLCDtoshowthetimeinformationandmeasuringresults.keywords:UltrasonicthicknessmeterMSP430F247TDC-GP22河北工业大学2014届本科毕业设计说明书目录1绪论.............................................................................................................................................11.1课题简介及要求..............................................................................................................11.2本课题研究的内容以及现状..........................................................................................22单片机及超声波测厚的工作原理.............................................................................................32.1单片机的硬件组成..........................................................................................................32.2单片机的各引脚功能......................................................................................................52.3超声波测厚的工作原理..................................................................................................53总体方案的确定.........................................................................................................................73.1机械部分..........................................................................................................................73.2硬件设计........................................................................................................................113.3软件设计........................................................................................................................123.4本章小结........................................................................................................................134机械部分设计...........................................................................................................................144.1机械加工装配图............................................................................................................144.2电磁铁的选择................................................................................................................204.3弹簧的选择....................................................................................................................214.4本章小结........................................................................................................................215硬件系统的设计及原理图.......................................................................................................215.1最小系统和LCD显示电路..........................................................................................225.2超声波发射接收电路....................................................................................................235.3自动增益放大电路........................................................................................................245.4波形处理和拾取电路....................................................................................................255.5本章小结........................................................................................................................256元器件的选择...........................................................................................................................266.1时间芯片的选择..............................................................................................................266.2超声波探头的选择........................................................................................................276.3其他元器件的选择........................................................................................................276.4本章小结..............................