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1SUMITOMOBAKELITECOLTD NEWMOLDINGCOMPOUNDSFORCOSTREDUCTION,NON-POSTMOLDCURABLEHIGHRELIABILITY/JEDECLEVEL1or2EXCELLENTMOLDABILITYEME-6600HseriesSUMITOMOBAKELITECO.,LTD.ELECTRONICDEVICEMATERIALSRESEARCHLABORATORYApr.,1999Div.22SUMITOMOBAKELITECOLTD INTRODUCTIONINTRODUCTIONTARGETLEVELJEDECLEVEL1:85degC/85%168hrs+IRReflow235degC3timesJEDECLEVEL2:85degC/60%168hrs+IRReflow235degC3timesAPPLICATIONSOP,DIP:LEVEL1LargeQFP,LargePLCC:LEVEL23SUMITOMOBAKELITECOLTD CONCEPTCONCEPTRELIABILITYTargetJEDECLevel1,2withoutPMC⇒HigherFlexuralStrengthathightemperature⇒HigherAdhesionStrengthathightemperature⇒LowWaterAbsorptionMOLDABILITY(NoPin-Mole,Void,Sticking,WireSweep,PadTiltetc.,)⇒LowerVolatileMatter⇒LowerViscosityandLongFlow4SUMITOMOBAKELITECOLTD HIGHFILLERLOADINGCOUPLINGAGENTNEWDCPD(LOWERVISCOSITY)RESINSYSTEMNEWLOWSTRESSADDITIVETECHNIQUESTOACHIEVEHIGHRELIABILITYTECHNIQUESTOACHIEVEHIGHRELIABILITY1)LOWWATERABSORPTION2)HIGHADHESION3)LOWMODULUSATHIGHTEMP.4)LOWTHERMALEXPANSION5)HIGHSTRENGTH ATHIGHTEMP.5SUMITOMOBAKELITECOLTD NEWSTANDEREDGRADE[EME-6600Hseries]NEWSTANDEREDGRADE[EME-6600Hseries]6600CS6600CS6600CR6600CR660066006600HD6600HD6600H6600H6600HR6600HR6600DD,CG6600DD,CGForConventionalMoldForAutoMoldFastCureSemi-FastCureNormalCureVoidImprovement6SUMITOMOBAKELITECOLTD GRADEPOSITIONGRADEPOSITIONSOJSOPPLCCQFPLargeQFPJEDECDIPEME-6600seriesEME-6300HseriesLevel3Level2Level4Level1EME-6600Hseries7SUMITOMOBAKELITECOLTD FORMULATION6600H6600HD6600HR6600CS6300HFillerContentMuchMuchMuchIncreasedSTDIncreasedIncreasedIncreasedFillerTypeMuchMuchMuchModifiedSTDModifiedModifiedModifiedEpoxyTypeLowVis.DCPDLowVis.DCPDOCNDCPD+BP+BPDCPD+BPHardenerTypeSTDSTDSTDSTDSTDCatalystTypeSTDSTDSTDSTDSTDLSATypeNewNewNewNewSTD8SUMITOMOBAKELITECOLTD COMPARISONDATACOMPARISONDATAPOSTMOLDCURE:175℃／2hrsITEMUNIT6600H6600HD6600HR6600CS6300HConv.Conv.AutoConv.MainlyAutoAutoConv.SpiralFlowcm9070809580GelTimesec3545283540Koka'svis.poise180250220180300Alpha11/℃0.80.80.81.01.7Alpha21/℃3.43.43.44.06.8Tg℃150145155150165FlexuralStrength(25℃)kgf/mm21717171812FlexuralStrength(240℃)kgf/mm22.22.22.22.01.6FlexuralModulus(25℃)kgf/mm227002700270021001200FlexuralModulus(240℃)kgf/mm295959510565SpecificGravity-2.012.012.011.951.81WaterAbsorption%0.120.120.120.160.30ShoreDHardness-8585858682FlameResistanceUL-94V-0V-0V-0V-0V-0EME-6600HisstandardgradeforallPKG.9SUMITOMOBAKELITECOLTD MOLDABILITYMOLDABILITY(7-1)ExternalVoid---ConventionalMold(80LQFP)---PKGtype:80LQFP/42AlloyPKGsize:14×20×2.7mmChipSize:6×6mm(withoutwire)Padsize:6.5×6.5mmCheck:Pinholesize0.3～1mmbymicroscopeMold:ConventionaltypeMoldingcondition:Preheattemp80℃,Curecondition180℃/100secTransfertime15secPinHoleGateVoidEdgeVoidWeld6600HD0/960/960/960/966600H0/960/960/960/9610SUMITOMOBAKELITECOLTD MOLDABILITYMOLDABILITY(7-2)MoldingWindow---AutoMold(208LQFP)---PKGtype:208LQFP/CuPKGsize:27×27×3.2mmCheck:Pinholesize0.3～1mmbymicroscope Mold:MultiGangPotMoldCompound:EME-6600HMoldingConditionExternalVoidPre-HeatTemp.H/STr.TimePadSize(mm×mm)(sec)(℃)(sec)11×1115×150170No7.00/160/16175No7.00/160/16185No7.00/160/165170No7.00/160/16175No7.00/160/16175No15.00/160/16175Yes7.00/160/16185No7.00/160/1610170No7.00/160/16175No7.00/160/16185No7.00/160/1611SUMITOMOBAKELITECOLTD RELIABILITYRELIABILITY(8-1)SolderCrackResistance---208LQFP---PKGtype:208LQFP/CuPKGSize:27×27×3.2mmtAgPaste:CRM-1076DFChipSize:10×10mm(SiN)PadSize:11×11mmCheck:SAT&CROSSCUTforAutoMold(NonPMC)EME-6600HEME-6600HRJEDEC2ExternalCrack0/160/16InternalCrack0/160/16DelamonChip0/160/16DelamunderPad0/160/16JEDEC2AExternalCrack0/160/16InternalCrack0/160/16DelamonChip0/160/16DelamunderPad0/160/16JEDECL2:85/60168hrs+IRREFLOW235℃3timesJEDECL2A:60/60168hrs+IRREFLOW235℃3times12SUMITOMOBAKELITECOLTD RELIABILITYRELIABILITY(8-2)SolderCrackResistance---80LQFP---PKGtype:80LQFP/CuPKGsize:14×20×2.0mmAgPaste:CRM-1076DFChipSize:9×9mm(SiN)PadSize:9.5×9.5mmCheck:SAT&CROSSCUTforAutoMoldEME-6600HEME-6600CSNonPMCPMC2hrsNonPMCPMC2hrsJEDECL2ExternalCrack0/160/160/160/16InternalCrack5/160/1616/167/16DelamonChip0/160/160/160/16DelamunderPad0/160/160/160/16JEDECL2:85/60168hrs+IRREFLOW235℃3times13SUMITOMOBAKELITECOLTD