SMT零件组装工艺标准

理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件X方向)SMDAssemblyworkmanshipcriteria--Chipcomponentalignment(XAxis)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.1.零件橫向超出焊墊以外，但尚未大於其零件寬度的50%。(X≦1/2W)1.Thecomponentshiftedoffthepadandshiftlengthshallless1/2chipwidth1.零件已橫向超出焊墊，大於零件寬度的50%(MI)。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthover1/2chipwith允收狀況(AcceptCondition)X≦1/2WX≦1/2WX1/2WX1/2W註:此標準適用於三面或五面之晶片狀零件Thisstandardonlybeusedfor3or5faceterminationschipcomponentww330理想狀況(TargetCondition)拒收狀況(RejectCondition)1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.1.零件縱向偏移，但焊墊尚保有其零件寬度的25%以上。(Y1≧1/4W)2.零件縱向偏移，但零件端電極仍蓋住焊墊為其零件寬度的25%以上。(Y2≧1/4W)Componentisshiftedtowardslongestpartofthechip,butthetermiuadendofchipstillontheland1.ThePadlengthnotbecoverbychip(Y1)shallover1/4chipwidth(W)2.1/4widthofthelandforsolderfillettoform.1.零件縱向偏移，但焊墊未保有其零件寬度的25%(MI)。(Y1＜1/4W)2.零件縱向偏移，但零件端電極蓋住焊墊小於其零件寬度的25%。(Y2＜1/4W)3.Whicheverisrejected.允收狀況(AcceptCondition)WW330Y2≧1/4WY1＜1/4WY2＜1/4WY1≧1/4WSMT零件組裝工藝標準--晶片狀(Chip)零件之對準度(組件Y方向)SMDAssemblyworkmanshipcriteria--Chipcomponentalignment(YAxis)理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--圓筒形（Cylinder）零件之對準度SMDAssemblyworkmanshipcriteria--Cylindercomponentalignment1.組件的〝接觸點〞在焊墊中心1.Thepointofcontactiscenteredonthelands1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以下。(X≦1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10mil),(Y20mil)1.Thelengthofcomponentshiftedoffthepad(X)shalllessthe1/3Diameterofcomponent2.Shiftedtowardthelongestpartofthecomponent,thesolderterminationsstillontheland1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以上(MI)。(X＞1/3D)2.零件縱向偏移，但金屬封頭未在焊墊上。(Y1≦0mil),(Y2≦0mil)3.Whicheverisrejected.允收狀況(AcceptCondition)X≦1/3DX≦1/3DY2＞0milY1＞0milX＞1/3DX＞1/3DY2≦0milY1≦0mil註：為明瞭起見,焊點上的錫已省去。Note:Inordertoclarifythefigure,thesolderjointbeeliminatedD理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳面之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingfootprintalignment1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X≦1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離≧5mil(0.13mm)。(S≧5mil)1.Thelengthoftheleadfootprintshiftedofftheland(X)shallless1/2widthoflead2.Theclearance(S)betweenleadshiftedoffandlandshallover5mil允收狀況(AcceptCondition)WSX≦1/2WS≧5milX1/2WS＜5mil1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X＞1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離＜5mil(0.13mm)(MI)。(S＜5mil)3.Whicheverisrejected.理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳趾之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingtoealingnment1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.Theleadhadshiftedandfootprintnotovertheendofland1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.Theleadhadshiftedandfootprinthadovertheendofland(MI)允收狀況(AcceptCondition)WW已超過焊墊側端外緣理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT零件組裝工藝標準--鷗翼(Gull-Wing)零件腳跟之對準度SMDAssemblyworkmanshipcriteria--Gull-Wingheelalingnment1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands1.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(X≧T)。1.Theleadhadshiftedthelengthfromleadheeltoendofland(X)shallbeoverthethicknessofland(T)1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳厚度(XT)(MI)。允收狀況(AcceptCondition)TXTX≧TTXT理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT焊點性工藝標準--鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMDsolderjointworkmanshipcriteria--MinimumsolderofGullWingfootprint1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。(h≧1/2T)。3.腳跟(Heel)沾錫角需90度。1.Widthofsolderfilletbetweenleadandland(X)shallover2/3leadfootprint(L)2.Minimumsolderfilletflowsupendmorethan1/2thicknessofleadonheel3.Wettingangle＜90∘onheel1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。2.腳跟(Heel)焊錫帶涵蓋高度h小於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角≧90度。(MI)4.Whicheverisrejected.允收狀況(AcceptCondition)LX=2/3LLX2/3Lh≧1/2TTh1/2TT理想狀況(TargetCondition)SMT焊點性工藝標準--鷗翼(Gull-Wing)腳面焊點最大量SMDsolderjointworkmanshipcriteria--MaximumsolderofGullWingfootprint1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Goodsolderflowupandconcavefilletbetweenlandandlead2.Concavesolderfilletbetweensidefaceofleadandland3.Theshape(profile)oflead(footprint)beclearlyvisible1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whicheverisrejected.1.solderflowcovertheend(TIP)oflead2.Theshape(profile)ofleadnotbevisibleclearly3.Whicheverisrejected拒收狀況(RejectCondition)允收狀況(AcceptCondition)理想狀況(TargetCondition)拒收狀況(RejectCondition)SMT焊點性工藝標準--鷗翼(Gull-Wing)腳跟焊點最大量SMDsolderjointworkmanshipcriteria--MinimumsolderofGullWingHeel1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註：Ａ：引線上彎頂部Ｂ：引線上彎底部Ｃ：引線下彎頂部Ｄ：引線下彎底部1.SolderflowuptothecenterbetweenB,Cpointontheheeloflead1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)