半导体封装制程与设备材料知识介绍-PPT

半导体封装制程与设备材料知识简介PrepareBy：WilliamGuo2007.11Update半导体封装制程概述半导体前段晶圆wafer制程半导体后段封装测试封装前段（B/G-MOLD）－封装后段（MARK-PLANT）－测试封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離，並外接信號線至導線架上分离而予以包覆包装测试直至IC成品。半导体制程Oxidization(氧化处理)Lithography(微影)Etching(蚀刻)DiffusionIonImplantation(扩散离子植入)Deposition(沉积)WaferInspection(晶圆检查)Grind&Dicing(晶圓研磨及切割)DieAttach(上片)WireBonding(焊线)Molding(塑封)Package(包装)WaferCutting(晶圆切断)WaferReduce(晶圆减薄)LaserCut&packagesaw(切割成型)Testing(测试)Lasermark(激光印字)IC制造开始前段結束后段封装开始製造完成封裝型式(PACKAGE)ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)8~64DIPDualIn-linePackagePlastic2.54mm(100miles)1directionlead3~25SIPSingleIn-linePackage封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic2.54mm(100miles)1directionlead16~24ZIPZigzagIn-linePackagePlastic1.778mm(70miles)20~64S-DIPShrinkDualIn-linePackage封裝型式ThroughHoleMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramicPlastic2.54mm(100miles)half-sizepitchinthewidthdirection24~32SK-DIPSkinnyDualIn-linePackageCeramicPlastic2.54mm(100miles)PBGAPinGridArray封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesPlastic1.27mm(50miles)2directionlead8~40SOPSmallOutlinePackagePlastic1.0,0.8,0.65mm4directionlead88~200QFPQuad-FlatPack封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27,0.762mm(50,30miles)2,4directionlead20~80FPGFlatPackageofGlassCeramic1.27,1.016,0.762mm(50,40,30miles)20~40LCCLeadlessChipCarrier封裝型式SurfaceMountShapeMaterialLeadPitchNoofI/OTypicalFeaturesCeramic1.27mm(50miles)j-shapebend4directionlead18~124PLCCPlasticLeadedChipCarrierCeramic0.5mm32~200VSQFVerySmallQuadFlatpackAssemblyMainProcessDieCure(Optional)DieBondDieSawPlasmaCardAsyMemoryTestCleanerCardTestPackingforOutgoingDetaping(Optional)Grinding(Optional)Taping(Optional)WaferMountUVCure(Optional)LasermarkPostMoldCureMoldingLaserCutPackageSawWireBondSMT(Optional)半导体设备供应商介绍-前道部分PROCESSVENDORMODELSMT-PRINTERDEKHOR-2ISMT–CHIPMOUNTSIMENSHS-60TAPINGNITTODR3000-IIIINLINEGRINDER&POLISHACCRETECHPG300RMSTANDALONEGRINDERDISCO8560DETAPINGNITTOMA3000WAFERMOUNTERNITTOMA3000DICINGSAWDISCODFD6361TSKA-WD-300TPROCESSVENDORMODELDIEBONDHITACHIDB700ESECESEC2007/2008ASMASM889898CUREOVENC-SUNQDM-4SWIREBONDERK&SK&SMAXUMULTRASKWUTC-2000ASMEagle60PLASMACLEANMARCHAP1000TEPLATEPLA400MoldTOWAYPS-SERIESASAOMEGA3.8半导体设备供应商介绍-前道部分常用术语介绍1.SOP-StandardOperationProcedure标准操作手册2.WI–WorkingInstruction作业指导书3.PM–PreventiveMaintenance预防性维护4.FMEA-FailureModeEffectAnalysis失效模式影响分析5.SPC-StatisticalProcessControl统计制程控制6.DOE-DesignOfExperiment工程试验设计7.IQC/OQC-Incoming/OutingQualityControl来料/出货质量检验8.MTBA/MTBF-MeanTimebetweenassist/Failure平均无故障工作时间9.CPK-品质参数10.UPH-UnitsPerHour每小时产出11.QC7Tools(QualityControl品管七工具)12.OCAP(OutofControlActionPlan异常改善计划)13.8D(问题解决八大步骤)14.ECNEngineeringChangeNotice(制程变更通知)15.ISO9001，14001–质量管理体系前道ＦＯＬ后道EOLWireBond引线键合Mold模塑LaserMark激光印字LaserCutting激光切割EVI产品目检SanDiskAssemblyProcessFlowSanDisk封装工艺流程DiePrepare芯片预处理ＤieAttach芯片粘贴WaferIQC来料检验PlasmaClean清洗PlasmaClean清洗SawSingulation切割成型SMT表面贴装PMC模塑后烘烤SMT（表面贴装）---包括锡膏印刷(Solderpasteprinting),置件(Chipshooting),回流焊(Reflow),DI水清洗(DIwatercleaning),自动光学检查(Automaticopticalinspection),使贴片零件牢固焊接在substrate上StencilSubstrateSolderpastepringtingChipshootingReflowOvenDIwatercleaningAutomaticopticalinpectionCapacitorDIwaterCameraHotwindNozzlePADPADSolderpasteDiePrepare(芯片预处理)ToGrindthewafertotargetthicknessthenseparatetosinglechip---包括来片目检(WaferIncoming),贴膜(WaferTape),磨片(BackGrind),剥膜(Detape),贴片(WaferMount),切割(WaferSaw)等系列工序,使芯片达到工艺所要求的形状,厚度和尺寸,并经过芯片目检(DVI)检测出所有由于芯片生产,分类或处理不当造成的废品.WafertapeBackGrindWaferDetapeWaferSawInlineGrinding&Polish--AccretechPG300RMTransferCoarseGrind90%FineGrind10%CentrifugalCleanAlignment&CenteringTransferBackSideUpwardDe-tapingMountKeyTechnology:1.LowThicknessVariation:+/_1.5Micron2.GoodRoughness:+/-0.2Micron3.ThinWaferCapacity:Upto50Micron4.All-In-Onesolution,ZeroHandleRisk2.Grinding相关材料ATAPE麦拉BGrinding砂轮CWAFERCASSETTLE工艺对TAPE麦拉的要求：1。MOUNTNodelaminationSTRONG2。SAWADHESIONNodieflyingoffNodiecrack工艺对麦拉的要求：3。EXPANDINGTAPEDiedistanceELONGATIONUniformity4。PICKINGUPWEAKADHESIONNocontamination3.Grinding辅助设备AWaferThicknessMeasurement厚度测量仪一般有接触式和非接触式光学测量仪两种；BWaferroughnessMeasurement粗糙度测量仪主要为光学反射式粗糙度测量方式；4.Grinding配套设备ATaping贴膜机BDetaping揭膜机CWaferMounter贴膜机WaferTaping--NittoDR300IICutTapeTapingAlignmentTransferTransferBackKeyTechnology:1.HighTransferAccuracy:+/_2Micron2.HighCutAccuracy:+/-0.2mm3.HighThroughput:50pcswafer/Hour4.ZeroVoidandZeroWaferBrokenDetapingWafermountWaferframe晶圓切割(Dicing)Dicing设备:ADISCO6361系列BACCERTECH东京精密AW-300TMainSectionsIntroductionCuttingArea:Spindles(Blade,Flange,CarbonBrush),CuttingTable,Axes(X,Y1,Y2,Z1,Z2,Theta),OPCLoaderUnits:Spinner,Elevator,Cassette,RotationArmBladeClose-ViewBladeCuttingWaterNozzleCoolingWaterNozzleDieSawing–Disco6361KeyTechnology:1.Twin-SpindleStructure.2.X-axisspeed:upto600mm/s.3.SpindleRotarySpeed:Upto45000RPM.4.CuttingSpeed:Upto80mm/s.5.Z-axisrepeatability:1um.6.PositioningAccuracy:3um.RearFrontAFewConceptsBBD(BladeBrokenDetector)Cutter-set:Contac