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主板架构介绍主板基础知识如果把中央处理器CPU比喻为整个电脑系统的心脏，那么主板上的芯片组就是整个身体的躯干。在电脑界称设计芯片组的厂家为CoreLogic，Core的中文意义是核心或中心，光由字面的意义就足以看出其重要性。对于主板而言，芯片组几乎决定了这块主板的功能，进而影响到整个电脑系统性能的发挥，芯片组是主板的灵魂。芯片组（Chipset）是主板的核心组成部分，按照在主板上的排列位置的不同，通常分为北桥芯片和南桥芯片。北桥芯片一般提供对CPU的类型和主频、内存的类型和最大容量、ISA/PCI/AGP插槽、ECC纠错等支持，通常在主板上靠近CPU插槽的位置，由于此类芯片的发热量一般较高，所以在此芯片上装有散热片。北桥芯片在芯片组中起着主导性的作用，也称为主桥（HostBridge）。南桥芯片主要用来与I/O设备及ISA设备相连，并负责管理中断及DMA通道，让设备工作得更顺畅，其提供对KBC(键盘控制器)、RTC(实时时钟控制器)、USB(通用串行总线)、传输UltraDMA/33(66)EIDE数据方式和ACPI(高级能源管理)等的支持，在靠近PCI槽的位置。南北桥命名规则INTEL南桥命名规则：南桥ICH的编号都是82801，其后的第一个字母代表第几代晶片，如82801Gx就是ICH7系列。第二个字母B为Base、不支持RAID，R代表支持Raid，M标识Mobile；INTEL915系列之后的北桥命名规则：G是主流集成显卡芯片组，支持主流的FSB和内存，支持PCI-E×16；P也是主流版本，但无集成显卡；PL相对于P是简化版本，在支持的FSB和内存上有所缩水，无集成显卡，支持PCI-E×16；M为Mobile平台；名词解释FSB:(FrontSideBus)前端系统总线GMCH:(GraphicsandMemoryControllerHub)图形和内存控制中心MCH:(MemoryControllerHub)内存控制中心ICH:(I/OControllerHub)I/O控制中心PCH:(Platformcontrollerhub）平台控制中心MCP:(Multi-chippackage)两个独立的dies：processorcore和GPU/memorycore主要的芯片组及CPU厂商主要的芯片组厂商：•INTEL•VIA（威盛）•AMD（超威）•SIS（矽统）主要的CPU厂商：•INTEL•VIA（威盛）•AMD（超威）INTEL系列主板架构2007LowPowerPlatform-SantaRosaICH8MorICH8EMIntel®GME965ExpressGMCH(Crestline)SupportforMediaExpansionCardGen4.0GMAPCIExpress*x16GraphicsIntel®HighDefinitionAudio,8IndependentDMAAudioEngines10Hi-SpeedUSB2.0Ports6PCIExpress*x1DDR2533/6673SATAPorts4PCIBusMastersDDR2533/667BIOSSupportIntel®Core™2Duo(Merom)Intel®Celeron®M(Merom)LPCorSPI8GBs533/800MTSFSBSDVOLVDSFlatpanel/TV/CRT82566DMNinevahGbEChipsetSupport:•965GMExpressChipset+ICH8M•DDR2533/667,1-2channels,4GBmax•Graphics,Video&AdvancedI/O(onMCH):–Gen4Corewith8executioncores–Videopost-processingenhancements–Advanceddisplaycapabilities(LVDS24bpp)•AdvancedI/O(onICH):–PCIExpress:6ports–Integrated10/100LANMAC(optional)–Intel®ActiveManagementTechnology(AMT,optional)–LegacyI/Oincluding3xSATA,4xPCI,10xUSB2.0Software•OSSupport:MicrosoftXPe,SuSeEnterpriseLinux,RedHatEnterpriseLinuxforPOS,QNXNeutrino•BIOS&DriverSupport:EmbeddedGraphicsDriver(IEGD),LegacyBIOSandEFIBIOS2008MenlowforEmbeddedPlatformDDR2400/533(memorydownorSODIMM)400/533MT/sCMOSFSBPoulsboFWHSIOSDVO24bitLVDS8*USB2.0PortsIntel®HighDefAudioLPCGPIOSMBusSilverthorne2x1PCIExpress3portsECSPISupportedProcessors•1.6GHz/533MHz/2W/512K•1.33GHz/533MHz/2W/512K•1.1GHz/400MHz/2W/512KSCH•SinglechipSCH(GMCH+ICH)Memory•SingleChannel•DDR2400/533•2GBMaxMemoryGraphics•LowPowerGraphicsCore•DualIndependentDisplays•InternalLVDSIOSupport•1PATA(Master/Slave)•2-(x1)PCIePorts•8USB(1client)•Intel®HighDefinitionAudio2008Navy-PierPlatform(Intel®Atom™ProcessorN270,945GSE,ICH7M)Intel®Atom™ProcessorN270•45nmtechnology;22x22mmpackage•TDP~2.5W•Hyper-Threadingtechnology,C4lowpowerstate•Intel®945GSE•27x27mmpackage•TDP=3.5W(dependsonconfig.)•LVDS,VGA,SDVO•IntelGeneration3.5IntegratedGFXCore(133MHz)•SingleChannelDDR2400/533–1SO-DIMM+MemoryDown–B/W:5.3GB/s(1Ch)•Intel®ICH7•31x31mmpackage•TDP~1.5W•4PCIe,4PCI•2SATA,1PATA•Intel®HighDefinitionAudio•10/100LANcontroller•8USB2portsFSB533MHzx2DMIDDR2533x1SO-DIMMPCIeWifimini-cardSIOLANPCIex2x6ATA/100x2LVDSVGASDVO/DVICodecParallelGbETPMSerialPS2945GSEICH7-MIntel®Atom™ProcessorN270SC,1.6GHz2009Luna-PierPlatform(Pineview-MProcessor,ICH8M)Pineview-MProcessor•22mmx22mmpackage•TDP~5.5W•512KBcache•TDP~2.5W2GBMaxMemory•SingleChannelDDR2667•IntegratedGraphicsController•Intel®ICH8M•31x31mmpackage•TDP~2.4W•6PCIe,4PCI•3SATA,1PATA•Intel®HighDefinitionAudio•10/100/1000EthernetMAC•10USB2.0ports•O/SSupport•WindowsXP,XPe,WEPOS,WinCE•FedoraCore8•VxWorks•MontaVistaLinux*•QNXNeutrinoICH8MSIO10Hi-SpeedUSB2.0Ports1IDEChannelIntel®HighDefinitionAudioLPC4PCI6PCIExpressx1Lanesx4DMIVGALVDSDDR2SO-DIMMTPMGbELANPineview-MMicroprocessorDX9Graphics:200MHzDDR2MemoryController(SingleChannel)3SATALPCSPIFlashDeviceSPI2010Luna-PierRefreshPlatform(Pineview-DSC/DCProcessor,ICH8MPineview-D**Processor•SingleandDualcoreSKUs•FanlessdesigncapabilityforbothSKUs•400Mhzgraphicsengine•45nmtechnology•512KbL2cache•KitTDP:~13W(SC)/~17W(DC)•64bitDDR2667-4GBMax•SingleMemoryChannel•Intel®64,HT,XDBit•Intel®ICH8-M•GbE(10/100/1000)MAC•Intel®HighDefinitionAudio•3SATAPorts•6x1PCIExpressPorts•10USBPortsICH8MFWHSIO10Hi-SpeedUSB2.0Ports1IDEChannelIntel®HighDefinitionAudioLPCorSPI4PCI6PCIExpressx1LanesVGALVDSDDR2SODIMMx4DMITPMGbELAN3SATAPineviewDSC/DC2010LOWPowerPlatform-Calpella1313Notes:1:OnlyonClarkdale,Arrandale2:Notallfeaturesenabledonallproducts3:FormerlycalledIbexPeakICHProcessorI/OClocksGraphicsmovesintoProcessor1MemoryControllermovesintotheProcessorDisplaymovesintoPCHIntel®ManagementEnginemovesintoPCHClockBuffersintegrateintoPCHProcessorDDR3IMCPCIeGraphicsGFXI/OMEDisplayDisplayClockBufferDMIIntel®FlexibleDisplayInterface(Intel®FDI)DDR2/DDR3DisplayPCIeGraphicsDMIFSBMEiGFXIMCDisplayIntel®4SeriesChipsetIntel®5seriesChipset3Today’s3-ChipSolution2-ChipSolutionArrandale是下一代64位32nm工艺制程的处理器；该处理器内部集成了图形和内存控制器，图形和内存控制器是45nm制程；Arrandale支持两种封装：A37.5x37.5mmrPGApackage(rPGA988A)A34x28mmBGApackage(BGA1288)QM57可搭配的CPU：Intel(r)CoreTMi7-620MProcessorPGASVIntel(r)CoreTMi7-610EProcessorBGASVIntel(r)CoreTMi7-620LEProcessorBGALVIntel(r)CoreTMi7-620UEProcess