锡膏印刷技术

SMT()1/A.B.100m250m2/(B.1)1.2.0.65mmPitch(B.1)2.0.65mmPitch(B.1)3.0.65mmPitch3.0.65mmPitch(B.1)4.5.6.2(A)(Solderpaste)(Reflow)2(B)(adhesive)Reflow22(C)(squeegee)1.(particlesizeshape)2.(viscosity)PCBpadPCBpad3.(metalcontent)Reflow4.5.(Reflow)63%37%Reflow183…1.Reflow2.3.(1).(2)./4.1.2.3.4.PCB4.PCB1.2.:PCB3.:PCB2D/3D…3.:PCB2D/3D…1.(Downpressure):/PCB/…1.(Downpressure):/PCB/…2.(Traversespeed):cycletime3.(Attackangle):/4.(Snap-off):1.:PAD…2.:PADShort3.:4.:A.B.PCBC.LaserD.AOIE.2D/3DE.2D/3D2.:PADShort