去胶渣原理

RCKWOODELECTRONICMATERIALSElectrochemicals除膠渣劑主要功能：除膠渣劑是一種鹼性溶液,它能打斷樹脂系統中的鍵結,將已膨鬆軟化的之樹脂及膠渣完全的咬蝕，並予以去除主要特性：此為一強氧化劑，咬蝕能力強，且咬蝕能力與濃度及溫度成正比RCKWOODELECTRONICMATERIALSElectrochemicals氧化之反應機構4MnO4-+4OH-4MnO42-+2H2O+O2[1]2MnO42-+2H2O2MnO2+4OH-+O2[2][1]+[2]2MnO4-MnO42-+MnO2+O2樹脂:－OCH2CHCH2O+6MnO4-3MnO42-+3MnO2+3CO2+3H2OOHCCH3CH3MnO4-COO-K+(可溶)RCKWOODELECTRONICMATERIALSElectrochemicals再生電極EPR4MnO4-2+O2+2H2O4MnO4-+4OH-陽極(例如Ti):2Mn+6-2e-2Mn+74OH--4e-2H2O+O2陰極(例如Cu):4H++4e-2H2RCKWOODELECTRONICMATERIALSElectrochemicalsMnO4-2再生方法化學再生法:SPSMnO4-2+S2O8-2+H2OMnO4-+2SO4-2+OH-*一次添加不宜超過10g/l*槽內有板子時不可添加再生鹽RCKWOODELECTRONICMATERIALSElectrochemicalsEPR注意事項*EPR需24小時持續操作*當MnO4-2持續升高時,EPR需拆下清洗,可利用中和劑槽液浸泡,直到無反應為止,並檢查銅棒是否完好*每台EPR的最大操作電流為150安培*EPR把手的部份接正極,面板中間的銅棒接負極;如果接正負極接反,則銅棒會被溶解而失去功能RCKWOODELECTRONICMATERIALSElectrochemicals中和劑主要功能：主要是將殘留於板面及孔壁內的二氧化錳及高錳酸鹽類物質除去，以利於後製程金屬化流程主要特性：此為一還原劑，對於強氧化劑有很好的中和效果RCKWOODELECTRONICMATERIALSElectrochemicals2MnO4-+2NH2OH+3H2SO42MnSO4+K2SO4+6H2O+N2+O25MnO42-+4NH2OH+10H2SO45MnSO4+5K2SO4+16H2O+2N2+4O25MnO2+2NH2OH+5H2SO45MnSO4+8H2O+N2+2O2中和之反應機構註:MnSO4可溶、無色RCKWOODELECTRONICMATERIALSElectrochemicals實驗計劃研究(DOEStudy)找出並篩選實驗因子實驗室中進行第一階段實驗計劃篩選主要因子實驗室中進行第二階段實驗計劃現場進行第三階段實驗計劃考慮各種藥劑之影響考慮最佳之操作條件範圍考慮設備因子RCKWOODELECTRONICMATERIALSElectrochemicals板材之實驗計劃研究CoreMaterial:板材FR406,FR5,FR4,BT,PI….ResinDielectrics:樹脂介電材料Ajinomoto,ToshibaChem.(RSC),Mitsui(RCC),HitachiChem.(PP),Polyclad….InkDielectrics:油墨介電材料TaiYo200BC1,TaiYo200BC2,TaiYo200BG2,TaiYo700,CiBa7135….RCKWOODELECTRONICMATERIALSElectrochemicalsFR4-Tg132℃BlankAfterDesmearWeightLoss0.2~0.5mg/cm2RCKWOODELECTRONICMATERIALSElectrochemicalsFR406-Tg170℃H-TypeWeightLoss0.2~0.25mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsFR406-Tg170℃V-TypeWeightLoss0.2~0.3mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsFR5-Tg170℃WeightLoss0.2~0.3mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsGetek-Tg175℃WeightLoss0.05~0.1mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsFR-408-Tg180℃WeightLoss0.08~0.15mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsCyanate-Tg200℃WeightLoss0.1~0.12mg/cm2BlankAfterDesmearRCKWOODELECTRONICMATERIALSElectrochemicalsMitsui(RCC)-Tg145℃BlankAfterDesmearPeelStrength=0.8kg/cmRCKWOODELECTRONICMATERIALSElectrochemicalsTaiyo700-Tg170℃PeelStrength=1.1~1.2kg/cmSideASideBRCKWOODELECTRONICMATERIALSElectrochemicalsTaiyo200BG2-Tg130℃PeelStrength=1.4~1.6kg/cmSideASideAtilt30RCKWOODELECTRONICMATERIALSElectrochemicalsTaiyo200BC2-Tg130℃PeelStrength=1.8~2.0kg/cmSideASideAtilt30RCKWOODELECTRONICMATERIALSElectrochemicalsCiba7135-Tg135℃PeelStrength=1.5~1.7kg/cmSideAtilt30SideARCKWOODELECTRONICMATERIALSElectrochemicalsCiba7190-Tg135℃PeelStrength=1.5~1.7kg/cmSideASideBRCKWOODELECTRONICMATERIALSElectrochemicals生產品質控制項目ControlrangeWeightLoss0.15–0.25mg/cm2(FR-4、Tetra)MicrosectionNosmearSEMNosmearandgoodroughnessRCKWOODELECTRONICMATERIALSElectrochemicalsWEIGHTLOSSTEST1.取25CM2大小之裸板(不含銅)兩片2.用水洗淨置於烤箱,設定110℃烘烤10分鐘3.取出冷卻3分鐘,稱重至小數點以下4位記錄為W14.將裸板與生產板一起走完DesmearLine5.水洗後取出置於烤箱,設定110℃烘烤10分鐘6.取出冷卻3分鐘,稱重至小數點以下4位記錄為W27.計算:8.控制考範圍:依製程需求規範)(2)(21.2cmmgWWLossWeight寬長RCKWOODELECTRONICMATERIALSElectrochemicalsCH3|-C-|CH3OH|-O-CH2-CH-CH2-O-OCH2-CH-CH2-O-O-O-CH2-CH-CH2CH3|-C-|CH3n•EPOXYCHEMISTRY•BROMINATEDEPOXYRESINOOBr*－－X－*n•TERABROMOBISPHENOLABrBrCH3HO－－OHCH3BrBr•BREN-SOHOHOHBrBrBrnHBrBrOHOHRCKWOODELECTRONICMATERIALSElectrochemicalsOXIDIZERMECHANISMEPOXYRESIN:－OCH2CH2O+6MnO4-3MnO42-+3MnO2+3CO2+3H2OOHCCH3CH3MnO4-COO-(solute)CCH3CH3MnO4-COO-BrCCH3CH3BrorBr(solute)COO-BrBrBrorRCKWOODELECTRONICMATERIALSElectrochemicals操作條件規範流程操作條件操作時間滴水時間溫度換槽頻率膨鬆劑SolII:35?%5'-7'10～1570?℃3000SF/GAL膨鬆劑H/A:15?%H/B:4.0?%5'-7'10～1560?℃3000SF/GAL去膠渣劑Mn+7:75?5g/lMn+6:30g/l102:4.0?%12'-15'10～1575?℃3000SF/GAL中和劑Neu:10?%H2SO4:4.0?%5'-7'10～1540?℃700SF/GALRCKWOODELECTRONICMATERIALSElectrochemicals配槽規範流程配槽方式操作條件備註膨鬆劑SolII:35%SolII:35?%膨鬆劑H/A:15%H/B:4%H/A:15%?%H/B:4%?%需均勻攪拌才可進行取樣分析去膠渣劑101:75g/l102:4%Mn+7:75?5g/lMn+6:30g/l102:4.0?%需加溫至控制溫度才可進行取樣分析中和劑Neu:10%H2SO4:20%Neu:10?%H2SO4:4.0?%RCKWOODELECTRONICMATERIALSElectrochemicalsDesmear設備規格流程過濾攪拌震盪器TANK材質加熱器材質循環turn數膨鬆劑VVSUS316SUS3166-7回收槽PP,PEWR2AIRPP,PE除渣槽AIRVSUS316,TiSUS316,Ti回收槽PP,PEWR2AIRPP,PE中和劑VVPP,PETEFLON3-5WR2AIRPP,PERCKWOODELECTRONICMATERIALSElectrochemicals常見之電路板樹脂熱固型(ThermosettingResin)樹脂：酚醛樹脂(PhenolicResin)環氧樹脂(EpoxyResin)聚亞醯胺樹脂(PolyimideResin,PI)聚四氟乙烯(Polytetrafluorethylene,PTFE)聚氰酸酯樹脂(PolycyanateEsterResin)RCKWOODELECTRONICMATERIALSElectrochemicals環氧樹脂的形成機構2CH2—CH—CH2—ClHOCCH3CH3OHO苯二酚環氧氯丙烷RCKWOODELECTRONICMATERIALSElectrochemicals常見的環氧樹脂架橋劑Dicyandimide,Dicy,H2NCNHCN聯胺(Diamine),NH2．NH2二乙三胺(Diethylenetriamine),NH2(CH2)2NH(CH2)2NH2NHRCKWOODELECTRONICMATERIALSElectrochemicals膨鬆原理