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1/P138*ProcessModule說明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(ShearmaterialtoSize)B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)C.乾膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)Developing,Etching&Stripping(DES)2/P138d-3鉚釘組合(eyelet)d-4疊板(Layup)d-5壓合(Lamination)d-6後處理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction)e-1薄化銅(CopperReduction)F.電鍍(HorizontalElectrolyticPlating)f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂帶研磨(BeltSanding)f-6剝錫鉛(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)H.防焊(綠漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3靜電噴塗(SprayCoating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)h-7顯影(Develop)h-8後烘烤(Postcure)3/P138h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11噴砂(Pumice)(WetBlasting)h-12印可剝離防焊(PeelableSolderMask)I.鍍金Goldplatingi-1金手指鍍鎳金(GoldFinger)i-2電鍍軟金(SoftNi/AuPlating)i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)J.噴錫(HotAirSolderLeveling)j-1水平噴錫(HorizontalHotAirSolderLeveling)j-2垂直噴錫(VerticalHotAirSolderLeveling)j-3超級焊錫(SuperSolder)j-4.印焊錫突點(SolderBump)K.成型(Profile)(Form)k-1撈型(N/CRouting)(Milling)k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜邊(BevelingofG/F)L.短斷路測試(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光學檢查(AOIInspection)l-2VRS目檢(Verified&Repaired)l-3汎用型治具測試(UniversalTester)l-4專用治具測試(DedicatedTester)l-5飛針測試(FlyingProbe)M.終檢(FinalVisualInspection)m-1壓板翹(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包裝及出貨(Packing&shipping)4/P138m-4目檢(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6護銅劑(ENTEKCu-106A)(OSP)m-7離子殘餘量測試(IonicContaminationTest)(CleanlinessTest)m-8冷熱衝擊試驗(ThermalcyclingTesting)m-9焊錫性試驗(SolderabilityTesting)N.雷射鑽孔(LaserAblation)N-1雷射鑽Tooling孔(LaserablationToolingHole)N-2雷射曝光對位孔(LaserAblationRegistrationHole)N-3雷射Mask製作(LaserMask)N-4雷射鑽孔(LaserAblation)N-5AOI檢查及VRS(AOIInspection&Verified&Repaired)N-6BlaserAOI(afterDesmearandMicroetching)N-7除膠渣(Desmear)N-8微蝕(Microetching)5/P138A/W(artwork)底片Ablation燒溶(laser),切除abrade粗化abrasionresistance耐磨性absorptionabsorptionACC(accept)允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleration速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在製品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈;孔環anodeslime(sludge)陽極泥anodizing陽極處理AOI(automaticopticalinspection)自動光學檢測applicabledocuments引用之文件AQLsampling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)Asreceived到貨時6/P138backlighting背光back-up墊板bankedworkinprocess預留在製品basematerial基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊;斜邊biaxialdeformation二方向之變形black-oxide黑化blankcontroller空白對照組7/P138blankpanel空板blanking挖空blip彈開blister氣泡;起泡blistering氣泡blowhole吹孔board-thicknesserror板厚錯誤bondingplies黏結層bow;bowing板彎breakout從平環內破出bridging搭橋;橋接BTO(BuildToOrder)接單生產burning燒焦burr毛邊(毛頭)camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralprojection集中式投射線certification認證chamfer倒角(金手指)chamfering切斜邊;倒角characteristicimpedance特性阻抗chargetransferoverpotential電量傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯誤8/P138coefficientofthermalexpansion(CTE)熱澎脹系數coldsolderjoint冷焊點cold-weld金屬粉末冷焊color顏色colorerror顏色錯誤compensation補償competitiveperformance競爭力績效complexsalt錯化物complexor錯化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費性產品contactresistance接觸電阻continuousperformance連續發揮效能contractservice協力廠controlledsplit均裂式conventionalflow亂流方式conventionaltensiletest傳統張力測試法conversioncoating轉化層convex突出coordinatelist資料清單coppercladedlaminates(CCL)銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue(coppersplash)銅渣corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性coulombslaw庫倫定律countersink喇叭孔coupon試樣couponlocation試樣點coveringpower遮蓋力CPU中央處理器crack破裂;裂痕crazing裂痕;白斑crosslinking交聯聚合9/P138crosstalk呼應作用crosslinking交聯crystalcollection結晶收集curing聚合體currentefficiency電流效率cut-outs挖空cutting裁板cyanide氰化物cyclesoflearning學習循環cycle-timereduction交期縮短datecode週期deburring去毛頭dedicated專用型degradation退變delamination分層dent/pinhole凹陷/針孔departmentofdefense國防部designation字碼簡示法de-smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時間dimensionerror外形尺寸錯誤dielectricconstant介質常數difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensionalstability尺度安定性dimens