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摘要Ⅰ倒车雷达系统的研究与设计专业:电子信息科学与技术本科生:骆世刚摘要汽车倒车雷达是针对当前公路、街道、停车场、车库等越来越拥挤，加上存在视觉盲区，无法看见车后的障碍物，司机在倒车时很容易刮伤汽车，甚至发生事故的情况而出现的一种旨在倒车防护的汽车防撞系统。该系统能够在汽车以较低的速度进行倒车的过程中，识别出车后部的障碍物，并能够测量车与障碍物之间的距离，在车辆与障碍物发生碰撞前，发出声光报警，提醒司机刹车。本设计从实验研究分析的角度，分析了超声波测距原理以及国内外此类汽车倒车雷达存在的问题，提出了目前最简单、实用的一种倒车雷达实现方案，即基于成都国腾微电子公司GM3101倒车雷达芯片为核心的超声波测距倒车雷达,该芯片功能集成度高，外围只需接上超声波传感器和功率器件就可以实现整个系统功能，也不需要软件编程。同时设计中围绕目前呼声很高的汽车电器网络化实现，提出倒车雷达数据基于新型总线XY-CNBUS的传递方案。系统设计中采用了模块设计思想，简化了调试工作量，最终很好完成了超声波测距倒车雷达系统的硬件设计、软件设计及系统调试。关键词：汽车倒车雷达超声波GM3101芯片XY-CNBUS汽车电器网络化AbstractⅡAbstractAutomobileReversingRadar(‘ARR’)isaprotectionsystemwhichappearedintheconditionofthatthecarsarescratchedeasily,evensomeoftheaccidentshappenwhendriversreverse,forthereasonofthatthecurrenthighway,street,parkinglotsandgaragesaregettingmorecrowded,andthedriversareunabletoseeobstaclesbehindthevehiclebecauseoftheexistenceofvisualblindspots,aimedatpreventacarcrashwhenreversing.Thereversingradarsystem,whichcanrecognizethebarrieratthebackofcarwhenthevehiclesreverseatalowspeed,andiscapableofmeasuringthedistancebetweenthevehicleandobstacles,warnedthedriverstobrakeatthewayofsoundandlight,beforethecollisionoccurred.Thedesignanalyzeshowtheultrasonicmeasuredistanceandwhattheproblemoftheotherautomobilereversingradarswhichhaveappearedathomeandabroadare,fromtheperspectiveofresearchandanalysis.ThenintroducingthemostsimpleandpracticalwayatpresenttomaketheARR,thatis,theARRbasedintheGM8101chipwhichproducedinChengDuGuoTengMicroelectronicsCompany.Thechipisintegratedhighly,canfunctionasawholesystembyonlyconnectingtoexternalultrasonicsensorandpowerdevice,anddoesnotrequiresoftwareprogramming.Meanwhile,astheresearchaboutrealizingthevehicleelectricalnetworkisbecomingmoreandmorepopulartoday,aprogramthatthedataoftheARRistransferredinanewkindofbuscalledasXY-CN.Amodulardesignconceptwasusedattheprocessofdesigningthesystem,itsimplifiesthedebuggingworkload.Ultimately,hardwaredesign,softwaredesignandsystemdebuggingabouttheARRwascompletedverywell.Keywords：AutomobileReversingRadarultrasonicGM3101XY-CNBUSrealizationofthevehicleelectricalnetwork目录Ⅲ目录中文摘要···················································································ⅠAbstract····················································································Ⅱ目录····················································································Ⅲ第一章绪论············································································11.1研究背景···········································································11.2发展概况和当前存在的问题··················································11.2.1发展概况······································································11.2.2当前存在的问题·····························································41.3本设计的主要内容和目的·······················································5第二章系统相关理论与结构···················································62.1超声波的测距基本原理························································62.2XY-CN总线介绍································································72.2.1概述···········································································72.2.2系统由来····································································82.2.3XY-CNBUS型总线特点·················································9第三章硬件设计及调试·······················································113.1系统总体方案设计····························································113.2GM3101芯片···································································123.2.1概述·········································································123.2.2工作特征··································································123.2.3封装及引脚功能说明···················································133.2.4芯片具体功能及应用···················································133.3XY-CNBUS专用数字通讯芯片············································153.3.1CMT001芯片···························································153.3.2CMT001芯片应用参考电路·········································163.3.3CMT100芯片···························································173.3.4CMT100芯片应用参考电路········································173.4系统电路解析及工作原理···················································183.4.1上位机电路解析························································183.4.2下位机电路解析························································223.4.3工作原理·································································243.5实验安装及调试·······························································24目录Ⅳ3.5.1焊接········································································243.5.2调试过程及方法·························································25第四章软件设计及调试·······················································274.1系统软件设计整体介绍······················································274.2上位机软件设计·······························································284.2.1上位机程序主流程图···················································284.2.2雷达模块程序设计······················································294.2.3上位机接收数据程序设计·············································304.2.4上位机发送数