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1LCM制程简介©ChiMeiOptoelectronicsPage2LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage3LCM制程简介1st-外观检查(AppearanceInspection)作法:以目视检查目的：筛检LCD后流外观不良的Panel,如缺角、玻璃刮伤、残胶、CF玻璃突出等注意事项：取放面板时易造成玻璃缺角需特别小心；取放擦拭面板时需戴静电环并极力避免碰触到X、Y侧端子部分，以免产生静电不良©ChiMeiOptoelectronicsPage4LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage5LCM制程简介2nd-涂导电胶(ConductiveResinDispense)作法:在面板X、Y侧端子部分涂上导电胶目的：增强面板防止静电破坏的能力注意事项：取放面板时易造成玻璃缺角需特别小心；取放面板时需戴静电环并极力避免碰触到X、Y侧端子部分，以免产生静电不良©ChiMeiOptoelectronicsPage6LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage7LCM制程简介3rd-磨边(Beveling)重点：将面板X、Y侧端子部玻璃边磨平目的：将面板X、Y侧端子部玻璃边磨平避免玻璃棱角刮伤人员、部品，并藉以消除玻璃边内在应力避免玻璃受应力而产生裂痕、缺角，并将shortbar磨除注意事项：X、Y侧端子部玻璃边磨平是高温高摩擦的动作，需注意磨边时机器喷水是否正常，避免产生静电不良©ChiMeiOptoelectronicsPage8LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage9LCM制程简介4th-异物括除(CulletRemove)作法：用刮刀刮除玻璃面板上的异物目的：刮刀刮除玻璃面板上的异物，避免偏光板贴付时异物留存于面板与偏光板间造成不良注意事项：刮刀作动在面板上必须与面板平行接触，作动范围需涵盖整个面板©ChiMeiOptoelectronicsPage10LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage11LCM制程简介5th-洗净(WetClean)作法：用洗净液将面板洗净目的：用洗净液将面板上之异物冲洗干净©ChiMeiOptoelectronicsPage12LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage13LCM制程简介6th-贴偏光板(Polarizer)作法：将上下偏光板贴付于面板上下两侧目的：为使产品光学(影像)显示正常，面板需与上下偏光板贴合注意事项：上下偏光板与面板搭配的方式条件决定产品合光学特性，故上下偏光板贴付的方向精度需符合规格要求©ChiMeiOptoelectronicsPage14LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage15LCM制程简介7th-脱泡(AutoClave)作法：将偏光板贴付完成品置入高温加压炉内目的：利用压力及高温将偏光板与面板贴合时产生的气泡挤压出来或压小、并使面板与偏光板两者接合更紧密注意事项：抬放Cassette时须小心，避免摔破面板©ChiMeiOptoelectronicsPage16LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage17LCM制程简介8th-点灯测试(LOT)作法：将高温加压脱泡后半成品在LOT机台点灯检查目的：筛检磨边至偏光板贴付工程造成的的不良（如偏光板异物、偏光板胶等）及前工程（LCD厂）后流的品位不良品注意事项：检查工程需花费较多的眼力精神更需要仔细与耐心，确保不良不后流及避免筛检过严，才能避免材料浪费，成本损失©ChiMeiOptoelectronicsPage18LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage19LCM制程简介9th-OLB(TAB压着)作法：将面板与TABIC藉由ACF接合目的：使面板端子Lead与TABLead准确对位藉由ACF异方向导电的特性（上下导通，左右绝缘）接合导通，使面板内的TFT能接收到TABIC输出的正确讯号和资料注意事项：生产前的点检、确认事项必须确实©ChiMeiOptoelectronicsPage20LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage21LCM制程简介10th-OLBI(OLB测试)作法：将OLB半成品在OLBI机台点灯检查目的：检查OLB工程造成的的不良（如线欠陷、short等）注意事项：拿取半成品需小心避免碰触到TABLead，造成TABLead曲折。检查工程需花费较多的眼力精神更需要仔细与耐心，确保不良不后流及避免筛检过严，才能避免材料浪费，成本损失©ChiMeiOptoelectronicsPage22LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling磨边CulletRemove异物括除WetClean洗净Polarizer贴偏光板AutoClave脱泡LOT点灯测试OLBTAB压着OLBIOLB测试PCBPCB压着PCBIPCB测试SiliconeDispense涂防水胶Assy.组装FlickerAdjust闪烁调整Aging高温烘烤CTestC检DTestD检OQCPacking包装WareHouse.入库©ChiMeiOptoelectronicsPage23LCM制程简介11th-PCB(PCB压着)作法：将PCBA与TABIC藉由ACF接合目的：使PCBALead与TABLead准确对位藉由ACF异方向导电的特性（上下导通，左右绝缘）接合导通，使PCBA输出的逻辑控制讯号与资料能正确传送到TABIC输入端注意事项：生产前的点检、确认事项必须确实©ChiMeiOptoelectronicsPage24LCM制程简介制程重点解说.AppearanceInspection外观检查ConductiveResinDispense涂导电胶Beveling