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CompeqConfidential•PCBManufacturingProcessIntroductionbyCompeqCompeqConfidentialLaserviaBoardLaserviaBoardDoubleDouble--SideBoardSideBoardICSubstrateICSubstrateCPUModuleCPUModuleMultiMulti--LayerBoardLayerBoardMilestoneofCOMPEQMilestoneofCOMPEQ1970‘s1980‘s1990‘s2000‘sCompeqConfidentialCOMPEQPRODUCTTYPEDEMANDTECH.DEMANDPCBREQUIREMENTWORKSTATIONNOTEBOOKSERVERDESKTOPSIMM/DIMM/RIMMTelecomPDAMOBILEPHONEBASESTATIONEMAILPAGERICSubstratePBGAFC-PGAFC-BGACSPMULTI-TIERNetworkingSWITCHROUTERATMSWITCHREMOTEACCESSAPPEARANCESMALLERLIGHTERTHINNERFUNCTIONMOREFUNCTIONSBETTERQUALITYBETTERRELIABILITYCOMPLEXUNIONTHINNERBOARDHIGHPERFORMANCEMATERIALRCCTHINCOREHI-TGLOWDKHALOGEN-FREELEAD-FREETECHNOLOGYHDIMICROVIABURIED&BLINDVIAVIAONPAD/VIAVIABEHINDPADHIGHA/RPLATINGTHINBOARDPLATINGLEAD-FREEPROCESSSUPERSOLDERIMMERSIONGOLDIMMERSIONSILVEREMBEDDEDCAPACITOREMBEDDEDRESISTANCEPINLAMINATIONENVIRONMENTPROTECTIONHIGHDENSITYENVIRONMENTALFRIENDLYEQUIPMENTTHINCOREDESLINEHANDLINGFREELOAD/UNLOADMACHINEPINLAMINATIONMACHINEHORIZONTALBROWNOXIDELINEVERTICALDESMEAR&PTHPLATINGLINEHORIZONTALPLATINGLINEHIGHLAYERCOUNTCompeqConfidentialPCBFlowChartMeterialIssueDryFilmLaminationExposureDevelopingEtchingStrippingBlackOxideLaminationDrillingDesmearDeburrE_lessCu(PTH)PanelPlateOuterlayerImageTransferPattermPlatePureTinPlateEtchingOuterlayerAOISolderMaskFinishTypeHASL(Optional)LegendPrint(Optional)ViaCapping(Optional)G/FPlate(Option)ProfilingFinalInspectionandTestingFinishTypeOSP(Entek)(Optional)PackagingStockingFinishTypeImmersionSilver(Optional)InnerlayerAOIFinishTypeImmersionGold(Optional)CompeqConfidential內層製程壓板鑽孔雷射鑽孔PTHShadow外層電鍍外層蝕刻綠漆塞孔綠漆印字ProcessFlowIntroductionMetalFinish成型OSP測試包裝Desmear&DeburrRegularPCBHDI(A)發料CompeqConfidentialPleaseprovideustheexpectedPCBdimensioninadvance,Compeqiswillingtosubmitproposalforbetterpanelutilization!PanelizationAvailablesheetsizeAvailablePinLamsize36x4816x1840x4818x2142x4818x2442x4020x24(21x24)ItemsStandardSpecialMax.PanelSize20x2421x24Max.FinishBoardSize18x2219x22Borderperside(MassLam)0.750.65Borderperside(PinLam)1.21.0Distancebetweenboards(C)100mil80milCompeqConfidential內層板發料裁板作業(01,011)♦目的:將上游工廠生產大面積（48”*42”）基板以自動裁板機鋸切成所需要之尺寸（例:24”*21”）♦流程:依生產流程單規定之發料尺寸，輸入程式並檢查機台與鋸片狀況基板疊放整齊先予以修邊，裁出板材基本面自動裁板機按輸入程式數據，自動作業裁出需求規格裁出完成板材之板邊burr以細砂紙研磨後送交內層前處理CompeqConfidential製程（一）：前處理目的：去除板面之油漬、鉻、鋅等，並使銅面具有良好之粗糙度。流程：微蝕：微蝕槽(H2SO4/H2O2，SPS/H2SO4)→水洗(CT水)→烘乾電解脫脂：電解槽(NaOH、KOH)→水洗(CT水)→酸洗(HCL)→水洗-→烘乾製程（二）：壓膜目的：以熱壓滾輪將DRYFILM(UV光阻劑)均勻覆蓋於銅箔基板上壓膜機壓膜後的基板內層製程介紹(27,28,29)CompeqConfidential製程（三）：曝光目的：以UV光照射使底片之線路成像於基板之乾膜上原理：D/F之光起始劑→照光(UV)→自由基→聚合反應&交聯反應→線路成像製程（四）：顯影、蝕銅、去膜連線1.顯影：以1%Na2CO3沖淋，使未成像(CURING)之乾膜溶於鹼液中，並以CT水沖洗板面，將殘留在板面之乾膜屑清除。2.蝕刻：以蝕刻液(CuCL2、HCL、H2O2)來咬蝕未被乾膜覆蓋之裸銅，使不須要之銅層被除去，3.去膜：以3%之NaOH將留在線路上之乾膜完全去除，內層板即成形蝕刻、去膜後的內層板內層蝕刻線內層顯影線CompeqConfidentialInnerLayerImageTransferdryfilmCuCucuringcuringuncuredLightPPPPCucuringcuringCucuringcuringCuPPPPCuCuPPDryFilmLaminationResistExposureStripResistExposureCopperEtchingResistStrippingCompeqConfidential內層製程CompeqConfidential壓板製程(25A)•氧化（BLACKOXIDE）:粗化金屬銅面以增加與膠片材料間的結合力。•壓板：接續內層製程，將已進行ImageTransfer之內層ThinCore透過熱壓製程將其結合成多層板–壓合：利用高溫(180℃)高壓(480Psi)將B-Stage之Epoxy轉化成C-Stage，提供層間機械結合力與層間所需之介電層厚度–後處理：利用X-Ray鑽孔機鑽出後續鑽孔製程所需之基準工具氧化處理後的內層板氧化處理線CompeqConfidential壓板製程CompeqConfidential鑽孔製程(02A)•鑽孔：為使電路板之線路導通及插件,必須有導通孔及插孔.這些孔必須以高精密之鑽孔製程來產生，而鑽孔在PCB流程為重要製程之一。–進刀速Feed(IPM)及轉速Speed(KRPM)：此兩者對孔壁品質有決定性之影響。若二者搭配不好則孔壁會有粗糙(Roughness)，膠渣(Smear),毛邊(Burr)，釘頭(Nailhead)等缺點–分段鑽：鑽小孔時若採一段鑽，因排屑量急增鑽頭易被阻塞而造成斷針。使用分段將孔鑽透可改善排屑，斷針及精確度不良之缺點CompeqConfidential鑽孔製程CompeqConfidentialPTH(05,053)•化學鍍銅&一次銅：將孔內非導體利用無電鍍方式使孔導通，並利用電鍍方式加厚孔銅及面銅厚度•流程：–活化(催化劑)：使錫膠體附著於孔壁，利用錫鈀膠體外有氯離子團(負電)和孔壁介面活性劑(正電)形成凡得瓦力鍵結–加速劑：剝除板面及孔內之錫膠體層，使裸露出來之鈀層易與化學銅附著–化學銅(甲醛+Cu2++NaOH)：利用甲醛當還原劑、當催化劑，在鹼性藥液中把Cu2還原成Cu附在表面上–電鍍一次銅：加厚孔銅及面銅厚度化學鍍銅&一次銅化學鍍銅&一次銅後的多層板CompeqConfidentialPTHCompeqConfidentialSurfacePretreatment073DryFilmLamination07ResistExposure07ResistDeveloping07PatternPlating08ResistStrippingAOI(14-Micro)+VRS17SolderResistPretreatmentPanelPlating05ImageTechnologyCopperEtchingTinStrippingSESLine13OutterLayerProcessCompeqConfidentialImageTechnologyDryFilmLaminationResistExposureResistDevelopingPatternPlatingCucuringcuringPPCuPlatingTinCuPPCuPlatingTinCuPPCuPlatingCuPPCuPlatingTindryfilmCuCucuringcuringuncuredLightCucuringcuringPPPPPPResistStrippingCopperEtchingTinStrippingCompeqConfidential外層製程CompeqConfidential電鍍製程(鍍二銅08)•二次銅：補足一次銅孔銅及面銅線路厚度，達客戶要求•流程：–咬銅使線路上之銅rough，易於電鍍；同時使線路上之scum剝離–酸洗(H2SO4)：–預浸，與電鍍液保持相同酸度；同時去除銅線路上之氧化膜–鍍二次銅（CuSO4solution，陽極為銅球）：•鍍錫：在銅線上鍍錫作為EtchingResistor，使在蝕銅時避免咬蝕到銅線路CompeqConfidential電鍍製程CompeqConfidential外層蝕刻(13)•去膜蝕銅剝錫：利用蝕刻方式咬去多餘面銅使線路成形•流程：–去膜(KOH)：去除鍍二次銅時之PlatingResistor–蝕銅(Cu2++NH4OH+NH4Cl)：利用Cu(NH4)4Cl2去攻擊沒有錫保護的銅面，只留下鍍一層錫的銅線路–剝錫(HNO3+護銅劑)：利用硝酸剝去在銅線路上之錫，使銅線路成形CompeqConfidential外層蝕刻CompeqConfidential綠漆塞孔(18,183)•近年來為防止免洗助焊劑進孔，而對大型零件（如BGA）肚底如啞鈴狀佈線之狗骨導孔（DogBoneVia）要求綠漆塞孔，目前許多手機板不但要求全部塞孔，且已在滿塞度上有所要求•流程：–以SCREENPRINT方式,於客戶指定位置之零件區進行塞孔–預烘(precure)：主要目的為趕走油墨中之溶劑，成為不黏(Tackfree)狀態。CompeqConfidential綠漆塞孔CompeqConfidential綠漆(182,189,39,54)•SOLDERMASK：為保護電路板上線路，避免因刮傷造成短、斷路現象和達成防焊功