SMT-PMP标准范文

版本CI编号实施日期变更原因变更描述起草人Rev.CINo.EffectiveDateReasonOfChangeChangeDescriptionOriginatorACI-0304111月21日新版本发行新版本发行林宪BCI-048624月9日版本升级增加SPC魏祥桔C6月3日版本升级增加PBA工段林宪FormNo.:38FM-A003-016Rev.04-历史记录RevisionHistory-PROCESSFLOW/MANAGEMENTPLAN（工艺流程图/管理计划）#SUPPLIER/供应商:KaiFaTechnologyPROJECTNAME/产品名称:三星手机DOCNo./文件编号:M001-005-ELM911Rev./版本:C#PARTNo./物料编号:N/ADATEISSUED/发布日期:2008-11-10INSPECTIONANDTEST/目检测试MATERIALS/原料OPERATION/操作STORAGE/贮存#ProcessDocumentProcessProcessProcesscontrolProcesscontrolWHOFREQUENCYMETHODCONTROLTRIGGERACTIONSIDNo.No.FlowDescription(Parameter)Spec.TOOLSRECORDPOINT/工序编号/文件编号/工艺流程/过程描述/过程控制参数/过程控制标准/负责/频率/方法、工具/控制记录/切换点/行动101stsiderawPCBinputBOMMatchw/BOMMat'lWhileinputCheckw/BOMRecordlist记录表NotMatchRTVPCB基板投料202ndsidePCBLoadingmachineProd生产100%放第二面基板到上板机3023IC-M001-9002PCBloadingPCB装入PCBorientationPCB板方向Matchw/stencil与钢网是否一致Prod生产100%AutoPCBloader35Solderpasteinput锡膏投料Soldertype锡膏类型SENJU-M705-GRN360-K2-VTProd生产WhileuseLabel标签NotMatch不一致Returnandchange退回并更换4023IC-SA999-028-XSolderpastestorage锡膏贮藏Prod生产100%RefrigeratoryStoragetemp.贮藏温度0~10C-degree（无铅）Prod生产Once/shiftThermalmeterTrendchartOffspecEquipadjustrefrigeratory4523IC-SA999-028-XUnfreeze锡膏解冻Time时间2hrsProd生产WhileuseRoomtemperatureLabel标签OffspecInformPEtodispose5023IC-SA999-028-XUsetimeafterUnfreezeTime时间〈96hrsProd生产WhileuseRoomtemperatureLabel标签OffspecInformPEtodispose锡膏解冻后使用时间5523IC-SA999-028-XAutomill锡膏自动搅拌Time5minProd生产WhileuseMillmachineLabel标签OffspecInformPEtodispose6023IC-M001-9001Paperboardprinting/薄膜板印刷Printingdefects/印刷缺陷:QAIProd/生产3panel/newbuildAdhesivepaper3,X放大镜AnydefectMEadjustmachine/设备调整机器-Missalignment/偏位-Solderbridge/锡桥-Insufficientsolder/少锡-Otherdefects/其它缺陷7023IC-M001-9001Screenprinting/丝网印刷Prod生产100%Printer，wiperStencilver.Andorientation/钢网版本和方向Matchw/programm/与程序一致Prod生产Whileloading装入时Visualcheck目检NotMatch一致Changeandreload重装Stencillifetime/钢网的寿命200KtimesProc工艺Once/dayCheckingrecord检查Recordlist记录表Offspec/超过标准Scrap报废Stenciltension/钢网的强度30N/cm2Proc工艺1time/100KTensionmeter张力计Recordlist记录表Offspec/超过标准Scrap报废&1time/150KtimesStencilcleaning钢网的清洁Nosolderpasteresidual无锡膏残留Prod/生产Once/shift自动清洗机，溶剂Recordlist记录表AnyresidualRe-clean再清洁Once/2hrs手工清洗，擦网纸，酒精Recordlist记录表AnyresidualRe-clean再清洁Squeegeesize/刮刀尺寸与PCB板长度匹配Prod/生产WhileuseStencillabel钢网标识NotMatch不一致Change更换Squeegeepressure刮刀压力4.5+/-0.5kgProd/生产Once/shiftMachinesettingRecordlist记录表NotMatch不一致Adjustmachine调整机器Squeegeecleaning刮刀清洁Nosolderpasteresidual无锡膏残留Prod/生产Once/shift自动清洗机，溶剂Recordlist记录表AnyresidualRe-clean再清洁Solderpastethickness锡膏厚度0.08-0.14mmQA5point/panel/2hrsSPIXbar-RChartOffspec/超过标准InformPE通知工艺工程师Solderpastelifetimeaftercoveropen=24hrsProd/生产WhileuseMarkusingtimeonlabelLabel/标签Offspec/超过标准InformPE通知工艺工程师开盖后锡膏的寿命Solderpastelifetimeafterprinting=2hrsProd/生产WhilemachinedownTimerOffspec/超过标准Cleanboard洗板12第2页，共7页PROCESSFLOW/MANAGEMENTPLAN（工艺流程图/管理计划）#SUPPLIER/供应商:KaiFaTechnologyPROJECTNAME/产品名称:三星手机DOCNo./文件编号:M001-005-ELM911Rev./版本:C#PARTNo./物料编号:N/ADATEISSUED/发布日期:2008-11-10INSPECTIONANDTEST/目检测试MATERIALS/原料OPERATION/操作STORAGE/贮存#ProcessDocumentProcessProcessProcesscontrolProcesscontrolWHOFREQUENCYMETHODCONTROLTRIGGERACTIONSIDNo.No.FlowDescription(Parameter)Spec.TOOLSRECORDPOINT/工序编号/文件编号/工艺流程/过程描述/过程控制参数/过程控制标准/负责/频率/方法、工具/控制记录/切换点/行动锡膏印刷后的寿命Solderpastevolumeonstencil1/2volumeofbottleProd/生产Firstpart第一块板Visualcheck目测Offspec/超过标准Addsolderpaste加锡膏锡膏在钢网上的用量1/2瓶SolderpasteaddingfrequencyOnce/0.5hrProd/生产Realtime/适时AutocounterOffspec/超过标准Addsolderpaste加锡膏锡膏添加的频率1次/0.5hr8023IC-M001-9001Printingvisualinspection丝印目检Visualdefect:目检缺陷QAIProd/生产10panel/1hr3XmagnifierYieldreport合格率Offspec/超过标准Reporttoengineering-Missalignment偏位-Solderbridge锡桥-Insufficientsolderpaste少锡-Otherdefects其它缺陷9023IC-999999-357SPCVisualdefect:目检缺陷QAISPC2panel/1hr3XmagnifierSPCreportOffspec/超过标准Reporttoengineering-Missalignment偏位-Solderbridge锡桥-Insufficientsolderpaste少锡-Otherdefects其它缺陷第3页，共7页PROCESSFLOW/MANAGEMENTPLAN（工艺流程图/管理计划）#SUPPLIER/供应商:KaiFaTechnologyPROJECTNAME/产品名称:三星手机DOCNo./文件编号:M001-005-ELM911Rev./版本:C#PARTNo./物料编号:N/ADATEISSUED/发布日期:2008-11-10INSPECTIONANDTEST/目检测试MATERIALS/原料OPERATION/操作STORAGE/贮存#ProcessDocumentProcessProcessProcesscontrolProcesscontrolWHOFREQUENCYMETHODCONTROLTRIGGERACTIONSIDNo.No.FlowDescription(Parameter)Spec.TOOLSRECORDPOINT/工序编号/文件编号/工艺流程/过程描述/过程控制参数/过程控制标准/负责/频率/方法、工具/控制记录/切换点/行动95Componentsinput贴片部件上线10023IC-999999-179-XComponentsloadingtofeederStep步距Matchw/mat'larrangementlistProd/生产WhileloadVisual目检NotMatch一致Resetstep重新设置步距23IC-M001-9003装贴片部件到飞达上与排料单一致Feedertype飞达型号Matchw/mat'larrangementlistProd/生产WhileloadVisual目检NotMatch一致InformEquip通知设备工程师与排料单一致10523IC-999999-179-XLoadfeedertomachineFeederposition飞达位置Matchw/mat'larrangementlistProd/生产WhileloadVisual目检NotMatch一致InformEquip通知设备工程师23IC-M001-9003装飞达到机器上与排料单一致Mat'lP/N物料编号Matchw/mat'larrangementlistProd/生产WhileloadVisual目检NotMatch一致InformPE通知工艺工程师&BOM与排料单BOM一致11023IC-999999-179-XComponentplacementProd/生产100%FJNXT/Seimens23IC-M001-9003贴片Program程序名称及版本Matchw/mat'larrangementlistProd/生产WhileloadCheckmachine检查机器InformEquip通知设