数字集成电路(中文)第一第二章

EE141DigitalIntegratedCircuitsIntroduction数字集成电路设计EE141DigitalIntegratedCircuitsIntroduction2课程介绍参考教材：数字集成电路设计——电路、系统与设计JanM.RabaeyAnanthaChandrakasanBorivojeNikolic著周润德译学时：每周两节，实验单周两节考核方式：开卷笔试平时：30%（上机／作业）考试：70%EE141DigitalIntegratedCircuitsIntroduction3Whatisthiscourseallabout?数字集成电路的介绍CMOS器件与工艺导线模型CMOS反相器和逻辑门传输延时、噪声和功耗组合、时序逻辑电路设计方法学能学到什么数字集成电路的入门介绍，从物理器件层到系统整片层的概念。强化数字电路知识，了解基于不同层次的DigitalICDesign的流程，具备一定的基本数字集成电路的设计能力EE141DigitalIntegratedCircuitsIntroduction4引言数字集成电路设计进展数字集成电路中亟待解决的问题如何衡量设计质量EE141DigitalIntegratedCircuitsIntroduction5EE141DigitalIntegratedCircuitsIntroduction6第一台机械计算机TheBabbageDifferenceEngine(1832)25,000零件Cost:17,470磅EE141DigitalIntegratedCircuitsIntroduction7ENIAC–第一台电计算机(1946)电气计算机磁控开关真空管1946年/18000电子计算机晶体管/集成电路沿革的动力功耗-可靠性-成本EE141DigitalIntegratedCircuitsIntroduction8晶体管革命第一个晶体管BellLabs,1948BardeenSchockleyEE141DigitalIntegratedCircuitsIntroduction9第一块集成电路双极型逻辑1960’sJackKilbyECL3输入逻辑门Motorola1966EE141DigitalIntegratedCircuitsIntroduction10Intel4004微处理器19711000晶体管1MHz工作频率全定制人工设计EE141DigitalIntegratedCircuitsIntroduction11IntelPentium(IV)微处理器2000年~亿个晶体管~GHz工作频率可复用设计基于单元库/宏单元层次化设计设计自上而下性能驱动设计功耗-速度-面积EE141DigitalIntegratedCircuitsIntroduction12摩尔定律（Moore’sLaw）In1965,GordonMoorenotedthatthenumberoftransistorsonachipdoubledevery18to24months.Hemadeapredictionthatsemiconductortechnologywilldoubleitseffectivenessevery18monthsEE141DigitalIntegratedCircuitsIntroduction13Moore’sLaw16151413121110987654321019591960196119621963196419651966196719681969197019711972197319741975LOG2OFTHENUMBEROFCOMPONENTSPERINTEGRATEDFUNCTIONElectronics,April19,1965.EE141DigitalIntegratedCircuitsIntroduction14复杂度的演变-存储器EE141DigitalIntegratedCircuitsIntroduction15晶体管数量1,000,000100,00010,0001,00010100119751980198519901995200020052010808680286i386i486Pentium®Pentium®ProK1BillionTransistorsSource:IntelProjectedPentium®IIPentium®IIICourtesy,IntelEE141DigitalIntegratedCircuitsIntroduction16Moore’slaw–微处理器40048008808080858086286386486Pentium®procP60.0010.010.1110100100019701980199020002010YearTransistors(MT)2Xgrowthin1.96years!TransistorsonLeadMicroprocessorsdoubleevery2yearsCourtesy,IntelEE141DigitalIntegratedCircuitsIntroduction17Moore’slaw–芯片尺寸40048008808080858086286386486Pentium®procP611010019701980199020002010YearDiesize(mm)~7%growthperyear~2Xgrowthin10yearsDiesizegrowsby14%tosatisfyMoore’sLawCourtesy,IntelEE141DigitalIntegratedCircuitsIntroduction18工作频率P6Pentium®proc486386286808680858080800840040.111010010001000019701980199020002010YearFrequency(Mhz)LeadMicroprocessorsfrequencydoublesevery2yearsDoublesevery2yearsCourtesy,IntelEE141DigitalIntegratedCircuitsIntroduction19Moore’slaw–功耗P6Pentium®proc486386286808680858080800840040.1110100197119741978198519922000YearPower(Watts)LeadMicroprocessorspowercontinuestoincreaseCourtesy,IntelEE141DigitalIntegratedCircuitsIntroduction20功耗将成为主要问题5KW18KW1.5KW500W40048008808080858086286386486Pentium®proc0.111010010001000010000019711974197819851992200020082012YearPower(Watts)能量的传递和耗散将变得不可能Courtesy,IntelEE141DigitalIntegratedCircuitsIntroduction21功率密度40048008808080858086286386486Pentium®procP611010010001000019701980199020002010YearPowerDensity(W/cm2)HotPlate核反应温度火箭喷嘴的温度t功率密度过高导致节温升高Courtesy,IntelEE141DigitalIntegratedCircuitsIntroduction22不仅仅是微处理器数字电话市场(出货量)19961997199819992000Units48M86M162M260M435MAnalogBasebandDigitalBaseband(DSP+MCU)PowerManagementSmallSignalRFPowerRF(datafromTexasInstruments)移动电话EE141DigitalIntegratedCircuitsIntroduction23数字设计方面的挑战“微观问题”•超高速设计•互连•噪声、串扰•可靠性、可制造性•功耗•时钟分布“宏观问题”•产品上市周期•千百万门级•高层次抽象•可复用IP:可移植性•可预测性•等.EE141DigitalIntegratedCircuitsIntroduction24产率发展趋势1101001,00010,000100,0001,000,00010,000,000200319811983198519871989199119931995199719992001200520072009101001,00010,000100,0001,000,00010,000,000100,000,000LogicTr./ChipTr./StaffMonth.xxxxxxx21%/Yr.compoundProductivitygrowthratex58%/Yr.compoundedComplexitygrowthrate10,0001,0001001010.10.010.001LogicTransistorperChip(M)0.010.11101001,00010,000100,000Productivity(K)Trans./Staff-Mo.Source:Sematech复杂度超出了设计能力（产率）~！ComplexityCourtesy,ITRSRoadmapEE141DigitalIntegratedCircuitsIntroduction25缩放比例工艺特征尺寸每代降低0.7芯片按照功能每代两倍增长芯片成本却没有大幅增加每个功能的成本降低两倍但是…如何设计功能更强的芯片?设计人员却没有按照每两年增长翻倍的速度增加…因此需要更有效的设计方法开发不能级别的抽象更多优秀的仿真综合工具EE141DigitalIntegratedCircuitsIntroduction26设计抽象层次n+n+SGD+DEVICECIRCUITGATEMODULESYSTEMEE141DigitalIntegratedCircuitsIntroduction27设计的衡量如何去评价一个数字电路的性能?成本（Cost）可靠性（Reliability）可伸缩性（Scalability）速度（延时、操作频率）Speed(delay,operatingfrequency)功耗（Powerdissipation）完成某功能能量（Energytoperformafunction）EE141DigitalIntegratedCircuitsIntroduction28数字电路的基本特性/参数静态/稳态特性鲁棒性可靠性动态/瞬态特性速度性能功耗特性热耗散/电源要求芯片面积制造成本EE141DigitalIntegratedCircuitsIntroduction29集成电路的成本固定成本NRE(non-recurrentengineering)设计时间和人工成本一次性投入成本可变成本Recurrentcosts芯片工艺、封装、测试成本与芯片数量成正比与芯片面积成正比EE141DigitalIntegratedCircuitsIntroduction30电压传输特性VTC（VoltageTransferCharacteristic）V(x)V(y)VOHVOLVMVOHVOLfV(y)=V(x)SwitchingThresholdNominalVoltageLevelsVOH=f(VOL)VOL=f(VOH)VM=f(VM)EE141DigitalIntegratedCircuitsIntroduction31数