SMT回焊炉DOE实验

ConfidentialContents3.ReflowSolderingDOEImplementation2.DOE----ExecutionStepConfidential2.DOE----ExecutionStepDefinethetypeofproblemSelectFactorandLevelforDOESelectorthogonaltableforLevelcombinationandRunDOEAnalyseDOEDatabyANOVADecidewhatlevelofselectedfactorswillbeusedReproducibilityVerificationonselectedcombinationStep1Step2Step3Step4Step5Step6Step7Step8DefinethegoalexpectedbyDOEimplementationSelecttypicalproductforDOErunningStandardizeDOEresultintoSOPStep9Confidential3.ProcessParameter-SettingbyDOE-overview(1)Step1.DefinethetypeofproblemProblemTypeTtypeAtypeXtypeProblemcauseclearclearunclearFactorlevelsettingsclearunclearunclearSolutionToolQCtoolsDOEDOEAsfarasPb-freesolderingprocessisconcerned,problemcausessuchasbridge,voidaresameasPbsolderingprocess,sobasingonlong-termexperienceinsolderingindustry,“A”typeproblemforPb-freeprocessoptimizationisselected.Step3.SelectPCBATypeforDOEimplementationBasingonthecomplexityofL1704interfaceboardPCBA-seephoto1,itsreflowprocesscanbethoughttypical.BasingonthecomplexityofL1704powerboardPCBA-seephoto2,itswavesolderingprocesscanbethoughttypical.Step2.DefinethegoalexpectedbyDOEOutputIndexMeasurementsGoalDppmofReflownofailurejointsbyvisualwith10XMagnifier150DppmofWavenofailurejointsbyvisualwith10XMagnifier1500ConfidentialPhoto1:L1704InterfaceBForTypicalReflowSolderingImmersionTinfinishPhoto2:L1704PowerBForTypicalWaveSolderingOSPfinish3.ProcessParameter-SettingbyDOE-overview(2)ConfidentialReflowSolderingDOEImplementationConfidentialStep4.SelectFactorandLevelforDOEfactorseffectonoutputcomplexityofLevelchangeUsedasDOEfactor(Y/N)Ifused,selectlevelsettingsifnousedbyDOE,howaboutthefixedsettings?A:preheatingtime●●YA1=60SA2=40SB:activetemp●●YB1=150CB2=170CC:reflowpeaktemp●●YC1=230CC2=245D:soldertype●●YD1=AlphaSAC305OM325D2=TLF-207-93Note:●significanteffect;veryeasytochange●Mediumeffect;easiertochangeDOEFactorsAnlysisFB310profileisselectedsinceitsmaxtemperatureishigherthanothers3.ProcessParameter-SettingbyDOE-ReflowProcessDOERunningbackground:ReflowSolderingMachineModel:FOLUNGNW-850NConveyerspeed:60cm/min.ConfidentialStep5.SelectorthogonaltableforcombinationL827andRunDOEQ'typerrunrunorderA:pre-heattimeA1=60sA2=40sB:activetempB1=150CB2=170CinteractionofA*BC:reflowtempC1=230CC2=245CeD:SolderModelD1=SAC305OM338D2=TLF-207-93eVoid(DPPM)Bridge(DPPM)sum(DPPM)30111111112189801198305111222228320283230612211224139163457733021222211218021830321212123271852217930721221213595654424830822112212832654348630422121120003.ProcessParameter-SettingbyDOE-ReflowProcessConfidentialavg=2491.83ABAxBCeDeLevel1response2505.42614.41879.13159.02805.0898.72287.6Level2response2478.22369.33104.61824.62178.64085.02696.1A1B12015.3A1B22995.6A2B13213.5A2B21742.9sumSi28109737.01483.3120146.13003652.43561367.7784657.820304690.5333739.2FactorsSi26991340.01483.3120146.13003652.43561367.720304690.5totalofe=effor1118397.0error(e)ABAxBCeDedf=Φi211111Vi=Si/Φi559198.51483.3120146.13003652.43561367.7#DIV/0!20304690.5#DIV/0!Fk=Vk/Ve0.00.25.46.4#DIV/0!36.3#DIV/0!note:F(1,2,0.05)=18.51,F(1,2,0.01)=98.50Fk18.51significantfactor*,Fk98.5verysignifactfactor**Contribution%3.98%0.01%0.43%10.69%12.67%#DIV/0!72.23%#DIV/0!OrderDCAxBBAeffor(e)Contribution%72.23%12.67%10.69%0.43%0.01%3.98%Accumulation%72.23%84.90%95.59%96.02%96.02%100.00%Step6.AnalyseDOEDatabyANOVA(1)3.ProcessParameter-SettingDOE-ReflowProcessConfidentialParetooffactor’scontributiontooutputStep6.AnalyseDOEDatabyANOVA(2)3.ProcessParameter-SettingDOE-ReflowProcessConfidentialLevel1Level2Step6.AnalyseDOEDatabyANOVA(3)Factor’slevelresponsetooutput3.ProcessParameter-SettingbyDOE-ReflowProcessConfidentialInteractionresponsetooutputStep6.AnalyseDOEDatabyANOVA(4)3.ProcessParameter-SettingbyDOE-ReflowProcessConfidentialStep7.Decidewhatlevelofselectedfactorswillbeused1.Fromthechartof“Factor’slevelresponsetooutput”,wecanseethatfactor“D”namely“solderpastemodel”isasignificantfactortooutput.2.TheoptimumcombinationfordefinedparametersisA2B2C2,whichoutputcanbefarlowerthangoal-setting.Pre-heattime:40secondsActivetemp:170。CReflowtemp:245。CSolderPasteType:SAC305OM325Run100pcsunderselectedcombination,Nodefectisfound,soDOEisdecidedtobesuccessfulcomparedtothedefinedgoal.Step8.ReproducibilityVerificationonSelectedCombinationStep9.StandardizeDOEresultintoSOP3.ProcessParameter-SettingbyDOE-ReflowProcessConfidentialStep9.StandardizeDOEresultintoSOP3.ProcessParameter-SettingbyDOE-ReflowProcessConfidentialStep9.StandardizeDOEresultintoSOP-ProfileReference3.ProcessParameter-SettingbyDOE-ReflowProcessPreheatingTemp:170CTime:90sHeatingTemp:220CTime:70sPeakHeatingTemp:247CTime:20sRemark:Thisprofileisdefinedon:1.AlphaSn-Ag-Cu305lead-freesolder.2.FolungNW-850NReflowsolderingmachine3.InterfaceBofModelL1704ConfidentialStep6.AnalyseDOEDatabyANOVA(2)Paretooffactor’scontributiontooutput3.ProcessParameter-SettingbyDOE-WaveSolderingProcessConfidentialStep6.AnalyseDOEDatabyANOVA(3)Level1Level2Factor’slevelresponsetooutput3.ProcessParameter-SettingbyDOE-WaveSolderingProcessConfidentialInteractionresponsetooutputStep