MXM-spec-v301

MobilePCIExpressModuleElectromechanicalSpecificationVersion3.0Revision1.0June26,2008RevisionHistoryRevRespChange1.0GGInitialrelease.iiiivContents1Introduction11.1Background.......................................11.2MXMVersion3.0Benefits................................21.3DisplaySupport.....................................31.4Required/OptionalFeatureMatrix............................42MechanicalSpecification52.1FormFactors.......................................52.2MXMBoardOutlines..................................52.3MXMPCBMountingHoles...............................72.3.1BoardMountingHoles.............................72.3.2ThermalSolutionMounting...........................72.3.3BackingPlate..................................72.4BoardHeightRestrictions................................92.5MXMEdgeFingers...................................142.6MXMConnector.....................................193ElectricalSpecifications233.1ElectricalConnector...................................233.2ConnectorPinout....................................253.3PinDescription......................................283.3.1PowerGroup..................................283.3.2PCIExpressSignalGroup...........................293.3.3DisplayPortSignalGroup............................303.3.4LVDSSignalGroup...............................313.3.5AnalogDisplaySignalGroup..........................323.3.6PowerandThermalManagementSignalGroup................333.3.7SystemManagementSignalGroup.......................343.4SystemRequirements...................................353.4.1PowerSequencing................................353.4.2ModulePowerDownandPowerUp......................363.4.3ResetRequirements...............................363.4.4PCIExpressInterface..............................373.4.5DisplayPortInterface..............................373.4.6DVI/HDMIonDPInterface..........................383.4.7DVI/HDMIonLVDSInterface........................393.4.8VGAInterface..................................393.4.9TVOutImplementation............................40v3.4.10SMBusinterface.................................403.4.11ThermalandPowerManagementInterface...................413.4.12PWR_LEVELSignal..............................413.4.13InternalFlatPanelInterface...........................423.4.14VGA_DISABLE#Signal............................423.4.15WAKEFunctionality..............................423.4.16OEMModules..................................423.5SignalIntegrity......................................433.5.1ModuleSpecification..............................433.5.2SystemSpecification...............................443.5.3DisplayPort...................................453.5.4TMDSandLVDS................................473.5.5PCIExpress...................................493.6DCSpecifications....................................504ThermalSpecification514.1ThermalSpecificationPhilosophy............................514.1.1SystemThermalComponents..........................514.1.2PowerSources..................................524.2ThermalRequirements..................................534.2.1SystemRequirements..............................534.2.2ModuleThermalRequirements.........................534.2.3ThermalSolutionRequirements.........................554.3ThermalSpecificationSummary.............................59ApplicableDocuments61viListofFigures1.1MXMApplications....................................11.2MXMCompatibility...................................22.1BoardOutlines......................................62.2BoardSlotsDetail....................................72.3MountingHoles(TypeAandTypeB)..........................82.4BoardBottomSideHeightRestrictions(TypeAandTypeB).............92.5TypeATopSideHeightRestrictions..........................112.6TypeBTopSideHeightRestrictions..........................132.7CardThicknessandChamfer..............................142.8ModuleEdgeFingerTop................................152.9ModuleEdgeFingerBottom...............................172.10PinAlignmentDetail...................................182.11Terminal-BoardMinimumEngagement.........................192.12ConnectorFootprint...................................202.13ModuleLocation.....................................213.1ConnectorDifferentialInsertionLoss..........................243.2ConnectorDifferentialReturnLoss...........................243.3ConnectorDifferentialNearEndCrossTalk......................253.4PowerSequencing....................................353.5ModulePowerDown..................................363.6ResetSequencing.....................................363.7Dual-modeDisplayPortImplementation........................373.8DVI/HDMIImplementationusingDPInterface....................383.9VGAImplementation..................................393.10TVImplementation...................................403.11InternalFlatPanelTiming................................423.12MXMModuleandSystem................................433.13ModuleValidationTestSetup..............................433.14SystemValid