《提高太阳能电池转换效率的技术探讨》 杜邦

DuPont™Solamet®AdvancedHighEfficiencyCellTechnologyDr.MikeFBarkerR&DManager,AsiaPacificDuPontMicrocircuitMaterialsMay21st20141Copyright©DuPont2014.Allrightsreserved.20032004200520062007200820092010201120122013EAmericasAPACJapanChinaMEAEurope600MW34,500MWSource:EPIA,IHSAnExcitingDecadeofGrowthforPV2Copyright©DuPont2014.Allrightsreserved.DuPontisDifferentFromOtherSolarMaterialsCompaniesMaterialsandIPforthehighestpowersolarcellsMaterialsproventoprotectsolarpanelsoverdecadesofuseIndustryscalein-housesolarcellandpanelassemblyandtestGlobalsolarcellprocessengineeringandfieldsupportPoweringglobalDuPontsiteswithPVpowerBig-dataanalysisfromPVinstallationsglobally40yearsofexperienceandunderstandingscanningfrommaterialstopowergeneration3Copyright©DuPont2014.Allrightsreserved.Solamet®DevelopmentDuPontTaiwanPhotovoltaicCenterDuPontLeadsinInvestmentsforNewPVMaterials44Copyright©DuPont2014.Allrightsreserved.PhotocourtesyofIsovoltaicTedlar®Film-BasedBacksheets–ProtectingYourInvestment5Copyright©DuPont2014.Allrightsreserved.6Note:Flexc-SiPhotocourtesyofTransformSolarAndWeAreInventingTheFutureThroughR&DIonomerEncapsulantsforBifacialSolarPanelsHighPowerAll-Back-ContactSolarPanelsFlexibleSolarPanelsCopyright©DuPont2014.Allrightsreserved.24,000activeDuPontpatentsworldwideIndustryleadingSolarpatentportfolio100PhDsfocusedonsolarmaterialsDuPontLeadinginInnovationSource:DuPont7Copyright©DuPont2014.Allrightsreserved.82630354352637692104555667930344048576882991132217443326200204060801001201402010A2011A2012A20132014201520162017201820192020TFcSiProject20%CAGRForPVInstallationsAmoveawayfromThinFilmPVModuleDemandForecastTechnology2013-18CAGRSource:DPVSAnnualInstallations(GW)cSi20%ThinFilm~10%Copyright©DuPont2014.Allrightsreserved.Expectedmarketsegments–c-Sicellarchitectures9(DPVSEst.)34405782142245AnnualProduction(GW)Source:ITRPVandDPVSCopyright©DuPont2014.Allrightsreserved.Efficiency(%)YearConventionalCellsSolamet®PV14xProductsHighEfficiencyCellsSolamet®PV15x,16xHighEfficiencyLDECellsSolamet®PV17x,18xNewLBSF(LDE)ArchitecturesSolamet®PV36xN-typeCellBi-facial:PV3NxIBC:Pv197BackContactMWT:Solamet®PV70xCellEfficiencyEvolutionDuPont™Solamet®MetallizationTechnologyisontargettohelpachieve22%cellefficiencyin201510Copyright©DuPont2014.Allrightsreserved.NewArchitecturesIBCMWTN-typeBackRearTabbingAlSystemsFrontSinglePrinthighadhesion20102011201220132014201520162017201820192020DuPont™Solamet®ProductGenerationRoadMap2013.04FeDoublePrintPV2DAPV17XforHE/LDEPERCLocalBackSurfaceFieldAlPV36X(LaserAblated)IBCMetallizationsanddopinginksMetallizationsfordecoupledinterconnect(DualPrint,Stencils)PV2DXPV16APV18XforHE/LDEImprovedperformance,drivingdownconsumption,improvedadhesion&finelinecapabilityLowcosttabbinginterconnectsPV51XandPV52XLowcostnon-firethroughinterconnecttabbingAgforPERCMWTViaGen1:PV701MWTViaGen1:PV71XreducedshuntingN-type:p-contactPV3N1PV18xforStencilPrintingDuPontFire-ThroughLBSFstructureImprovingyields,reducelinewidth,maximizeadhesionMultiprintPV18XforHPMultiN-type:p-contactPV3NX–higherconductivity,lowercontact&lowVoclossPVxxxPbfree11Copyright©DuPont2014.Allrightsreserved.ImprovedFineLine/AspectRatio12Copyright©DuPont2014.Allrightsreserved.ScreenTypesMeshtypeandpatternopeningdirectlyimpactsonpastetransferFactorscriticaltopastetransfer:MeshtypeandthicknessMeshtreatment:Calender,wireblastEmulsionmaterialsScreenmesh(countsperinch)MeshwirediameterOpenratio2902060%3252349%3601660%4001851%SqueegeesidewafersideLightcalenderHeavycalenderPatternopening30-40umEmulsionmayimpactonpastepealingeffectCalenderimpactsontotalthicknessandpastetransfer13Copyright©DuPont2014.Allrightsreserved.30405060708090100110304050607080901001101H/102H/101H/112H/111H/122H/121H/132H/131H/14(F)Rsheet(ohm)ScreenOpening(um)RsheetonMulti(ohm)Screenopening(um)PV16xPV17xPV18xSource:DuPontCellPerformanceEvolution•Betterfinelinecapabilitywithnewscreentechwillbecomekeyforpastedevelopment•GoodcontactperformanceonhigherRsheetemittertosustainFF0.18g0.14g0.11g0.22g325.23290.20400.18360.16Next?14Copyright©DuPont2014.Allrightsreserved.WhatisIdealPrintedFineLine?GoalLowaspectratio-UnacceptableAcceptable?Goodtransferwithfineline.Noseepageunderemulsion.Tomaintain/improveEfficiencywithfinelinemustincreasefingernumberANDimproveaspectratio.•DoublePrinting•Stencil15Copyright©DuPont2014.Allrightsreserved.StencilPrintCosts&BenefitsBenefitsCosts•LowerFSAgusageupto40%•EfficiencyGains•Finer,betterARfingers•Non-etchbusbar•SupportsShallowerEmittersrequiringhigherfingercount•BetterAdhesion•TailoredFSbusbar•PotentialfasterFSfingerqualification•SomemaybypasscertificationifnoFSbusbarchange•Stencilmorecostlythanscreen•HigherStencilCost•Potential3-5xlongerlifetimevs.screen,yetpotentiallyshorterasoperatorsneedtobehighlytrained•Operatorsmorecostlyifspecializedrole?•Modulereliability?•CTMlosses?•Yield/Throughput?•Currentissueswithconsistentfingerdimensionsandappearanceinmassproduction16BenefitshavebeendemonstratedonR&DscalebutCoOisunknowngiventhetechnologyhasnotyetmovedtoMassProductionCopyright©DuPont2014.Allrigh