SMTintroductionandtrainingAgenda:SMTintroductionSMTequipmentsIntr.SMTMaterialIntr.SMTproducefollowchartSMTworkstationVersion2SMTintroductionSMT:SMT是表面组装技术(表面贴装技术)(SurfaceMountedTechnology的缩写),是目前电子组装行业里最流行的一种技术和工艺.Version3…~1950s1950s~1980s1980s~NowPoint-to-PointConstructionThrough-holetechnologySurface-mounttechnologySMTintroductionSMT优点:组装密度高,电子产品体积小,重量轻,贴片组件的体积和重量只有传统插装组件的1/10左右,一般采用SMT之后,电子产品体积缩小40%~60%,重量减轻60%~80%.可靠性高,抗振能力强.焊点缺陷率低.高频特性好.减少了电磁和射频干扰.易于实现自动化,提高生产效率.降低成本达30%~50%.节省材料,能源,设备,人力,时间等缺点:生产设备投入成本高技术力量要求高产品维修困难4SMTEquipments5DEKYLHITACHHDATEfixtureSMTequipment's6GSMPAHellerBTUSMTMaterials7PCB:PCB(PrintedCircuitBoard),中文名称为印制电路板,又称印刷电路板,印刷线路板,是重要的电子部件,是电子元器件的支撑体,是电子元器件电气连接的提供者.简单来讲,PCB板是SMT生产最基本的材料,PCB表面也就是表面贴装技术中讲的“表面”.根据电路层数分类:分为单面板(Single-SidedBoards),双面板(Double-SidedBoards)和多层板(Multi-LayerBoards).PCBproduceprocess1)单面板工艺流程开料磨边→钻孔→外层图形→(全板镀金)→蚀刻→检验→丝印阻焊→(热风整平)→丝印字符→外形加工→测试→检验2)双面板喷锡板工艺流程开料磨边→钻孔→沉铜加厚→外层图形→镀锡、蚀刻退锡→二次钻孔→检验→丝印阻焊→镀金插头→热风整平→丝印字符→外形加工→测试→检验3)双面板镀镍金工艺流程开料磨边→钻孔→沉铜加厚→外层图形→镀镍、金去膜蚀刻→二次钻孔→检验→丝印阻焊→丝印字符→外形加工→测试→检验4)多层板喷锡板工艺流程开料磨边→钻定位孔→内层图形→内层蚀刻→检验→黑化→层压→钻孔→沉铜加厚→外层图形→镀锡、蚀刻退锡→二次钻孔→检验→丝印阻焊→镀金插头→热风整平→丝印字符→外形加工→测试→检验5)多层板镀镍金工艺流程开料磨边→钻定位孔→内层图形→内层蚀刻→检验→黑化→层压→钻孔→沉铜加厚→外层图形→镀金、去膜蚀刻→二次钻孔→检验→丝印阻焊→丝印字符→外形加工→测试→检验6)多层板沉镍金板工艺流程开料磨边→钻定位孔→内层图形→内层蚀刻→检验→黑化→层压→钻孔→沉铜加厚→外层图形→镀锡、蚀刻退锡→二次钻孔→检验→丝印阻焊→化学沉镍金→丝印字符→外形加工→测试→检验8SMTMaterials9SMTMaterials10SMTMaterials11Version12SMT–SurfaceMountedTechnologySMD–SurfaceMountedDevicesPCBA–PrintedCircuitBoard+AssemblyAOI–AutomaticOpticInspectionSPI–SolderPasteInspectionVI–VisualinspectionICT–InCircuitTesterATE–AutomaticTestEquipmentT/U–TouchUpDC–DirectCurrentF/T–FunctionTestAcronymsandAbbreviationsSMTProductionProcessDesign13ScreenPrintRe-flowOvenAOIHighSpeedMounterMultiMounterX-Ray3DInspectionInspectionSupportSystemDispenserATEPCBAF/TPCBARepairTeamSMTnormalprocessICT14SMTPCBAFLOWSMTProductionProcessDesignLoaderPrinterHighspeedMounterGlueDispenserReflowPrinterGlueDispenserHighspeedMounterReflowAOIAAOIBICTRouteT/UF/TSystemAss’ySPICleansolderPasteFAILPASSRepairFAILPASSVICleansolderPasteRepairRepairFailOKFAILOK15SMTProcess吸板机ABS-1000锡膏印刷机第一面锡膏~保存温度2℃~8℃.自然回温≧4hrs.自动搅拌机.印刷机~1.确实的钢板清洗2.刮刀,压力设定3.上线前钢板需再次清洗锡膏厚度SPEC2pcs/2HNG清洗PCBCyberSE500BA开封PCBControlQty100待放入机器\停线开封PCB要真空包装开封的PCB板24小时必须生产完毕DEK/INFAPISPI流程管制重点设备/仪器16SMTProcess点胶机黑胶~1.保存期限内.2.保存温度2℃~8℃.3.自然回温≧8hrs.点胶机~1.点胶位置2.点胶量.YILI:EM5701高速机泛用机1.不错件2.不偏移3.不反向4.不折脚1.不错件2.不偏移3.不反向4.不折脚5.不高翘Panasonic:CM402&CM602FUJI:CP6&CP7GSM:DT401CB流程管制重点设备/仪器17氮气炉1.温度设定值235-2452.ForNVIDIA设定值240-2503.温度曲线4.开氮气流量30005.链速HELLER/BTU在线修护NG1.烙铁温度380±20℃(PTH)2.电容,电阻340±10℃3.烙铁漏电压值≦5V4.修护后必须目视并刷入SFIS5..区分OK&NGPCBA万用表/烙铁/离子风扇/计算机1.零件吃锡状况2.不错件3.不偏移4.不反向5.折脚6.高翘7.刷入SFISNACOK炉后目视DSMTProcess流程管制重点设备/仪器181.修护后必须目视并刷入SFIS2.区分OK&NGPCBAECyberHROK在线修护NG1.烙铁温度380±20℃(PTH)2.电容,电阻340±10℃3.烙铁漏电压值≦5V4.修护后必须目视并刷入SFIS5..区分OK&NGPCBA6.同一节3片相同不良/低于良率下限及时反馈lineengineer与发停线通知万用表/烙铁/离子风扇/计算机JET-300OK第二面AOID在线修护NGOKICTOK1.修护后必须目视并刷入SFIS2..区分OK&NGPCBA流程管制重点设备/仪器SMTProcess1.烙铁温度380±20℃(PTH)2.电容,电阻340±10℃3.烙铁漏电压值≦5V4.修护后必须目视并刷入SFIS5..区分OK&NGPCBA万用表/烙铁/离子风扇/计算机19Router1.无弯曲3.无撞件4.无损坏EM-5700OKT/UF/TW/HOKNGPE分析线外修护OKE1.ESD2.烙铁温度3.电动起子扭力4.离子风扇ESDtester烙铁温度测试仪扭力测试仪1.良率2.测试程序3.测试治具4.ESDHDD测试机台测试turnparts1.烙铁温度2.X-Ray3.ReworkBAG机器4.万用表X-Ray/ReworkBGAmachine/Quick2015流程管制重点设备/仪器SMTProcessSMT名词解释CAD:ComputerAidedDesign)计算机辅助设计.CAM:ComputerAidedManufacturing)计算机辅助制造.CAT:ComputerAidedTesting)计算机辅助测试.FPC:(FlexiblePrintedCircuit)柔性印制电路.PCB:(PrintedCircuitBoard)印制电路板.PWB:(PrintedWiringBoard)印制线路板.FTH:(PlatedThroughHole)通孔镀.SMT:(SurfaceMountTechnology)表面安装技术.SMB:(SurfaceMountBoard)表面安装板.SMD:(SurfaceMountDevices)表面安装器件.ISO:(InternationalOrganizationforStandardization)国际标准化组织.IEC:(InternationalElectrotechnicalCommision)国际电工技术委员会组织.IPC:(TheInstituteforInternationalandPackagingElectronicCircuits)美国电路互连与封装学会(标准).MIL:(MilitaryStandard)美国军用标准.IC:(IntegratedCircuit)集成电路.LSI:(LargeScaleIntegratedCircuit)大规模集成电路.JPC:(JapanPrintedCircuitAssociation)日本印制电路学会.UL:(UnderwritersLaboratoriesINC)美国保险商试验室.SMOBC:(SolderMaskonBareCopper)裸铜线路丝印阻焊油墨.AOI:(AutomatedOpticalInspection)自动光学检测.SPC:(StatisticalProcessControl)统计制程控制.SQC:(StatisticalQualityControl)统计质量控制.20SMT名词解释5S:5S管理ABC:作业制成本制度(Activity-BasedCosting)ABB:实施作业制预算制度(Activity-BasedBudgeting)ABM:作业制成本管理(Activity-BaseManagement)APS:先进规画与排程系统(AdvancedPlanningandScheduling)ASP:应用程序服务供货商(ApplicationServiceProvider)ATP:可承诺量(AvailableToPromise)AVL:认可的供货商清单(ApprovedVendorList)BOM:物料清单(BillOfMaterial)BPR:企业流程再造(BusinessProcessReengineering)BSC:平衡记分卡(BalancedScoreCard)BTF:计划生产(BuildToForecast)BTO:订单生产(BuildToOrder)CPM:要径法(CriticalPathMethod)CPM:每一百万个使用者会有几次抱怨(ComplaintperMillion)CRM:客户关系管理(CustomerRelationshipManagement)CRP:产能需求规划(CapacityRequirementsPlanning)CTO:客制化生产(ConfigurationToOrder)DBR:限制驱导式排程法(Drum-Buffer-Rope)DMT:成熟度验证(DesignMaturingTesting)DVT:设计验证(DesignVerificationTesting)DRP:运销资源计划(DistributionResourcePlanning)DSS:决策支持系统(DecisionSupportSystem)21SMT名词解释EC:设计变更/工程变更(EngineerChange)EC:电子商务(Elect