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陕西理工学院毕业设计I设计题目：基于单片机的电子日历工作系统的设计作者：00所在单位：（陕西理工学院机械工程学院机自专业机自000班级，陕西汉中723000）指导教师：000[摘要]针对电子仪器仪表的发展趋势以及人们日常生活、工作中对电子日历的需要，设计了一种基于单片机的电子日历工作系统。具体步骤如下：（1）完成了系统总体方案设计与论证。根据任务需要对芯片模块、按键模块、时钟模块、显示模块、温度模块等提出方案论证，最终确定了系统总体方案，绘制了系统框图。（2）根据总体方案完成了系统硬件的设计。通过所选取的硬件搭建了总体电路图。（3）根据硬件电路完成了系统软件的开发。其中包括时钟模块、温度模块的设计，并编写了程序。（4）对设计的结果利用Proteus软件进行功能仿真分析，仿真结果验证了电子日历系统的可行性。（5）完成了样机的制作，经过实际运行验证，完成了任务要求。[关键词]单片机，时钟芯片，温度芯片，仿真陕西理工学院毕业设计IIDesignofElectronicCalendarWorkSystemBasedonMCU000（Grade00,Class0,MajorMechanicalManufactureandAutomation，MechanicalEngineeringDept.，ShaanxiUniversityofTechnology，Hanzhong723003，Shaanxi）Tutor:000AbstractInviewofthedevelopmenttrendofelectronicinstrumentsandtheneedsofpeople'sdailylifeandwork,theelectroniccalendarsystembasedonsinglechipmicrocomputerisdesigned.Specificstepsareasfollows:(1)theoverallschemedesignanddemonstrationofthesystemhasbeencompleted.Accordingtothetaskofthechipmodule,keymodule,clockmodule,displaymodule,temperaturemodule,andsoon,andfinallydeterminethesystemoverallscheme,drawingthesystemblockdiagram.(2)thehardwaredesignofthesystemiscompletedaccordingtotheoverallscheme.Theoverallcircuitdiagramisconstructedthroughtheselectedhardware.(3)thesystemsoftwareisdevelopedaccordingtothehardwarecircuit.Includingclockmodule,temperaturemoduledesign,andthepreparationoftheprogram.(4)theresultsofthedesignareanalyzedbyusingProteussoftware.Thesimulationresultsverifythefeasibilityoftheelectroniccalendarsystem.(5)completedtheproductionoftheprototype,aftertheactualoperationoftheverification,completethetaskrequirements.KeywordsSinglechipmicrocomputer,clockchip,temperaturechip,simulation陕西理工学院毕业设计I目录1绪论.............................................................................................................................................................11.1课题研究的背景...............................................................................................................................11.2课题的研究目的与意义....................................................................................................................11.3课题解决的主要内容........................................................................................................................12系统的方案设计与论证..............................................................................................................................22.1单片机芯片设计与论证....................................................................................................................2方案1：采用51系列单片机作为系统控制器.............................................................................2方案2：采用凌阳系列单片机作为系统的控制器.......................................................................22.2按键控制模块设计与论证................................................................................................................22.3时钟模块设计与论证........................................................................................................................2方案1：采用DS1302为计时时钟芯片........................................................................................2方案2：采用DS12C887为计时时钟芯片...................................................................................22.4温度采集模块设计与论证................................................................................................................32.5显示模块模块设计与论证................................................................................................................33系统硬件的设计.........................................................................................................................................43.1STC89C52单片机.............................................................................................................................43.1.1最小系统设计........................................................................................................................63.1.2时钟电路................................................................................................................................73.1.3复位电路................................................................................................................................73.2时钟芯片DS1302接口设计与性能分析.........................................................................................83.2.1DS1302性能简介..................................................................................................................83.2.2DS1302接口电路设计...........................................................................................................83.3温度芯片DS18B20接口设计与性能分析....................................................................................103.3.1DS18B20性能简介..............................................................................................................103.3.2DS18B20接口电路设计......................................................................................................113.3.3DS18B20的工作时序.........................................................................................................123.4LCD显示模块.......................................................................