面向芯片封装的划片机的机械结构设计

本科毕业设计(论文)题目：面向芯片封装的划片机机械结构设计院（系）：机电工程学院专业：机械设计制造及自动化班级：学生：学号：指导教师：201年0月本科毕业设计(论文)题目：面向芯片封装的划片机机械结构设计院（系）：机电工程学院专业：机械设计制造及自动化班级：班学生：学号：指导教师：201年0月I面向芯片封装划片机机械结构设计摘要芯片封装是三大半导体行业之一。包装工艺包括：划线，粘膜，超声波焊接，包装，测试，包装。划片机就是芯片封装生产线上一个器件，不过这可是第一个关键器件，它的功能是将生产的晶圆加以切割，做成单元器件，并为下一个单元晶片的接合做准备。然而，因为和国外技术的差距比较大，所以中国划片机基本上都是从外国购买的。为了让中国拥有自己研发制作的划片机，详细设计了划片机机的整体规划和其中的关键部件。在阐明划线.工艺要求的基础上，我们先确定了.划片机的主要功能，设计了划片机各部分的原理。然后，列出了四种不同的.结构方案，分别分析它们的优缺点，仔细比较后选择.其中的最优方案。最终完成了.划片机整体规划。在下一步中，每个零件结构的初步设计都按照划线过程的要求进行，包括各轴的传输方案和相关的结构参数。然后，根据主体的要求，对划片机的四个轴进行精心设计。通过计算，完成.X，θ，Y，Z轴的.螺母机构的选.择类型、导轨选择。最后，完成.划片机.X，θ，Y，Z轴的装配图。关键字：划片机；总体规划；结构设计；滚珠丝杠；步进电机；滚动直线导轨IIMechanicalstructuredesignofdicingsawforchippackagingAbstractChippackagingisoneofthethreemajorsemiconductorindustries.Packagingprocessesinclude:scribing,mucosal,ultrasonicwelding,packaging,testing,packaging.Thedicingmachine.isadeviceonthechippackagingline,butthisisthefirstkeydevice,itsfunctionistoproducethewafertobecut,madeofunitdevices,andforthenextunitchiptodothepreparation.However,becausethegapbetweenforeigntechnologyandrelativelylarge,sotheChinesedicingmachineisbasicallypurchasedfromforeigncountries.InordertoallowChinatohaveitsownR&Dproductionofdicingmachine,detaileddesignoftheoverallplanningofthedicingmachineandoneofthekeycomponents.Onthebasisofclarifyingtherequirementsofthescribingprocess,wefirstdeterminedthemainfunctionofthedicingmachineanddesignedtheprincipleofeachpartofthedicingmachine.Then,fourdifferentstructuralschemesarelisted,andtheiradvantagesanddisadvantagesareanalyzedrespectively.Aftercarefulcomparison,theoptimalschemeisselected.Eventuallycompletedtheoverallplanningofthedicingmachine.Inthenextstep,thepreliminarydesignofeachpartstructureiscarriedoutaccordingtotherequirementsofthescribingprocess,includingthetransmissionschemeofeachaxisandtherelatedstructuralparameters.Then,accordingtotherequirementsofthemainbody,thefouraxesofthedicingmachinearecarefullydesigned.Throughthecalculation,theselectionofthenutmechanismoftheX,θ,Y,andZaxesiscompleted,andtheguiderailselectioniscompleted.Finally,completethedicingmachineX,θ,Y,Zaxisassemblydiagram.Keywords:dicingsaw；Overallplanning；Structuredesign；Ballscrew；Steppermotor；Rollinglinearguiderail3目录摘要...................................................................................................................IAbstract............................................................................................................II1绪论............................................................................................................11.1课题背景及研究意义............................................................................11.2国内外相关研究情况...........................................................................11.3划片机的发展过程................................................................................21.4划片机的工作原理...............................................................................31.5本课题的主要内容...............................................................................42划片机的总体方案设计...............................................................................52.1划片机的原理方案设计.........................................................................52.1.1划片机X、Y、Z轴的原理方案设计..........................................52.1.2划片机θ轴的原理方案设计.......................................................52.2划片机的结构方案设计[10]....................................................................62.3方案可行性分析...................................................................................83划片机结构参数的初步设计及相关计算........................................................93.1划片机主轴的参数的初步设计[12].........................................................93.2原动机参数的初步的设计....................................................................93.3划片机X轴参数的初步设计.............................................................103.4划片机θ轴参数的初步设计...............................................................103.5划片机Y轴的初步设计......................................................................103.6划片机Z轴的初步设计......................................................................104划片机X、θ、Y、Z轴机械结构具体设计..................................................114.1X轴机械结构的设计及计算................................................................114.1.1X轴伺服电机的选型.................................................................114.1.2X轴滚珠丝杠的选型.................................................................114.1.3X轴直线导轨的选型.................................................................134.2θ轴机械结构的设计及计算.................................................................144.2.1蜗杆蜗轮副的主要参数选择.....................................................144.2.2步进电机的选型.......................................................................174.2.3θ轴方向的晶片工作台幅面尺寸...............................................174.2.4X轴方向移动滑台幅面尺寸.....................................................174.3Z轴机械结构的设计及计算................................................................184.3.1Z轴滚珠丝杠的设计................................................................184.3.2Z轴电机的选